Maitiro eTVG pawafer ye quartz sapphire BF33 girazi wafer punching

Zvakanakira zveTGV (Through Glass Via) zvinonyanya kuratidzwa mu:

1) Hunhu hwakanaka hwemagetsi hune mafrequency akakwira. Girazi chinhu chinodzivirira kupisa, dielectric constant inongori chikamu chimwe chete kubva muzvitatu zvesilicon, kurasikirwa kwakaderera ne2-3 pane silicon, zvichiita kuti kurasikirwa kwesubstrate uye migumisiro yezvipembenene ideredzwe zvakanyanya kuti ive nechokwadi chekuti chiratidzo chinotumirwa chakavimbika;

(2) Zviri nyore kuwana girazi rakakura uye rakatetepa zvakanyanya. Tinogona kupa Sapphire, Quartz, Corning, uye SCHOTT uye vamwe vagadziri vemagirazi vanogona kupa girazi repaneru rakakura kwazvo (>2m × 2m) uye rakatetepa zvakanyanya (<50µm) uye zvinhu zvegirazi zvinochinjika zvakanyanya.

3) Mutengo wakaderera. Batsirwa nekuwana nyore nyore girazi guru rakatetepa kwazvo, uye haridi kuiswa kwezvikamu zvinodzivirira kupisa, mutengo wekugadzira girazi readapter ndiro chikamu chimwe chete muzvina cheplate yeadapter yakavakirwa pasilicon;

4) Maitiro ari nyore. Hapana chikonzero chekuisa jira rinodzivirira kupisa pamusoro pe substrate nemadziro emukati meTGV (Through Glass Via), uye hapana kutetepa kunodiwa mu adapter plate yakatetepa kwazvo;

(5) Kugadzikana kwakasimba kwemuchina. Kunyangwe ukobvu hwe adapter plate huri pasi pe 100µm, warpage ichiri diki;

6) Mhando dzakasiyana dzemashandisirwo. Pamusoro pemashandisirwo akanaka mumunda we high-frequency, sechinhu chinoonekera, chinogonawo kushandiswa mumunda we optoelectronic system integration, airproof resistance uye corrosion reliability zvinoita kuti girazi substrate mumunda we MEMS encapsulation rive nekwanisiro huru.

Parizvino, kambani yedu inopa tekinoroji yegirazi reTGV (Through Glass Via) kuburikidza neburi, inogona kuronga kugadziriswa kwezvinhu zvinouya uye kupa chigadzirwa zvakananga. Tinogona kupa Sapphire, Quartz, Corning, uye SCHOTT, BF33 nemamwe magirazi. Kana muchida, munogona kutibata zvakananga chero nguva! Tinokugamuchirai kubvunza!