Wafer yeSilikoni Yakaputirwa nesimbi yeTi/Cu (Titanium/Copper)

Mufananidzo wakaratidzwa weTi/Cu Silicon Wafer (Titanium/Copper) Yakaputirwa nesimbi

Tsananguro pfupi:

YeduZvidimbu zvesilicon zvakaputirwa nesimbi zveTi/Cuine silicon yepamusoro (kana girazi/quartz) substrate yakafukidzwa nerukoko rwekunamatira titaniumuyerukoko rwemhangurauchishandisakusputtering kwakajairika kwemagnetron.Ti interlayer inovandudza zvakanyanya kunamira uye kugadzikana kwemaitiro, nepo Cu top layer ichipa nzvimbo isingapindi simba zvakanyanya, yakafanana yakanakira kubatanidza magetsi uye microfabrication iri pasi.

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Wafer yeSilikoni Yakaputirwa nesimbi yeTi/Cu (Titanium/Copper)6

Pfupiso

Yakagadzirirwa zvese kushandiswa kwekutsvaga uye kwekuongorora, mawafer aya anowanikwa muhukuru hwakasiyana uye munzvimbo dzakasiyana dzekudzivirira, ane hunyanzvi hwekugadzirisa ukobvu, rudzi rwe substrate, uye magadzirirwo e coating.

Zvinhu Zvikuru

Kunamatira kwakasimba uye kuvimbika: Ti bonding layer inowedzera kunamira kwefirimu kuSi/SiO₂ uye inovandudza kusimba kwekubata
Kumusoro kwepamusoro-soro: Kuputira kweCu kunoita kuti magetsi ashande zvakanaka kune vanhu vanobatana uye vanoedza zvivakwa
Rudzi rwakakura rwekugadzirisa: saizi yewafer, resistivity, kurongeka, ukobvu hwe substrate, uye ukobvu hwefirimu zvinowanikwa kana zvakumbirwa
Zvigadziko zvakagadzirira maitiro: inoenderana nemaitiro akajairika ekurabhoritari uye ekugadzira zvinhu (lithography, electroplating build-up, metrology, nezvimwewo)
Zvinyorwa zviripo: kunze kweTi/Cu, tinopawo mawafers ane simbi akaputirwa neAu, Pt, Al, Ni, Ag

Maumbirwo Akajairika & Kuiswa

Dura: Substrate + Ti adhesion layer + Cu coating layer
Maitiro akajairwa: Kusvipa kweMagnetron
Maitiro ekusarudza: Kupisa kwemvura / Kuisa Electroplating (kune zvinodiwa neCu yakakora)

Zvimiro zveMichina zveGlasi reQuartz

Chinhu	Sarudzo
Saizi yewafer	2", 4", 6", 8"; 10×10 mm; saizi dzekucheka dzakagadzirwa
Rudzi rwekufambisa	Rudzi rweP / Rudzi rweN / Rudzi rwemukati runodzivirira zvakanyanya (Un)
Kudzidziswa	<100>, <111>, nezvimwewo.
Kuramba	<0.0015 Ω·cm; 1–10 Ω·cm; >1000–10000 Ω·cm
Ukobvu (µm)	2": 200/280/400/500; 4": 450/500/525; 6": 625/650/675; 8": 650/700/725/775; custom
Zvinhu zvepasi pevhu	Silicon; quartz, girazi reBF33, nezvimwewo.
Ukobvu hwefirimu	10 nm / 50 nm / 100 nm / 150 nm / 300 nm / 500 nm / 1 µm (inogadziriswa)
Sarudzo dzemafirimu esimbi	Ti/Cu; uyewo Au, Pt, Al, Ni, Ag iripo

Chidimbu cheSilikoni chakaputirwa nesimbi cheTi/Cu (Titanium/Copper)4

Mashandisirwo

Ohmic contact & conductive substratesyekuongorora nekuvandudza michina uye kuyedza magetsi
Mbeu dzekugadzira electroplating(RDL, MEMS structures, gobvu Cu build-up)
Sol-gel uye nanomaterial kukura substratesyekutsvagisa kwe nano uye thin-film
Microscopy & metrology pamusoro(Kugadzirira uye kuyerwa kwemuenzaniso weSEM/AFM/SPM)
Nzvimbo dzemakemikari/dzezvinhu zvipenyuzvakaita semapuratifomu ekukura kwemasero, mapuroteni/DNA microarrays, uye ma substrates e reflectometry

FAQ (Ti/Cu Metal-Coated Silicon Wafers)

Mubvunzo 1: Sei Ti layer ichishandiswa pasi peCu coating?
A: Titanium inoshanda serukoko rwekunamatira (kubatana), kunatsiridza kunamatidzwa kwemhangura kune substrate uye kunatsiridza kugadzikana kweinterface, izvo zvinobatsira kuderedza kukwesha kana kucheka panguva yekubata nekugadzirisa.

Mubvunzo wechipiri: Ndeipi gadziriro yakajairika yeukobvu hweTi/Cu?
A: Misanganiswa yakajairika inosanganisiraTi: makumi e nm (semuenzaniso, 10–50 nm)uyeKureba kweCu: 50–300 nmyemafirimu akapfava. Matanda eCu akakora (µm-level) anowanzo kuwanikwa neelectroplating pachikamu chembeu cheCu chakasvinwa, zvichienderana nekunyorera kwako.

Mubvunzo 3: Unogona here kuputira mativi ese ewafer?
A: Ehe.Kupfeka kwedivi rimwe chete kana maviriinowanikwa kana yakumbirwa. Ndapota taurai zvamunoda pakutenga.

Nezvedu

XKH inonyanya kugadzira, kugadzira, uye kutengesa magirazi egirazi egirazi uye zvinhu zvitsva zvekristaro. Zvigadzirwa zvedu zvinopa zvigadzirwa zvemagetsi, zvemagetsi zvevatengi, uye zvemauto. Tinopa zvikamu zveSapphire optical, malenzi efoni, Ceramics, LT, Silicon Carbide SIC, Quartz, uye mawafer egirazi esemiconductor. Tine hunyanzvi uye michina yemazuva ano, tinobudirira mukugadzirisa zvigadzirwa zvisiri zvemazuva ano, tichivavarira kuva bhizinesi rinotungamira rezvigadzirwa zvemagetsi.