Midziyo yeSemiconductor
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Muchina weCNC Ingot Rounding (weSapphire, SiC, nezvimwewo)
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Muchina weLaser Rainbow weKuisa Chiratidzo cheSimbi Unokurumidza Kushandiswa
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Muchina wekucheka wegirazi reLaser wekugadzirisa girazi rakatsetseka
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Sisitimu yeLaser yeMicrojet Yakakodzera Yezvinhu Zvakaoma & Zvakapfava
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Muchina weKuchera weLaser Wakanyatsogadzirwa neLaser
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Muchina weKuchera weGirazi neLaser
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12inch Fully Automatic Precision Dicing Saw Equipment Wafer Dedicated Cutting System yeSi/SiC & HBM (Al)
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Zvishandiso zveKucheka Ring zveWafer zveOtomatiki Zvizere Saizi Yekushanda 8inch/12inch Kucheka Ring yeWafer
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Midziyo Yekumaka Inorwisa Kunyepedzera yeLaser Wafer Marking
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Sisitimu Yekucherekedza Zviratidzo Zvenhema yeLaser yeSapphire Substrates, Mawachi, Zvishongo Zvemhando Yepamusoro
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Chitofu cheSiC crystal growth SiC Ingot growing 4inch 6inch 8inch PTV Lely TSSG LPE growth method
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Muchina mudiki wekupunching laser wetafura 1000W-6000W 0.1MM unogona kushandiswa kugadzira zvinhu zvegirazi zvesimbi zvesimbi