Wafer Oientation System yeCrystal Oientation Measurement

Wafer Orientation System yeCrystal Oientation Measurement Featured Image

Tsanangudzo Pfupi

A wafer orientation chiridzwa chishandiso chepamusoro-chaizvo chinoshandisa X-ray diffraction misimboti kukwirisa semiconductor kugadzira uye zvinhu zvesainzi maitiro nekuona crystallographic orientation. Zvikamu zvayo zvepakati zvinosanganisira X-ray source (semuenzaniso, Cu-Kα, 0.154 nm wavelength), goniometer yakarurama (angular resolution ≤0.001 °), uye detectors (CCD kana scintillation counters). Nekutenderera sampuli uye kuongorora diffraction mapatani, inoverengera crystallographic indices (eg, 100, 111) uye nzvimbo yelatisi ine ± 30 arcsecond chaiyo. Iyo sisitimu inotsigira otomatiki mashandiro, vacuum fixation, uye akawanda-axis kutenderera, inoenderana ne2-8-inch wafers yekukurumidza kuyerwa kwewafer edges, referensi ndege, uye epitaxial layer alignment. Zvishandiso zvakakosha zvinosanganisira kucheka-yakatarisana nesilicon carbide, sapire wafers, uye turbine blade yakakwirira-tembiricha performance performance, inosimudzira zvakananga chip magetsi zvivakwa uye goho.

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Features

Equipment Introduction

Wafer orientation midziyo ndeyechokwadi midziyo yakavakirwa paX-ray diffraction (XRD) misimboti, inonyanya kushandiswa mukugadzira semiconductor, optical materials, ceramics, uye mamwe maindasitiri ezvinyorwa zvecrystalline.

Izvi zviridzwa zvinotarisa crystal lattice kutaridzika uye inotungamira chaiyo yekucheka kana kupukuta maitiro. Zvinhu zvakakosha zvinosanganisira:

High-precision zviyero:Inokwanisa kugadzirisa crystallographic ndege dzine angular resolution pasi kusvika 0.001 ° .
Sample yakakura kuenderana:Inotsigira mawafer anosvika 450 mm muhupamhi uye huremu hwe30 kg, akakodzera zvinhu zvakaita sesilicon carbide (SiC), safiro, uye silicon (Si).
Modular dhizaini:Anowedzera mashandiro anosanganisira kuzunguza curve kuongororwa, 3D pamusoro chirema mepu, uye stacking zvishandiso zveakawanda-sample processing.

Key Technical Parameters

Parameter Category	Yakajairika Values/Configuration
X-ray Source	Cu-Kα (0.4 × 1 mm yakatarisa nzvimbo), 30 kV inomhanyisa voltage, 0–5 mA inogadziriswa chubhu ikozvino
Angular Range	θ: -10° kusvika +50°; 2θ: -10° kusvika +100°
Kururama	Tilt angle resolution: 0.001 °, kuona kuremara kwepamusoro: ± 30 arcseconds (inozunguza curve)
Scanning Speed	Omega scan inopedza yakazara lattice kutaridzika mumasekondi mashanu; Theta scan inotora ~1 miniti
Sample Stage	V-groove, pneumatic suction, multi-angle kutenderera, inoenderana ne2-8-inch wafers
Expandable Functions	Rocking curve analysis, 3D mepu, stacking mudziyo, Optical defect yekuona (zvikwambo, GBs)

Working Principle

1. X-ray Diffraction Foundation

X-rays inodyidzana neatomic nuclei uye maerekitironi mucrystal lattice, ichigadzira diffraction mapatani. Mutemo waBragg ( nλ = 2d sinθ ) unotonga hukama huri pakati pemakona ekusiyanisa ( θ) ne lattice spacing (d).
Detector anotora aya mapatani, ayo anoongororwa kuvakazve chimiro checrystallographic.

2. Omega Scanning Technology

Iyo kristaro inotenderera ichitenderera ichitenderedza axis yakagadziriswa nepo X-rays ichivhenekera.
Madhigirii anounganidza masiginecha ediffraction mundege dzakawanda dzecrystallographic, zvichigonesa kugadzwa kwakazara kwelattice mumasekondi mashanu.

3. Rocking Curve Analysis

Fixed crystal angle ine akasiyana eX-ray incidence angles kuyera peak wide (FWHM), kuongorora hurema hwelatisi uye kunetsa.

4. Automated Control

PLC uye touchscreen interfaces inogonesa preset yekucheka angles, chaiyo-nguva mhinduro, uye kubatanidzwa nemichina yekucheka yekuvhara-loop control.

Advantages uye Features

1. Kurongeka uye Kubudirira

Angular accuracy ± 0.001 °, defect yekuona kugadziriswa <30 arcseconds.
Omega scan speed i200 × nekukurumidza pane yechinyakare Theta scans.

2. Modularity uye Scalability

Inokwidziridzwa kune yakasarudzika maapplication (semuenzaniso, SiC wafers, turbine blades).
Inosanganisirwa neMES masisitimu eiyo chaiyo-nguva kugadzirwa kwekutarisa.

3. Kugarisana uye Kugadzikana

Inogashira sampuli dzisina kuumbwa (semuenzaniso, dzakatsemuka dzesafire ingots).
Air-cooled design inoderedza zvinodiwa zvekugadzirisa.

4. Intelligent Operation

Kamwe-tinya calibration uye akawanda-basa kugadzirisa.
Auto-calibration ine referensi makristasi kuderedza kukanganisa kwevanhu.

Applications

1. Semiconductor Manufacturing

Wafer dicing orientation: Inosarudza Si, SiC, GaN wafer yekumisikidza yekugonesa kucheka kunyatsoita.
Defect mepu: Inozivisa madhiri epamusoro kana kutsemuka kuti uvandudze goho rechip.

2. Optical Materials

Nonlinear makristasi (semuenzaniso, LBO, BBO) yemidziyo yelaser.
Sapphire wafer reference surface marking ye LED substrates.

3. Ceramics uye Composites

Inoongorora kutaridzika kwezviyo muSi3N4 uye ZrO2 kune yakakwirira-tembiricha maapplication.

4. Research uye Quality Control

Makunivhesiti / maLab ekuvandudza zvinhu (semuenzaniso, alloys akakwira-entropy).
Industrial QC kuti ive nechokwadi chekuenderana.

XKH's Services

XKH inopa yakazara lifecycle tekinoroji tsigiro yewafer yekumisikidza zviridzwa, zvinosanganisira kuisirwa, process parameter optimization, rocking curve ongororo, uye 3D pamusoro chirema mepu. Tailored mhinduro (semuenzaniso, ingot stacking tekinoroji) inopihwa kuti iwedzere semiconductor uye yekuona zvinhu kugadzirwa zvakanaka neinopfuura 30%. Chikwata chakazvitsaurira chinoitisa pa-saiti kudzidziswa, nepo 24/7 tsigiro iri kure uye nekukurumidza spare chikamu kutsiva inovimbisa kuvimbika kwemidziyo.

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