Midziyo Inosimudza-Kubvisa Laser Semiconductor Inoshandura Ingot Thinning

Midziyo Inosimudza-Kubvisa Laser Semiconductor Shandura Ingot Thinning Mufananidzo Wakafanotaurwa

Tsananguro pfupi:

Semiconductor Laser Lift-Off Equipment imhando yepamusoro yezvigadzirwa zveindasitiri yakagadzirirwa kuchenesesa ma ingots e semiconductor nenzira chaiyo uye isingabatanidzi kuburikidza nehunyanzvi hwe laser-induced lift-off. Iyi sisitimu yepamusoro inoita basa guru mumaitiro emazuva ano e semiconductor wafer, kunyanya mukugadzirwa kwema wafers akatetepa kwazvo emagetsi emagetsi, ma LED, uye RF zvishandiso. Nekugonesa kupatsanurwa kwema layers matete kubva kuma ingots akawanda kana substrates dzedonor, Semiconductor Laser Lift-Off Equipment inoshandura kuchenesesa kwe ingot nekubvisa matanho ekucheka, kukuya, uye etching emakemikari.

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Kusuma Chigadzirwa cheSemiconductor Laser Lift-Off Equipment

Kucheneswa kwezvishandiso zve semiconductor, zvakaita se gallium nitride (GaN), silicon carbide (SiC), uye safira, kunowanzo shandiswa nesimba, kunopambadza, uye kunowanzo pwanyika kana kukuvara pamusoro. Kusiyana neizvi, Semiconductor Laser Lift-Off Equipment inopa imwe nzira isingaparadze uye yakanyatsojeka inoderedza kurasikirwa nezvinhu uye kushushikana pamusoro uku ichiwedzera kugadzirwa. Inotsigira mhando dzakasiyana dzezvinhu zve crystalline uye compound uye inogona kubatanidzwa zvakanaka mumitsetse yekugadzira semiconductor yepamberi kana yepakati.

Nema "configurable laser wavelengths", adaptive focus systems, uye "vacuum-compatible wafer chucks", mudziyo uyu wakanyatsokodzera kucheka ingot, kugadzira lamella, uye ultra-thin film detachment ye vertical device structures kana heteroepitaxial layer transfer.

Paramita yeSemiconductor Laser Lift-Off Equipment

Kureba kwewave	IR/SHG/THG/FHG
Upamhi hwePulse	Nanosecond, Picosecond, Femtosecond
Sisitimu yeOptical	Sisitimu yemaziso yakagadziriswa kana sisitimu yeGalvano-optical
Danho reXY	500 mm × 500 mm
Kugadzirisa Range	160 mm
Kumhanya Kwekufamba	Kupfuura 1,000 mm/sekondi
Kudzokorora	±1 μm kana pasi
Kururama Kwechinzvimbo Chacho:	±5 μm kana pasi
Saizi yeWafer	2–6 inches kana kuti yakagadzirirwa
Kudzora	Windows 10, 11 uye PLC
Simba reKupa Magetsi	AC 200 V ±20 V, Chikamu chimwe chete, 50/60 kHz
Zviyero zvekunze	2400 mm (W) × 1700 mm (D) × 2000 mm (H)
Huremu	chiuru chimwe chekirogiramu

Nheyo yekushanda yeSemiconductor Laser Lift-Off Equipment

Mashandiro makuru eSemiconductor Laser Lift-Off Equipment anoenderana nekuparadzana kwechiedza chezuva kana kubviswa kwechiedza panzvimbo iri pakati pedonor ingot ne epitaxial kana target layer. Laser yeUV ine simba guru (kazhinji KrF pa248 nm kana solid-state UV lasers inenge 355 nm) inotariswa kuburikidza nezvinhu zvinopa chiedza kana kuti zvinopa chiedza zvishoma, uko simba rinonyudzwa zvakasarudzwa pakadzika kwakafanotaurwa.

Kunyudzwa kwesimba iri munzvimbo imwe chete kunoita kuti gasi rive nemhepo ine simba rakawanda kana kuti thermal expansion layer panzvimbo inopindirana, izvo zvinotanga kucheneswa kwewafer yepamusoro kana device layer kubva pasi peingot. Maitiro acho anogadziriswa zvakanaka nekugadzirisa ma parameter akadai se pulse width, laser fluence, scanning speed, uye z-axis focal depth. Mugumisiro wacho chidimbu chakatetepa zvikuru—kazhinji chiri pakati pe10 ne50 µm—chakaparadzaniswa zvakanaka neingot huru isina kukweshana kwemuchina.

Nzira iyi yekusimudza nelaser yekubvisa ingot inodzivirira kurasikirwa nekerf uye kukuvara kwepamusoro kunokonzerwa nekucheka waya yedhaimani kana kukwesha kwemuchina. Inochengetedzawo kristalo yakasimba uye inoderedza zvinodiwa zvekupukuta, zvichiita kuti Semiconductor Laser Lift-Off Equipment ive chishandiso chinoshandura mutambo wekugadzira wafer yechizvarwa chinotevera.

Midziyo Inosimudza Laser Semiconductor Shandura Ingot Thinning 2

Mashandisirwo eSemiconductor Laser Lift-Off Equipment

Midziyo yeSemiconductor Laser Lift-Off inoshandisa zvakanyanya mukuderedza masimbi esimbi mumhando dzakasiyana dzezvinhu zvepamusoro uye zvekushandisa, zvinosanganisira:

Kuonda kweGaN neGaAs Ingot kweMagetsi Emagetsi
Inogonesa kugadzirwa kwewafer yakatetepa kuti ma transistors nema diode ashande zvakanaka uye asingapindi simba zvakanyanya.

Kugadziriswazve kweSiC Substrate uye Kuparadzaniswa kweLamella
Inobvumira kusimudzwa kwewafer-scale kubva kuSiC substrates yakawanda kuti igadzire midziyo yakamira uye kuti ishandiswezve.

Kucheka kweWafer ye LED
Inobatsira kusimudza maGaN layers kubva kuma ingts akakora esapphire kuti igadzire ma LED substrates akatetepa zvikuru.

Kugadzira RF neMicrowave Device
Inotsigira magadzirirwo e-transistor ane maelectron-mobility transistor (HEMT) akatetepa zvikuru anodiwa mu5G uye radar systems.

Kutamisirwa kweEpitaxial Layer
Inobvisa ma epitaxial layers nemazvo kubva kuma crystalline ingots kuti ishandiswezve kana kubatanidzwa mu heterostructures.

Masero ezuva eFirimu rakatetepa uye Photovoltaics
Inoshandiswa kupatsanura zvikamu zvitete zvinonyungudutsa zvemasero ezuva anochinjika kana anoshanda zvakanyanya.

Mune imwe neimwe yenzvimbo idzi, Semiconductor Laser Lift-Off Equipment inopa kutonga kusingaenzaniswi pamusoro pekufanana kweukobvu, mhando yechinhu, uye kuvimbika kwechikamu.

Mabhenefiti eLaser-Based Ingot Thinning

Kurasikirwa Nezvinhu Zvisina Kuoma
Zvichienzaniswa nenzira dzechinyakare dzekucheka wafer, maitiro elaser anoita kuti zvinhu zvishandiswe ne100%.

Kushushikana Kushoma uye Kukanganisa
Kubvisa kubatwa kwechinhu kunobvisa kudedera kwemuchina, kuderedza kuumbwa kwewafer bow uye microcrack.

Kuchengetedza Hunhu Hwepamusoro
Kazhinji hapana kudiwa kwekukwesha kana kupukuta mushure mekutetepa, sezvo laser lift-off ichichengetedza kunaka kwepamusoro.

Kubudirira Kwakanyanya uye Kugadzirira Kuzvigadzira
Inokwanisa kugadzirisa mazana ezvishandiso panguva imwe neimwe nekurodha/kuburitsa zvinhu otomatiki.

Inochinjika kuZvinhu Zvakawanda
Inoenderana neGaN, SiC, safira, GaAs, uye zvinhu zvitsva zveIII-V.

Zvakachengeteka Zvakatipoteredza
Inoderedza kushandiswa kwemishonga inobvisa huturu uye makemikari akasimba anowanzoitwa mukuita kuti huturu hucheke.

Shandisazve Substrate
Zvishandiso zvevanopa zvinogona kushandiswazve kana zvangoitwa kakawanda, zvichideredza zvakanyanya mitengo yezvinhu.

Mibvunzo Inowanzo bvunzwa (FAQ) yeSemiconductor Laser Lift-Off Equipment

Mubvunzo 1: Uhu hwakakura sei hunogona kuwanikwa neSemiconductor Laser Lift-Off Equipment pazvimedu zvewafer?
A1:Ukobvu hwechidimbu hunowanzova pakati pe10 µm kusvika 100 µm zvichienderana nechinhu chacho uye magadzirirwo acho.

Mubvunzo wechipiri: Muchina uyu ungashandiswa here kutetepa ma ingot akagadzirwa nezvinhu zvisingaonekwe seSiC?
A2:Ehe. Nekugadzirisa wavelength yelaser uye kugadzirisa interface engineering (semuenzaniso, sacrificed interlayers), kunyangwe zvinhu zvisingaonekwe zvakanaka zvinogona kugadziriswa.

Mubvunzo wechitatu: Ko substrate yemupi weropa inorongedzwa sei isati yabviswa nelaser?
A3:Sisitimu iyi inoshandisa mamodule e-sub-micron vision-based alignment ane mhinduro kubva ku fiducial marks uye surface reflectivity scans.

Mubvunzo wechina: Ndeipi nguva inotarisirwa yekutenderera kwekushanda kamwe chete kwekusimudza laser?
A4:Zvichienderana nehukuru hwewafer uye ukobvu, maitiro akajairika anotora maminetsi maviri kusvika gumi.

Mubvunzo wechishanu: Maitiro acho anoda nzvimbo yakachena here?
A5:Kunyange zvazvo zvisiri zvekumanikidzwa, kubatanidza nzvimbo dzekuchenesa kunokurudzirwa kuchengetedza kuchena kwepasi pevhu uye kubereka kwemidziyo panguva yekushanda nemazvo.

Nezvedu

XKH inonyanya kugadzira, kugadzira, uye kutengesa magirazi egirazi egirazi uye zvinhu zvitsva zvekristaro. Zvigadzirwa zvedu zvinopa zvigadzirwa zvemagetsi, zvemagetsi zvevatengi, uye zvemauto. Tinopa zvikamu zveSapphire optical, malenzi efoni, Ceramics, LT, Silicon Carbide SIC, Quartz, uye mawafer egirazi esemiconductor. Tine hunyanzvi uye michina yemazuva ano, tinobudirira mukugadzirisa zvigadzirwa zvisiri zvemazuva ano, tichivavarira kuva bhizinesi rinotungamira rezvigadzirwa zvemagetsi.