Midziyo yeSemiconductor
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Mutsetse weSilicon / Silicon Carbide (SiC) Wafer une Matanho mana akabatana nePolishing Automation (Mutsetse weKubata wePost-Polish)
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SiC Seed Coating–Bonding–Sintering Integrated Solution
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Sisitimu yeLaser Micromachining Yakanyatsogadzirwa
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Waya yeDaimondi Yakaona Waya Yakawanda-Waya Yekucheka Zvinhu Zvakasimba Uye Zvisina Kusimba
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Muchina weKugadzira Laser Unotungamirirwa neMicro Waterjet
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Muchina wekucheka wedhaimani wemhando yeSwing-Type Multi-Wire Diamond Saw unochinjika zvikuru
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Dhaimani Yakaona Mawaya Akawanda TJ3000 12″ Yakatenderedzwa Yakadzika
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Zvishandiso zveSaw Saw zveSapphire/Ceramics/Marble muVertical/Horizontal/Multi-Waya Cutting
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Zvikamu zveKutaurirana neLaser Yepamusoro-soro & Zviteshi
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Diamond Wire Multi-Waya High-Speed High-Precision Downward Swing Cutting Machine
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Midziyo Yekupukuta Yemativi Maviri Yakanyatsogadzirwa
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Muchina weKukuya Wakanyatsogadzirwa weSiC Sapphire Si wafer