TVG maitiro pane quartz sapphire BF33 wafer Girazi wafer kubaya

Zvakanakira zveTGV(Kuburikidza neGlass Via) zvinonyanya kuratidzwa mu:

1) Yakanakisa yakakwirira frequency maitiro emagetsi. Girazi zvinhu insulator zvinhu, iyo dielectric inogara ingori 1/3 yesilicon zvinhu, iyo kurasikirwa chinhu ndeye 2-3 maodha ehukuru hwakaderera pane iyo silicon zvinhu, zvichiita kuti substrate kurasikirwa uye parasitic mhedzisiro inoderedzwa zvakanyanya kuve nechokwadi. kutendeseka kwechiratidzo chinotumirwa;

(2) Saizi yakakura uye yekupedzisira-yakaonda girazi substrate iri nyore kuwana. Tinogona kupa Safire, Quartz, Corning, uye SCHOTT uye vamwe vagadziri vegirazi vanogona kupa yakakura-yakakura saizi (> 2m × 2m) uye yekupedzisira-yakatetepa (<50µm) yegirazi regirazi uye Ultra-yakatetepa inochinjika girazi zvinhu.

3) Mutengo wakaderera. Batsirwa kubva kune nyore kuwana kune yakakura-saizi yekupedzisira-yakaonda yepaneru girazi, uye haidi deposition ye insulating layer, mutengo wekugadzira wegirazi adapta ndiro inongoita 1/8 yesilicon-based adapter plate;

4) Nzira iri nyore. Hapana chikonzero chekuisa insulating layer pane substrate pamusoro uye mukati memadziro eTGV (Kuburikidza neGlass Via), uye hapana kutetepa kunodiwa mu-ultra-thin adapter plate;

(5) Kugadzikana kwemagetsi kwakasimba. Kunyangwe ukobvu hweadapter plate iri pasi pe100µm, warpage ichiri diki;

6) Yakasiyana-siyana yekushandisa. Mukuwedzera kune tarisiro yakanaka yekushanda mumunda we-high-frequency, sechinhu chakajeka, chinogonawo kushandiswa mumunda we optoelectronic system integration, airtightness uye corrosion resistance resistance inoita kuti girasi substrate mumunda weMEMS encapsulation ine simba guru.

Parizvino, kambani yedu inopa TGV (Kuburikidza neGlass Via) girazi kuburikidza negomba tekinoroji, inogona kuronga kugadziridzwa kwezvinhu zvinouya uye kupa chigadzirwa zvakananga. Tinogona kupa Safire, Quartz, Corning, uye SCHOTT, BF33 uye mamwe magirazi. Kana uine chinodiwa, unogona kutibata zvakananga chero nguva! Welcome kubvunza!