4 inch SiC Wafers 6H Semi-Insulating SiC Substrates prime, research, uye dummy giredhi.

Tsanangudzo Pfupi:

Semi-insulated silicon carbide substrate inoumbwa nekucheka, kukuya, kupukuta, kuchenesa uye imwe yekugadzira tekinoroji mushure mekukura kwesemi-insulated silicon carbide crystal. A layer kana multilayer crystal layer inokura pane substrate inosangana nemhando zvinodiwa se epitaxy, uye ipapo microwave RF mudziyo unogadzirwa nekubatanidza dhizaini yedunhu uye kurongedza. Inowanikwa se 2inch 3inch 4incgh 6inch 8 inch maindasitiri, tsvagiridzo uye bvunzo giredhi semi-insulated silicon carbide single crystal substrates.


Product Detail

Product Tags

Chigadzirwa Specification

Giredhi

Zero MPD Yekugadzira Giredhi (Z Giredhi)

Standard Production Giredhi(P Giredhi)

Dummy Giredhi (D giredhi)

 
Diameter 99.5 mm ~ 100.0 mm  
  4H-SI 500 μm±20 μm

500 μm±25 μm

 
Wafer Orientation  

 

Kunze kweaxis : 4.0° yakananga<1120 > ±0.5° ye4H-N, Paaxis : <0001>±0.5° ye4H-SI

 
  4H-SI

≤1cm-2

≤5 masendimita-2

≤15 masendimita-2

 
  4H-SI

≥1E9 Ω·cm

≥1E5 Ω·cm

 
Yekutanga Flat Oriental

{10-10} ±5.0°

 
Primary Flat Length 32.5 mm±2.0 mm  
Secondary Flat Length 18.0 mm±2.0 mm  
Secondary Flat Orientation

Silicon yakatarisana kumusoro: 90° CW. kubva Prime flat ± 5.0 °

 
Kusabatanidzwa kumucheto

3 mm

 
LTV/TTV/Bow/Warp ≤3 μm/≤5 μm/≤15 μm/≤30 μm ≤10 μm/≤15 μm/≤25 μm/≤40 μm  
 

Kukasharara

C chiso

    ChiPolish Ra≤1 nm

Si face

CMP Ra≤0.2 nm    

Ra≤0.5 nm

Edge Cracks By High Intensity Chiedza

Hapana

Cumulative kureba ≤ 10 mm, imwe chete

kureba≤2 mm

 
Hex Plates By High Intensity Chiedza Cumulative area ≤0.05% Cumulative area ≤0.1%  
Polytype Nzvimbo NeKusimba Kwakanyanya Chiedza

Hapana

Cumulative area≤3%  
Visual Carbon Inclusions Cumulative area ≤0.05% Yakawedzerwa nzvimbo ≤3%  
Silicon Surface Scratches By High Intensity Chiedza  

Hapana

Cumulative kureba≤1*wafer dhayamita  
Edge Chips High By Intensity Chiedza Hapana anotenderwa ≥0.2 mm hupamhi nekudzika 5 inotenderwa, ≤1 mm imwe neimwe  
Silicon Surface Kusvibiswa NeKunyanya Kusimba

Hapana

 
Packaging

Multi-wafer Cassette Kana Single Wafer Container

 

Detailed Diagram

Detailed Diagram (1)
Mufananidzo wakadzama (2)

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