12inch Fully Automatic Precision Dicing Saw Equipment Wafer Dedicated Cutting System yeSi/SiC & HBM (Al)

12inch Yakazara Otomatiki Precision Dicing Saw Equipment Wafer Yakatsaurwa Yekucheka Sitimu yeSi/SiC & HBM (Al) Inoratidzwa Mufananidzo

Tsanangudzo Pfupi

Iyo yakazara otomatiki chaiyo dicing michina ndeye yakakwirira-chaiyo yekucheka sisitimu yakanyatso kugadzirirwa semiconductor uye zvemagetsi zvikamu zveindasitiri. Inobatanidza tekinoroji yepamberi yekudzora tekinoroji uye nehungwaru hwekuona chinzvimbo kuti uwane micron-level kugadzirisa kurongeka. Mudziyo uyu wakakodzera kudhizaiza kwemhando dzakasiyana dzakaoma uye dzakaoma, kusanganisira:
1.Semiconductor Materials: Silicon (Si), silicon carbide (SiC), gallium arsenide (GaAs), lithium tantalate / lithium niobate (LT / LN) substrates, nezvimwewo.
2.Packaging Materials: Ceramic substrates, QFN/DFN mafuremu, BGA packaging substrates.
3.Functional Devices: Surface acoustic wave (SAW) filters, thermoelectric cooling modules, WLCSP wafers.

XKH inopa kuyedza kuenderana kwezvinhu uye maitiro ekugadzirisa masevhisi kuti ive nechokwadi chekuti michina inoenderana nezvinodiwa nevatengi zvekugadzira, ichipa mhinduro dzakakwana kune ese maR&D masampuli uye batch kugadzirisa.

Tumira email kwatiri

Features

Technical parameters

Parameter	Tsanangudzo
Saizi Yekushanda	Φ8", Φ12"
Spindle	Dual-axis 1.2/1.8/2.4/3.0, Max 60000 rpm
Blade Size	2" ~ 3"
Y1 / Y2 Axis	Imwe-nhanho kuwedzera: 0.0001 mm
	Kumira kwechokwadi: <0.002 mm
	Kucheka kureba: 310 mm
X Axis	Feed speed range: 0.1–600 mm/s
Z1 / Z2 Axis	Imwe-nhanho kuwedzera: 0.0001 mm
Z1 / Z2 Axis	Kumira kwechokwadi: ≤ 0.001 mm
θ Axis	Kumira kwechokwadi: ± 15"
Yekuchenesa Station	Kutenderera kumhanya: 100-3000 rpm
Yekuchenesa Station	Nzira yekuchenesa: Kusuka otomatiki & kupukuta-kuomesa
Kushanda Voltage	3-chikamu 380V 50Hz
Zviyero (W×D×H)	1550×1255×1880 mm
Kurema	2100 kg

Kushanda Nheyo

Iyo midziyo inowana yakakwirira-chaiyo yekucheka kuburikidza neanotevera matekinoroji:
1.High-Rigidity Spindle System: Kutenderera kunotenderera kusvika ku60,000 RPM, yakagadzirwa nedhaimondi blades kana laser yekucheka misoro kuti ienderane kune zvakasiyana-siyana zvinhu.

2.Multi-Axis Motion Control: X/Y/Z-axis positioning accuracy ye ± 1μm, yakabatanidzwa ne-high-precision grating scales kuti ive nechokwadi chekutsauka-kusina kucheka nzira.

3.Intelligent Visual Alignment: High-resolution CCD (5 megapixels) inoziva kamwe chete kucheka migwagwa uye inobhadhara kurwisana kwezvinhu kana kukanganisa.

4.Cooling & Dust Removal: Yakabatanidzwa yakachena mvura inotonhorera system uye vacuum suction guruva kubvisa kuderedza kupisa kwemafuta uye kusvibiswa kwechidimbu.

Kucheka Modes

1.Blade Dicing: Inokodzera zvechinyakare semiconductor zvinhu seSi neGaAs, ine kerf upamhi hwe50–100μm.

2.Stealth Laser Dicing: Inoshandiswa kune ultra-thin wafers (<100μm) kana zvinhu zvisina kusimba (eg, LT / LN), zvichiita kuti kupatsanurwa kusina kunetseka.

Typical Applications

Inowirirana Material	Munda Wekushandisa	Processing Zvinodiwa
Silicon (Si)	ICs, MEMS sensors	Yakakwirira-chaiyo kucheka, kucheka <10μm
Silicon Carbide (SiC)	Zvishandiso zvemagetsi (MOSFET/diode)	Yakaderera-kukuvadza kucheka, thermal manejimendi optimization
Gallium Arsenide (GaAs)	RF zvishandiso, optoelectronic chips	Micro-crack kudzivirira, utsanana kudzora
LT/LN Substrates	SAW mafirita, optical modulators	Kutemerwa-kusina kucheka, kuchengetedza piezoelectric zvivakwa
Ceramic Substrates	Power modules, LED kurongedza	High-hardness material processing, mupendero flatness
QFN/DFN Frames	Advanced kurongedza	Multi-chip panguva imwe chete yekucheka, kunyatsoita optimization
WLCSP Wafers	Wafer-level kurongedza	Dicing-isina kukuvara kweakanyanya-mutete wafers (50μm)

Zvakanakira

1. High-speed cassette frame scanning ine maaramu ekudzivirira kudhumhana, kukurumidza kutamisa nzvimbo, uye simba rakasimba rekugadzirisa kukanganisa.

2. Optimized dual-spindle cutting mode, kuvandudza kushanda kweinenge 80% kana ichienzaniswa ne-single-spindle systems.

3. Precision-imported ball screws, linear guides, uye Y-axis grating scale yakavharwa-loop control, inovimbisa kugadzikana kwenguva refu kwepamusoro-chaiyo machining.

4. Kunyatsogadzirisa kurodha / kusunungura, kuisa nzvimbo, kugadzirisa kutema, uye kuongorora kerf, zvakanyanya kuderedza mushandisi (OP) basa rekushanda.

5.Gantry-style spindle mounting structure, ine hushoma huviri-blade spacing ye 24mm, ichigonesa kuchinjika kuchinjika kune mbiri-spindle yekucheka maitiro.

Features

1.High-precision isiri-contact urefu chiyero.

2.Multi-wafer dual-blade kucheka pane imwe tray.

3.Automatic calibration, kerf inspection, uye blade breakage monitoring systems.

4.Inotsigira maitiro akasiyana-siyana ane selectable automatic alignment algorithms.

5.Fault self-correction performance uye real-time multi-position monitoring.

6.First-cut chekuongorora kukwanisa post-initial dicing.

7.Customizable factory automation modules uye mamwe mabasa ekusarudza.

Zvinhu zvinoenderana

Equipment Services

Isu tinopa rutsigiro rwakakwana kubva pakusarudzwa kwemidziyo kusvika pakugadzirisa kwenguva refu:

(1) Customized Development
Kurudzira blade/laser yekucheka mhinduro dzinobva pane zvinhu zvinhu (semuenzaniso, SiC kuoma, GaAs brittleness).

· Ipa yemahara sampuli yekuyedza kuona yekucheka mhando (inosanganisira chipping, kerf upamhi, kushata kwepamusoro, nezvimwewo).

(2) Kudzidzira Unyanzvi
· Basic Kudzidziswa: Equipment mashandiro, parameter gadziriso, yekugara kugadzirisa.
· Dzidzo dzepamberi: Maitiro optimization yezvinhu zvakaoma (semuenzaniso, kusagadzikana-yekucheka kucheka kweLT substrates).

(3) Mushure-Kutengesa Kutsigira
· 24/7 Mhinduro: Remote diagnostics kana pane-saiti rubatsiro.
· Spare Parts Supply: Yakachengetwa maspindles, blades, uye optical zvinhu zvekukurumidza kutsiva.
· Kuchengetedza Kuchengetedza: Kugaro gadzirisa kuchengetedza kurongeka uye kuwedzera hupenyu hwebasa.

Zvatiri Zvakanakira

✔ Chiitiko cheIndasitiri: Kubatira 300+ yepasirese semiconductor uye vagadziri vemagetsi.
✔ Cutting-Edge Tekinoroji: Yakanyatso mutsara madhairekitori uye servo masisitimu anovimbisa kugadzikana-inotungamira indasitiri.
✔ Global Service Network: Kuvharwa muAsia, Europe, uye North America kune rutsigiro rwenzvimbo.
Kuti uedze kana kubvunza, taura nesu!