4 inch SiC Wafers 6H Semi-Insulating SiC Substrates prime, research, uye dummy giredhi.

Tsanangudzo Pfupi

Semi-insulated silicon carbide substrate inoumbwa nekucheka, kukuya, kupukuta, kuchenesa uye imwe yekugadzira tekinoroji mushure mekukura kwesemi-insulated silicon carbide crystal.A layer kana multilayer crystal layer inokura pane substrate inosangana nemhando zvinodiwa se epitaxy, uye ipapo microwave RF mudziyo unogadzirwa nekubatanidza dhizaini yedunhu uye kurongedza.Inowanikwa se 2inch 3inch 4incgh 6inch 8 inch maindasitiri, tsvagiridzo uye bvunzo giredhi semi-insulated silicon carbide single crystal substrates.


Product Detail

Product Tags

Chigadzirwa Specification

Giredhi

Zero MPD Yekugadzira Giredhi (Z Giredhi)

Standard Production Giredhi(P Giredhi)

Dummy Giredhi (D giredhi)

 
Diameter 99.5 mm ~ 100.0 mm  
  4H-SI 500 μm±20 μm

500 μm±25 μm

 
Wafer Orientation  

 

Kunze kweaxis : 4.0° yakananga<1120 > ±0.5° ye4H-N, Paaxis : <0001>±0.5° ye4H-SI

 
  4H-SI

≤1cm-2

≤5 masendimita-2

≤15 cm-2

 
  4H-SI

≥1E9 Ω·cm

≥1E5 Ω·cm

 
Yekutanga Flat Oriental

{10-10} ±5.0°

 
Primary Flat Length 32.5 mm±2.0 mm  
Secondary Flat Length 18.0 mm±2.0 mm  
Secondary Flat Orientation

Silicon yakatarisana kumusoro: 90° CW.kubva Prime flat ± 5.0 °

 
Kusabatanidzwa kumucheto

3 mm

 
LTV/TTV/Bow/Warp ≤3 μm/≤5 μm/≤15 μm/≤30 μm ≤10 μm/≤15 μm/≤25 μm/≤40 μm  
 

Kukasharara

C chiso

    ChiPolish Ra≤1 nm

Si face

CMP Ra≤0.2 nm    

Ra≤0.5 nm

Edge Cracks By High Intensity Chiedza

Hapana

Cumulative kureba ≤ 10 mm, imwe chete

kureba≤2 mm

 
Hex Plates By High Intensity Chiedza Cumulative area ≤0.05% Cumulative area ≤0.1%  
Polytype Nzvimbo NeKusimba Kwakanyanya Chiedza

Hapana

Cumulative area≤3%  
Visual Carbon Inclusions Cumulative area ≤0.05% Yakawedzerwa nzvimbo ≤3%  
Silicon Surface Scratches By High Intensity Chiedza  

Hapana

Cumulative kureba≤1*wafer dhayamita  
Edge Chips High By Intensity Chiedza Hapana anotenderwa ≥0.2 mm hupamhi nekudzika 5 inotenderwa, ≤1 mm imwe neimwe  
Silicon Surface Kusvibiswa NeKunyanya Kusimba

Hapana

 
Packaging

Multi-wafer Cassette Kana Single Wafer Container

 

Detailed Diagram

Detailed Diagram (1)
Mufananidzo wakadzama (2)

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