Midziyo Yekusimudza-Kubvisa Semiconductor Laser

Midziyo Inosimudza Laser Semiconductor Mufananidzo Wakaratidzwa

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Midziyo yeSemiconductor Laser Lift-Off inomiririra mhinduro yechizvarwa chinotevera yekucheneswa kweingot yepamusoro mukugadzirisa zvinhu zve semiconductor. Kusiyana nenzira dzechinyakare dzewafer dzinoshandisa mechanical grinding, diamond wire sawing, kana chemical-mechanical planarization, iyi laser-based platform inopa imwe nzira isina kubata, isingaparadze yekubvisa layers dzakatetepa kubva ku bulk semiconductor ingots.

Yakagadzirirwa zvinhu zvinopfava uye zvinokosha zvakaita se gallium nitride (GaN), silicon carbide (SiC), sapphire, uye gallium arsenide (GaAs), Semiconductor Laser Lift-Off Equipment inogonesa kucheka mafirimu emhando yewafer zvakananga kubva ku crystal ingot. Iyi tekinoroji yekubudirira inoderedza zvakanyanya marara ezvinhu, inovandudza kufambisa, uye inosimudzira kusimba kwe substrate - zvese izvi zvakakosha kune zvishandiso zvechizvarwa chinotevera mumagetsi emagetsi, masisitimu eRF, photonics, uye micro-displays.

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Pfupiso yeChigadzirwa cheMidziyo yeLaser Lift-Off

Nekunyanya kukoshesa kudzora otomatiki, kuumba beam, uye kuongorora kwekudyidzana kwezvinhu zve laser, Semiconductor Laser Lift-Off Equipment yakagadzirirwa kubatanidzwa zvakanaka mumafambisirwo ekugadzira e semiconductor uku ichitsigira kuchinjika kweR&D uye kukwirira kwekugadzirwa kwehuwandu.

Tekinoroji & Nheyo yeKushanda kweMidziyo yeLaser Lift-Off

Maitiro anoitwa neSemiconductor Laser Lift-Off Equipment anotanga nekuvhenekesa ingot yemupi wechiedza kubva kudivi rimwe uchishandisa danda relaser reultraviolet rine simba guru. Danda iri rakanyatso tariswa pakadzika kwemukati, kazhinji padivi pechimiro cheinjiniya, uko kunyudzwa kwesimba kunowedzera nekuda kwekuchinja kwemaziso, kupisa, kana makemikari.

Pachikamu ichi chekunwa simba, kupisa kwenzvimbo kunotungamira kukuputika kudiki nekukurumidza, kuwedzera kwegasi, kana kuora kwechikamu chepakati (semuenzaniso, firimu rinodzvinyirira kana oxide yechibayiro). Kukanganiswa uku kwakanyatsodzorwa kunoita kuti chikamu chepamusoro chekristalline - chine ukobvu hwemakumi ema micrometer - chibve kubva pasi pengot zvakachena.

Semiconductor Laser Lift-Off Equipment inoshandisa misoro yekuongorora inoenderana nekufamba, kudzora kwe-z-axis kunogona kurongwa, uye reflectometry yenguva chaiyo kuona kuti kutenderera kwese kwese kunopa simba panzvimbo chaiyo yaunoda. Midziyo iyi inogonawo kugadzirwa ne burst-mode kana multi-pulse capabilities kuti iwedzere kutsetseka kwekubvisa uye kuderedza kushushikana kwasara. Zvakakosha, nekuti laser beam haimbofi yakabatana nechinhu chacho panyama, njodzi yekupwanyika, kukotama, kana kupwanyika kwenzvimbo inodzikira zvakanyanya.

Izvi zvinoita kuti nzira yekubvisa ganda nelaser ichinje zvinhu, kunyanya kana paine mawafer akatetepa zvakanyanya uye akareba anodiwa ne sub-micron TTV (Total Thickness Variation).

Paramita yeSemiconductor Laser Lift-Off Equipment

Kureba kwewave	IR/SHG/THG/FHG
Upamhi hwePulse	Nanosecond, Picosecond, Femtosecond
Sisitimu yeOptical	Sisitimu yemaziso yakagadziriswa kana sisitimu yeGalvano-optical
Danho reXY	500 mm × 500 mm
Kugadzirisa Range	160 mm
Kumhanya Kwekufamba	Kupfuura 1,000 mm/sekondi
Kudzokorora	±1 μm kana pasi
Kururama Kwechinzvimbo Chacho:	±5 μm kana pasi
Saizi yeWafer	2–6 inches kana kuti yakagadzirirwa
Kudzora	Windows 10, 11 uye PLC
Simba reKupa Magetsi	AC 200 V ±20 V, Chikamu chimwe chete, 50/60 kHz
Zviyero zvekunze	2400 mm (W) × 1700 mm (D) × 2000 mm (H)
Huremu	chiuru chimwe chekirogiramu

Mashandisirwo eMidziyo yeLaser Lift-Off muMaindasitiri

Midziyo yeSemiconductor Laser Lift-Off iri kukurumidza kushandura magadzirirwo ezvinhu munzvimbo dzakasiyana-siyana dze semiconductor:

Zvishandiso zveSimba zveVertical GaN zveMidziyo yeLaser Lift-Off

Kubviswa kwemafirimu eGaN-on-GaN akatetepa zvikuru kubva kuma ingot akawanda kunogonesa magadzirirwo emagetsi akatwasuka uye kushandiswazve kwema substrates anodhura.

Kutetepa kweSiC Wafer kweSchottky neMOSFET Devices

Inoderedza ukobvu hwechikamu chemudziyo uku ichichengetedza kuenzana kwechikamu chepasi — yakanakira magetsi emagetsi anochinja nekukurumidza.

LED neZvinhu zvekuratidza zveLaser Lift-Off zvinoshandisa Sapphire

Inogonesa kupatsanurwa kwakanaka kwezvikamu zvemidziyo kubva kumabhuru esapphire kuti itsigire kugadzirwa kwemicro-LED yakatetepa uye inodziya.

III-V Unyanzvi hwezvinhu zveLaser Lift-Off Equipment

Inobatsira kupatsanurwa kweGaAs, InP, uye AlGaN layers kuti pave nekubatanidzwa kwepamusoro kwe optoelectronic.

Kugadzirwa kweThin-Wafer IC uye Sensor

Inogadzira zvikamu zvitete zvinoshanda zvemasensa ekumanikidza, maaccelerometer, kana maphotodiode, uko huwandu huri chinetso chekushanda.

Zvigadzirwa zvemagetsi zvinochinjika uye zvakajeka

Inogadzira ma substrates akatetepa zvikuru akakodzera ma display anochinjika, macircuit anopfekwa, uye mahwindo akachenjera anoonekera.

Munzvimbo imwe neimwe yeizvi, Semiconductor Laser Lift-Off Equipment inoita basa rakakosha mukuita kuti zvinhu zvidiki zvishandiswe, kushandiswazve kwezvinhu, uye kurerutsa mashandiro.

Mibvunzo Inowanzo bvunzwa (FAQ) yeMidziyo yeLaser Lift-Off

Mubvunzo 1: Upfu hwakadini hwandingawana ndichishandisa Semiconductor Laser Lift-Off Equipment?
A1:Kazhinji pakati pema microns gumi kusvika makumi matatu zvichienderana nechinhu chacho. Maitiro acho anogona kuita kuti pave nemigumisiro mitete kana paine zvigadziriso zvakagadziriswa.

Mubvunzo wechipiri: Izvi zvinogona kushandiswa kucheka mawafer akawanda kubva muingot imwe chete here?
A2:Ehe. Vatengi vazhinji vanoshandisa nzira yekubvisa nelaser kuti vabvise zvidimbu zvakawanda zvakatetepa kubva muingot imwe chete.

Mubvunzo wechitatu: Ndezvipi zvinhu zvekuchengetedza zvinosanganisirwa pakushanda kwelaser ine simba guru?
A3:Mavharo eClass 1, masisitimu ekukiya, chidzitiro chematanda, uye kudzima otomatiki zvese zvakajairika.

Mubvunzo wechina: Sisitimu iyi inoenzaniswa sei nekucheka waya kwedhaimani maererano nemutengo wayo?
A4:Kunyange hazvo capex yekutanga ingave yakakwira, kubviswa nelaser kunoderedza zvakanyanya mari inoshandiswa, kukuvara kwe substrate, uye matanho ekugadzirisa mushure mekugadzirisa - kuderedza huwandu hwemari yekuva muridzi (TCO) kwenguva refu.

Mubvunzo 5: Maitiro acho anogona kuwedzerwa kusvika kuma ingots e6-inch kana 8-inch here?
A5:Zvechokwadi. Puratifomu iyi inotsigira ma substrates anosvika masendimita gumi nemaviri ane kugoverwa kwedanda rakafanana uye matanho ekufamba-famba ane chimiro chikuru.

Nezvedu

XKH inonyanya kugadzira, kugadzira, uye kutengesa magirazi egirazi egirazi uye zvinhu zvitsva zvekristaro. Zvigadzirwa zvedu zvinopa zvigadzirwa zvemagetsi, zvemagetsi zvevatengi, uye zvemauto. Tinopa zvikamu zveSapphire optical, malenzi efoni, Ceramics, LT, Silicon Carbide SIC, Quartz, uye mawafer egirazi esemiconductor. Tine hunyanzvi uye michina yemazuva ano, tinobudirira mukugadzirisa zvigadzirwa zvisiri zvemazuva ano, tichivavarira kuva bhizinesi rinotungamira rezvigadzirwa zvemagetsi.