MaWafers eSiC ane 4 inch 6H Semi-Insulating SiC Substrates anobatsira zvikuru, kutsvagisa, uye giredhi remhando yepamusoro

Tsananguro pfupi:

Substrate yesilicon carbide ine semi-insulated inoumbwa nekucheka, kukuya, kupolisha, kuchenesa uye imwe tekinoroji yekugadzirisa mushure mekukura kwesilicon carbide crystal ine semi-insulated. Layer kana multilayer crystal layer inorimwa pasubstrate inosangana nezvinodiwa zvemhando yepamusoro se epitaxy, uye ipapo mudziyo we microwave RF unogadzirwa nekubatanidza dhizaini yedunhu uye kurongedza. Inowanikwa se2inch 3inch 4incgh 6inch 8inch maindasitiri, tsvakurudzo uye bvunzo grade semi-insulated silicon carbide single crystal substrates.


Zvinhu zvirimo

Tsanangudzo yeChigadzirwa

Giredhi

Giredhi reKugadzirwa kweMPD Zero (Giredhi Z)

Giredhi Rekugadzirwa Kwakajairika (Giredhi reP)

Giredhi reDummy (Giredhi D)

 
Dhayamita 99.5 mm~100.0 mm  
  4H-SI 500 μm±20 μm

500 μm±25 μm

 
Kudzidziswa kweWafer  

 

Kudzima axis: 4.0° kuenda ku< 1120 > ± 0.5° ye4H-N, Kudzima axis: <0001>± 0.5° ye4H-SI

 
  4H-SI

≤1cm-2

≤5 cm-2

≤15 cm-2

 
  4H-SI

≥1E9 Ω·cm

≥1E5 Ω·cm

 
Kutungamira Kwakatsetseka Kwepakutanga

{10-10} ±5.0°

 
Hurefu Hwepamusoro-soro 32.5 mm±2.0 mm  
Kureba Kwechipiri Kwakatsetseka 18.0 mm±2.0 mm  
Kudzidziswa kwechipiri kwakadzikama

Silicon yakatarisana mudenga: 90° CW. kubva kuPrime flat ±5.0°

 
Kusabatanidzwa kweMupendero

3 mm

 
LTV/TTV/Uta /Warp ≤3 μm/≤5 μm/≤15 μm/≤30 μm ≤10 μm/≤15 μm/≤25 μm/≤40 μm  
 

Kuomarara

Chiso cheC

    ChiPolish Ra≤1 nm

Chiso chaSi

CMP Ra≤0.2 nm    

Ra≤0.5 nm

Mipata yemucheto nechiedza chakasimba

Hapana

Kureba kwakawedzerwa ≤ 10 mm, imwe chete

kureba ≤2 mm

 
Hex Plates Nechiedza Chakanyanya Kusimba Nzvimbo yakaunganidzwa ≤0.05% Nzvimbo yakaunganidzwa ≤0.1%  
Nzvimbo dzePolytype Nechiedza Chakanyanya Kusimba

Hapana

Nzvimbo yakaunganidzwa ≤3%  
Kubatanidzwa kweKabhoni Inoonekwa Nzvimbo yakaunganidzwa ≤0.05% Nzvimbo yakaunganidzwa ≤3%  
Kukwenya Kwepamusoro peSilicon Nechiedza Chakanyanya Kusimba  

Hapana

Kureba kwakawedzerwa ≤1 * dhayamita yewafer  
Edge Chips High By Intensity Light Hapana chinobvumidzwa ≥0.2 mm upamhi uye kudzika 5 inobvumirwa, ≤1 mm imwe neimwe  
Kusvibiswa kweSilicon pamusoro Nesimba Rakanyanya

Hapana

 
Kurongedza

Kaseti yeWafer yakawanda kana mudziyo weWafer imwe chete

 

Dhayagiramu Yakadzama

Dhayagiramu Yakadzama (1)
Dhayagiramu Yakadzama (2)

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