SiC Ceramic Fork Arm / End Effector - Yepamberi Precision Kubata kweSemiconductor Manufacturing

Tsanangudzo Pfupi

Iyo SiC Ceramic Fork Arm, inowanzonzi Ceramic End Effector, ndeye yakakwirira-inoshanda chaiyo inobata chikamu chakanyatso gadziridzwa kutakura wafer, kurongeka, uye chinzvimbo mumaindasitiri epamusoro-tech, kunyanya mukati me semiconductor uye photovoltaic kugadzirwa. Yakagadzirwa uchishandisa yakakwira-kuchena silicon carbide ceramics, chikamu ichi chinosanganisa yakasarudzika mechanicha simba, Ultra-yakaderera kupisa kwekuwedzera, uye nepamusoro kuramba kuvhunduka kwekupisa uye ngura.

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Features

Detailed Diagram

Product Overview

Kusiyana nemaitiro echinyakare ekupedzisira anogadzirwa kubva kualuminium, simbi isina tsvina, kana kunyange quartz, SiC ceramic end effectors inopa isingaenzaniswi mumakamuri ekutsvaira, dzimba dzekuchenesa, uye dzakaomarara kugadzirisa nharaunda, zvichiita kuti ive chikamu chakakosha chechizvarwa chinotevera chipfuko chinobata marobhoti. Nekuwedzera kudiwa kwekusvibiswa-isina kugadzirwa uye kushivirira kwakasimba mukugadzira chipmaking, kushandiswa kweceramic end effectors kuri kukurumidza kuve iyo indasitiri chiyero.

Manufacturing Principle

Kugadzirwa kweSiC Ceramic End Effectsinosanganisira nhevedzano yepamusoro-chaiyo, yakakwirira-kuchena maitiro anovimbisa zvese kushanda uye kusimba. Maitiro maviri makuru anonyanya kushandiswa:

Reaction-Bonded Silicon Carbide (RB-SiC)

Mukuita uku, preform yakagadzirwa kubva kusilicon carbide poda uye binder inopinzwa nesilicon yakanyungudutswa pakudziya kwakanyanya (~ 1500 ° C), iyo inopindirana neinosara kabhoni kuumba gobvu, yakaoma SiC-Si inoumbwa. Iyi nzira inopa yakanakisa dimensional control uye inodhura-inoshanda kune yakakura-yakakura kugadzirwa.

Pressureless Sintered Silicon Carbide (SSiC)

SSiC inogadzirwa nekuisira ultra-fine, high-purity SiC poda pakupisa kwakanyanya (> 2000 ° C) pasina kushandisa zvinowedzera kana chikamu chinosunga. Izvi zvinoguma nechigadzirwa chine ingangoita 100% density uye yepamusoro mechanika uye inopisa zvivakwa zvinowanikwa pakati peSiC zvinhu. Iyo yakanakira kune yekupedzisira-yakakosha wafer kubata maapplication.

Post-Processing

Precision CNC Machining: Inowana yakakwirira flatness uye parallelism.
Surface Finishing: Kupenya kwedhaimani kunoderedza kushata kwepamusoro kusvika <0.02 µm.
Inspection: Optical interferometry, CMM, uye isiri-kuparadza bvunzo dzinoshandiswa kuratidza chidimbu chimwe nechimwe.

Aya matanho anovimbisa kutiSiC end effectorinopa inowirirana yekuiswa kwewafer kurongeka, yakanakisa planarity, uye kushoma particle chizvarwa.

Key Features uye Benefits

Feature	Tsanangudzo
Ultra-Yakakwirira Kuoma	Vickers kuoma> 2500 HV, kuramba kupfeka uye chipping.
Low Thermal Kuwedzera	CTE ~4.5 × 10⁻⁶/K, zvichiita kuti chidimbu chigadzikane mukupisa bhasikoro.
Kemikari Inertness	Inopikisa HF, HCl, magasi eplasma, uye zvimwe zvinoparadza.
Yakanakisa Thermal Shock Resistance	Inokodzera kukurumidza kupisa / kutonhora mune vacuum uye choto masisitimu.
High Rigidity uye Simba	Inotsigira refu cantilevered forogo maoko pasina kutsauka.
Low Outgassing	Yakanakira ultra-high vacuum (UHV) nharaunda.
ISO Kirasi 1 Imba Yekuchenesa Yakagadzirira	Particle-yemahara mashandiro anovimbisa wafer kutendeseka.

Applications

Iyo SiC Ceramic Fork Arm / End Effector inoshandiswa zvakanyanya mumaindasitiri anoda kunyatsojeka, kuchena, uye makemikari kuramba. Mamiriro ekushandisa akakosha anosanganisira:

Semiconductor Manufacturing

Wafer kurodha / kuburitsa mu deposition (CVD, PVD), etching (RIE, DRIE), uye yekuchenesa masisitimu.
Robotic wafer yekufambisa pakati peFOUPs, makaseti, uye maturusi ekugadzira.
Kubata kwepamusoro-tembiricha panguva yekupisa kwemafuta kana kuti annealing.

Photovoltaic Cell Production

Kutakurwa kwakapfava kwesilicon wafers kana solar substrates mumitsetse otomatiki.

Flat Panel Ratidza (FPD) Indasitiri

Kufambisa girazi hombe mapaneru kana substrates muOLED/LCD kugadzirwa nharaunda.

Compound Semiconductor / MEMS

Inoshandiswa muGaN, SiC, uye MEMS mitsetse yekugadzira uko kudzora kusvibiswa uye kurongeka kwechokwadi kwakakosha.

Basa rayo rekupedzisira rinonyanya kukosha pakuona kusakanganiswa, kubata kwakagadzikana panguva yekushanda kwakaoma.

Customization kugona

Isu tinopa yakakura kugadzirisa kuti isangane neyakasiyana michina uye maitiro ekuita:

Fork Design: Maviri-prong, akawanda-minwe, kana kupatsanurwa-level marongero.
Wafer Size Kuenderana: Kubva pa2 "kusvika ku12" zvimedu.
Mounting Interfaces: Inoenderana neOEM robhoti maoko.
Ukobvu & Nepamusoro Tolerances: Micron-level flatness uye kumucheto kutenderera kunowanikwa.
Anti-Slip Features: Optional surface textures kana machira ekuchengetedza wafer grip.

Mumwe nomumweceramic end effectorinogadzirwa pamwe chete nevatengi kuti ive nechokwadi chakanyatsokodzera chine mashoma maturusi shanduko.

Mibvunzo Inowanzo bvunzwa (FAQ)

Q1: SiC iri nani sei pane quartz yekupedzisa effector application?
A1:Nepo quartz ichiwanzo shandiswa pakuchena kwayo, inoshaya kusimba kwemagetsi uye inogara ichiputsika pasi pemutoro kana kupisa kwekushisa. SiC inopa simba repamusoro, kuramba kupfeka, uye kugadzikana kwemafuta, zvakanyanya kuderedza njodzi yekudzikira uye kukuvara kwewafer.

Q2: Ko iyi ceramic forogo ruoko inoenderana neese marobhoti wafer handlers?
A2:Ehe, edu eceramic end effect inoenderana neakawanda mahombe ekubata masisitimu uye anogona kuchinjirwa kune yako chaiyo marobhoti modhi ine chaiyo engineering mifananidzo.

Q3: Inogona kubata 300 mm wafers pasina warping?
A3:Zvamazvirokwazvo. Iyo yakanyanya kuomarara yeSiC inobvumira kunyange yakatetepa, yakareba forogo maoko kubata 300 mm wafers zvakachengeteka pasina kudonha kana kutsauka panguva yekufamba.

Q4: Ndeipi yakajairika sevhisi hupenyu hweSiC ceramic end effector?
A4:Nekushandisa kwakakodzera, SiC end effector inogona kugara 5 kusvika 10 nguva yakareba kupfuura yechinyakare quartz kana aruminiyamu modhi, nekuda kwekupokana kwayo kwekupisa nekushushikana kwemagetsi.

Q5: Iwe unopa zvinotsiva kana nekukurumidza prototyping masevhisi?
A5:Ehe, isu tinotsigira kukurumidza kugadzirwa kwemuenzaniso uye tinopa ekutsiva masevhisi zvichienderana neCAD dhizaini kana reverse-engineered zvikamu kubva kumidziyo iripo.

Nezvedu

XKH inyanzvi mukusimudzirwa kwepamusoro-soro, kugadzira, uye kutengesa kwegirazi remaziso uye zvinhu zvitsva zvekristaro. Zvigadzirwa zvedu zvinoshanda zvemagetsi zvemagetsi, zvemagetsi zvevatengi, uye mauto. Isu tinopa Sapphire optical components, nharembozha lens inovhara, Ceramics, LT, Silicon Carbide SIC, Quartz, uye semiconductor crystal wafers. Nehunyanzvi hunyanzvi uye yekucheka-kumucheto michina, isu tinokunda mune isiri-yakajairwa chigadzirwa kugadzirisa, tichivavarira kuve inotungamira optoelectronic zvinhu zvepamusoro-tech bhizinesi.