Fully Automatic Wafer Ring-Kucheka Equipment Inoshanda Saizi 8inch/12inch Wafer Ring Kucheka

Tsanangudzo Pfupi

XKH yakazvimiririra yakagadzira yakazara otomatiki wafer edge yekucheka sisitimu, inomiririra mhinduro yepamberi yakagadzirirwa kumberi-kumagumo semiconductor yekugadzira maitiro. Mudziyo uyu unosanganisira hunyanzvi hwekuita multi-axis synchronous control tekinoroji uye inoratidzira yakakwirira-yakaomarara spindle system (yakanyanya kutenderera yekumhanya: 60,000 RPM), ichiendesa chaiyo kumucheto kuchekerera nekucheka chaiko kusvika ± 5μm. Iyo sisitimu inoratidza kuenderana kwakanyanya neakasiyana semiconductor substrates, kusanganisira asi isina kuganhurirwa ku:
1.Silicon wafers (Si): Inokodzera kumucheto kugadzirisa kwe8-12 inch wafers;
2.Compound semiconductors: Yechitatu-chizvarwa semiconductor zvinhu zvakadai seGaAs uye SiC;
3.Special substrates: Piezoelectric zvinhu wafers kusanganisira LT/LN;

Iyo modular dhizaini inotsigira nekukurumidza kutsiva kwezvinhu zvakawanda zvinodyiwa zvinosanganisira madhaimondi blades uye laser yekucheka misoro, nekuenderana kunodarika indasitiri zviyero. Kune zvehunyanzvi maitiro zvinodiwa, isu tinopa yakazara mhinduro dzinosanganisira:
· Dedicated yekucheka consumables kupa
· Tsika yekugadzirisa masevhisi
· Maitiro parameter optimization mhinduro

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Features

Technical parameters

Parameter	Unit	Tsanangudzo
Maximum Workpiece Saizi	mm	ø12"
Spindle	Configuration	Single Spindle
	Speed	3,000-60,000 rpm
	Output Power	1.8 kW (2.4 sarudzo) pa30,000 min⁻¹
	Max Blade Dia.	Ø58 mm
X-Axis	Kucheka Range	310 mm
Y-Axis	Kucheka Range	310 mm
	Step Kuwedzera	0.0001 mm
	Positioning Kururama	≤0.003 mm/310 mm, ≤0.002 mm/5 mm (chikanganiso chimwe chete)
Z-Axis	Movement Resolution	0.00005 mm
Z-Axis	Kudzokorora	0.001 mm
θ-Axis	Max Rotation	380 deg
Spindle Type		Single spindle, yakashongedzerwa neblade yakaoma yekucheka mhete
Mhete-Kucheka Kwakarurama	μm	±50
Wafer Positioning Kururama	μm	±50
Single-Wafer Kubudirira	min/wafer	8
Multi-Wafer Kubudirira		Kusvikira ku4 wafers akagadziriswa panguva imwe chete
Equipment Weight	kg	≈3,200
Equipment Dimensions (W×D×H)	mm	2,730 × 1,550 × 2,070

Operating Principle

Iyo sisitimu inowana yakasarudzika yekucheka kuita kuburikidza neaya epakati matekinoroji:

1.Intelligent Motion Control System:
· Yakakwira-chaiyo mutsara mota dhiraivha (dzokorora kurongeka kwechokwadi: ± 0.5μm)
· Six-axis synchronous control inotsigira yakaoma trajectory kuronga
* Chaiyo-nguva vibration kudzvinyirira algorithms inove nechokwadi chekucheka kugadzikana

2.Advanced Detection System:
Yakabatanidzwa 3D laser kureba sensor (kurongeka: 0.1μm)
+ Yakakwirira-resolution CCD yekuona chinzvimbo (5 megapixels)
· Online mhando yekuongorora module

3.Fully Automated Maitiro:
* Kurodha / kurodha otomatiki (FOUP yakajairwa interface inoenderana)
· Hungwaru kurongedza sisitimu
· Yakavharwa-loop yekuchenesa unit (kuchena: Kirasi 10)

Typical Applications

Ichi chishandiso chinopa kukosha kwakakosha pane ese semiconductor yekugadzira maapplication:

Munda Wekushandisa	Process Materials	Technical Advantages
IC Manufacturing	8/12" Silicon Wafers	Inowedzera lithography kurongeka
Power Devices	SiC/GaN Wafers	Inodzivirira kukanganisa kumucheto
MEMS Sensors	SOI Wafers	Inovimbisa kuvimbika kwechigadzirwa
RF Zvishandiso	GaAs Wafers	Inovandudza-high-frequency performance
Advanced Packaging	Reconstituted Wafers	Inowedzera goho rekurongedza

Features

1.Four-station configuration nokuda kwepamusoro kugadzirisa kushanda;
2.Stable TAIKO mhete debonding uye kubvisa;
3.Kuenderana kwepamusoro nemidziyo yakakosha;
4.Multi-axis synchronous trimming tekinoroji inova nechokwadi chekucheka kumucheto;
5.Fully automated process flow inoderedza zvakanyanya mari yebasa;
6.Customized worktable dhizaini inogonesa kugadzikana kugadzirisa kwezvimiro zvakakosha;

Mabasa

1.Ring-kudonha yekuona system;
2.Automatic worktable kuchenesa;
3.Intelligent UV debonding system;
4.Operation log kurekodha;
5.Factory otomatiki module kubatanidzwa;

Kuzvipira Kwebasa

XKH inopa yakazara, yakazara hupenyu hwekutsigira masevhisi akagadzirirwa kuwedzera mashandiro emidziyo uye kushanda zvakanaka mukati merwendo rwako rwekugadzira.
1. Customization Services
· Tailored Equipment Configuration: Chikwata chedu cheinjiniya chinoshanda pamwe nevatengi kukwirisa masisitimu ma paramita (kucheka kumhanya, blade kusarudzwa, nezvimwewo) zvichibva pane chaiyo zvinhu zvivakwa (Si / SiC / GaAs) uye maitiro ezvinodiwa.
· Tsigiro Yekuvandudza Maitiro: Isu tinopa sampuli yekugadzirisa ine yakadzama yekuongorora mishumo inosanganisira mupendero roughness kuyerwa uye kukanganisa mepu.
· Consumables Co-Development: Zvezvinhu zvitsva (semuenzaniso, Ga₂O₃), isu tinodyidzana nevanotungamira vanogadzirwa vagadziri kugadzira application-chaiyo blades/laser optics.

2. Professional Technical Support
· Yakatsaurirwa Pa-Site Tsigiro: Govera mainjiniya ane certification yezvikamu zvakakosha zvekukwira-up (kazhinji mavhiki maviri-4), achivhara:
Equipment calibration & process-tuning
Operator kugona kudzidziswa
ISO Kirasi 5 yekuchenesa imba yekubatanidza kutungamira
· Predictive Maintenance: Hutano hwekota hunotarisa nekuongorora vibration uye servo mota diagnostics kudzivirira isina kurongeka yekudzika.
· Kutarisisa Kure: Chaiyo-nguva mashandiro emidziyo yekutevera kuburikidza neyedu IoT chikuva (JCFront Connect®) ine otomatiki anomaly chenjedzo.

3. Value-added Services
* Maitiro Eruzivo Base: Svika 300+ yakasimbiswa yekucheka mabikirwo emhando dzakasiyana siyana (yakagadziridzwa kota).
· Tekinoroji Roadmap Alignment: Remangwana-uchapupu hwekudyara kwako nehardware/software kusimudzira nzira (semuenzaniso, AI-yakavakirwa chirema chekuona module).
· Emergency Response: Yakavimbiswa 4-awa kure nekuongororwa uye 48-awa pane-saiti kupindira (kuvharwa kwepasi rose).

4. Infrastructure yebasa
· Performance Guarantee: Contractual kuzvipira kune ≥98% zvishandiso uptime neSLA-yakatsigirwa mhinduro nguva.

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