Zvigadziko zvegirazi zveTGV 12inch wafer girazi rinopunhwa

Zvigadziko zvegirazi zvinoshanda zviri nani maererano nehunhu hwekupisa, kugadzikana kwemuviri, uye hazvipindi kupisa zvakanyanya uye hazviwanzoitiki nematambudziko ekukombama kana kushanduka nekuda kwekupisa kwakanyanya;

Pamusoro pezvo, hunhu hwemagetsi hwakasiyana hwepakati pegirazi hunoita kuti pave nekurasikirwa kwakaderera kwe dielectric, zvichibvumira kufambiswa kwechiratidzo uye simba zviri nyore. Nekuda kweizvozvo, kurasikirwa kwesimba panguva yekufambiswa kwechiratidzo kunodzikira uye kushanda kwe chip kunowedzerwa zvechisikigo. Ukobvu hwepasi pegirazi hunogona kuderedzwa nehafu kana tichienzanisa nepurasitiki yeABF, uye kutetepa kunovandudza kumhanya kwekutumira chiratidzo uye kushanda zvakanaka kwesimba.

Tekinoroji yekugadzira maburi yeTGV:

Nzira yekucheka inokonzerwa nelaser inoshandiswa kukonzera nzvimbo inoshanduka kubva muganda kuburikidza nelaser yakapwanywa, uye girazi rakagadziriswa nelaser rinoiswa mu hydrofluoric acid solution yekucheka. Kucheka kwegirazi renzvimbo inoshanduka kubva muganda mu hydrofluoric acid kunokurumidza kupfuura kwegirazi risina kupatsanurwa kubva mugomba.

Kuzadzwa kweTGV:

Chekutanga, maburi eTGV anogadzirwa. Chechipiri, mbeu yacho yakaiswa mukati megomba reTGV kuburikidza ne physical vapor deposition (PVD). Chechitatu, electroplating inobva pasi inoenda kumusoro inoita kuti TGV izare zvakanaka; Chekupedzisira, kuburikidza nekubatana kwenguva pfupi, kukuya musana, chemical mechanical polishing (CMP) copper exposure, kusunungura bonding, zvichiita TGV metal-filled transfer plate.