Mamiriro Azvino uye Mafambiro eSiC Wafer Processing Technology

Sezvinhu zvechikamu chechitatu chemidziyo yesimbi,kabhidhi yesilicon (SiC)Kristaro imwe chete ine mikana yakawanda yekushandiswa mukugadzira michina yemagetsi ine mafrequency akawanda uye ine simba guru. Tekinoroji yekugadzirisa yeSiC ine basa guru mukugadzirwa kwezvinhu zvemhando yepamusoro zve substrate. Chinyorwa chino chinosuma mamiriro aripo ekutsvagisa matekinoroji ekugadzirisa SiC muChina nekune dzimwe nyika, kuongorora nekuenzanisa nzira dzekucheka, kukuya, uye kupukuta, pamwe nemafambiro ekutsetseka kwewafer uye kuomarara kwenzvimbo. Chinotaurawo nezvematambudziko aripo mukugadzirisa wafer yeSiC uye chinokurukura nzira dzekuvandudza mune ramangwana.

Silicon carbide (SiC)Mawafers zvinhu zvakakosha zvekutanga zvemidziyo yesemiconductor yechizvarwa chechitatu uye ane kukosha kukuru uye mukana wemusika munzvimbo dzakadai sema microelectronics, magetsi emagetsi, uye magetsi esemiconductor. Nekuda kwekuoma kwakanyanya uye kugadzikana kwemakemikari emagetsi.SiC makristaro rimwe chete, nzira dzechinyakare dzekugadzirisa ma semiconductor hadzina kukodzera zvachose pakugadzira kwavo. Kunyangwe makambani mazhinji epasi rose akaita tsvakiridzo yakakura pakugadzirisa kwakasimba kwemakristaro eSiC single, matekinoroji akakodzera anochengetwa zvakavanzika zvakanyanya.

Mumakore achangopfuura, China yakawedzera kushanda nesimba mukugadzira zvinhu zveSiC single crystal nemidziyo. Zvisinei, kufambira mberi kwetekinoroji yeSiC device munyika iyi kuri kudziviswa nemiganhu mukugadzirwa kwetekinoroji uye mhando yewafer. Saka, zvakakosha kuti China ivandudze kugona kweSiC processing kuti iwedzere kunaka kweSiC single crystal substrates uye kuti ikwanise kushandiswa uye kugadzirwa kwayo kwakawanda.

Matanho makuru ekugadzirisa anosanganisira: kucheka → kukuya kwakakora → kukuya zvakanaka → kupukuta zvisina kunaka (kupukuta kwemuchina) → kupukuta zvakanaka (kupukuta kwemuchina kwemakemikari, CMP) → kuongorora.

Kuchekwa kweSiC Single Crystals

MukugadzirisaSiC makristaro rimwe chete, kucheka ndiro danho rekutanga uye rakakosha zvikuru. Kuchinja kwewafer's bow, warp, uye total thickness variation (TTV) zvinobva mukucheka zvinosarudza kunaka uye kushanda kwemabasa ekukuya nekupukuta anotevera.

Zvishandiso zvekucheka zvinogona kupatsanurwa zvichienderana nechimiro muzvikamu zviviri: dhayamita ye ...

1.1 Nzira dzeKucheka dzechinyakare

Kudzika kwekucheka kwemasaha ekunze (OD) kunogumira pahukuru hwebanga. Munguva yekucheka, banga rinowanzo zunguzika uye kutsauka, zvichikonzera ruzha rwakanyanya uye kuomarara kusina kunaka. Masaha emukati (ID) anoshandisa madhaimani abrasives padenderedzwa remukati rebanga semucheto wekucheka. Masaha aya anogona kunge akatetepa kusvika 0.2 mm. Panguva yekucheka, banga reID rinotenderera nekumhanya kukuru ukuwo chinhu chinochekwa chichifamba nepakati pebanga, zvichiita kuti chichekwe kuburikidza nekufamba uku.

Macheka edhaimani anoda kumira nekudzoserwa shure kakawanda, uye kumhanya kwekucheka kwakaderera zvikuru—kazhinji hakupfuuri 2 m/s. Anotamburawo nekusakara kukuru kwemuchina uye mari yakawanda yekugadzirisa. Nekuda kwehupamhi hwebanga rekucheka, radius yekucheka haigone kuve diki zvakanyanya, uye kucheka kwezvidimbu zvakawanda hakugoneki. Izvi zvishandiso zvekucheka zvechinyakare zvinoganhurirwa nekuomarara kwehwaro uye hazvigoneke kuita kucheka kwakakombama kana kuti zvine radius yakaganhurirwa yekutendeuka. Zvinongokwanisa kucheka zvakananga, kugadzira matanda akafara, zvine mwero wakaderera wekukohwa, uye nekudaro hazvina kukodzera kucheka.Makristaro eSiC.

1.2 Kucheka Kwemahara KweAbrasive Wire Saw Multi-Waya

Nzira yekucheka waya isina abrasive inoshandisa kufamba nekukurumidza kwewaya kuti iendese tsvina mukerf, zvichiita kuti zvinhu zvibviswe. Inonyanya kushandisa chimiro chinodzokororwa uye parizvino inzira yakakura uye inoshandiswa zvakanyanya pakucheka silicon ine kristalo imwe chete nemawafer akawanda. Zvisinei, kushandiswa kwayo mukucheka SiC hakuna kunyatsodzidzwa zvakanyanya.

Macheka emagetsi anokwesha anogona kugadzirisa mawafer ane ukobvu huri pasi pe300 μm. Anopa kurasikirwa kwakaderera, haawanzo kukonzera kupwanyika, uye anoita kuti pamusoro pawo pave nemhando yakanaka. Zvisinei, nekuda kwenzira yekubvisa zvinhu—zvichibva pakumonereka uye kupwanyika kweabrasives—pamusoro pewafer panowanzova nekushushikana kwakakura, kutsemuka kudiki, uye kukuvadzwa kwakadzika. Izvi zvinotungamira mukukombama kwewafer, zvinoita kuti zviome kudzora kururama kweprofile yepamusoro, uye kuwedzera mutoro pamatanho anotevera ekugadzirisa.

Kucheka kunonyanya kukanganiswa netsvina; zvakakosha kuchengetedza kupinza kwezvinoshandiswa pakukanda uye huwandu hwetsvina. Kugadzirisa slurry uye kudzokorodza kunodhura. Pakucheka zvishandiswa zvakakura, zvinonetsa kupinda muzvikamu zvakadzika uye zvakareba. Pasi pehukuru hwakafanana hwezviyo zvinokanda, kurasikirwa kwekerf kwakakura kupfuura kwezvinoshandiswa pakucheka waya zvisina kugadzika.

1.3 Yakagadziriswa Abrasive Diamond Wire Saw Multi-Waya Kucheka

Macheka edhaimani akagadzirwa nesimbi anowanzogadzirwa nekuisa zvidimbu zvedhaimani pasimbi yesimbi kuburikidza nenzira dze electroplating, sintering, kana resin bonding. Macheka edhaimani akagadzirwa nesimbi anopa zvakanakira zvakaita semakerf akatetepa, mhando yezvidimbu zviri nani, kushanda zvakanaka, kusvibiswa kwakaderera, uye kugona kucheka zvinhu zvakaoma.

Saha rewaya redhaimani rakagadziriswa nemagetsi parizvino ndiyo nzira inonyanya kushandiswa pakucheka SiC. Mufananidzo 1 (hauratidzirwe pano) unoratidza kuti pamusoro pewaya dzeSiC dzakachekwa sei uchishandisa nzira iyi. Sezvo kucheka kuchienderera mberi, wapage yewafa inowedzera. Izvi zvinodaro nekuti nzvimbo yekubatana pakati pewaya nezvinhu inowedzera sezvo waya ichidzika pasi, zvichiwedzera kuramba uye kudengenyeka kwewaya. Kana waya yasvika padhayamita yepamusoro yewafa, vibration inenge yasvika pakakwirira, zvichikonzera wapage yepamusoro.

Muzvikamu zvekupedzisira zvekucheka, nekuda kwekukurumidzisa waya, kufamba kwakasimba, kudzikira kwesimba, kumira, uye kudzoserwa shure, pamwe nematambudziko ekubvisa marara nechinhu chinotonhodza, kunaka kwewafer kunoderera. Kudzoserwa kwewaya uye kushanduka-shanduka kwekukurumidza, pamwe chete nezvidimbu zvikuru zvedhaimani pawaya, ndizvo zvinonyanya kukonzera kukwenya pamusoro.

1.4 Tekinoroji Yekuparadzanisa Kwechando

Kuparadzaniswa kweSiC single crystals kwakaoma inzira itsva mukugadzira zvinhu zve semiconductor zvechizvarwa chechitatu. Mumakore achangopfuura, yakakwezva kutariswa kukuru nekuda kwezvakanaka zvayo mukuvandudza goho uye kuderedza kurasikirwa kwezvinhu. Tekinoroji iyi inogona kuongororwa kubva pazvinhu zvitatu: musimboti wekushanda, kufamba kwemaitiro, uye zvakanakira zvikuru.

Kuona Kutarisa Kwemakristaro uye Kukuya Kwedhayamita Yekunze: Usati wagadzira, kutarira kwekristaro kweSiC ingot kunofanirwa kuonekwa. Iyo ingot inozoumbwa kuita chimiro che cylindrical (chinowanzonzi SiC puck) kuburikidza nekukuya kwedhayamita yekunze. Danho iri rinoisa hwaro hwekucheka nekuchekerera kwakanangana kunotevera.

Kucheka neWaya Dzakawanda: Nzira iyi inoshandisa zvidimbu zvinokwenya pamwe chete newaya dzekucheka kucheka ingot yecylindrical. Zvisinei, ine dambudziko guru rekurasikirwa kwekerf uye matambudziko ekusaenzana kwepamusoro.

Tekinoroji yekucheka neLaser: Laser inoshandiswa kugadzira layer yakagadziriswa mukati mekristaro, iyo inogona kubviswa zvidimbu zvitete. Nzira iyi inoderedza kurasikirwa kwezvinhu uye inowedzera kushanda zvakanaka kwekugadzirisa, zvichiita kuti ive nzira itsva inovimbisa yekucheka SiC wafer.

Kugadzirisa Maitiro Ekucheka

Kucheka Kwakagadziriswa Kwemawaya Akawanda Abrasive: Iyi ndiyo tekinoroji inoshandiswa zvakanyanya parizvino, yakakodzera SiC ine hunhu hwakasimba.

Kugadzira Machini emagetsi (EDM) neCold Separation Technology: Nzira idzi dzinopa mhinduro dzakasiyana-siyana dzakagadzirirwa zvinodiwa chaizvo.

Maitiro Ekupukuta: Zvakakosha kuti pave nekuyera mwero wekubvisa zvinhu uye kukuvara kwenzvimbo. Kupukuta kwemakemikari (CMP) kunoshandiswa kuvandudza kufanana kwenzvimbo.

Kutarisa Panguva Chaiyo: Tekinoroji dzekuongorora online dzinounzwa kuti dziongorore kuomarara kwenzvimbo panguva chaiyo.

Kucheka neLaser: Iyi nzira inoderedza kurasikirwa kwekerf uye inopfupisa maitiro ekugadzirisa, kunyangwe nzvimbo yakakanganiswa nekupisa ichiri dambudziko.

Matekinoroji Ekugadzira Zvakasanganiswa: Kusanganisa nzira dzemakanika nedzemakemikari kunovandudza mashandiro ekugadzira.

Tekinoroji iyi yatove kushandiswa mumaindasitiri. Semuenzaniso, Infineon yakatenga SILTECTRA uye ikozvino ine ma patent makuru anotsigira kugadzirwa kwakawanda kwema wafers e 8-inch. MuChina, makambani akaita seDelong Laser akawana kugona kwe30 wafers pa ingot imwe neimwe yekugadzirisa wafers e 6-inch, zvichireva kuvandudzwa kwe40% pane nzira dzechinyakare.

Sezvo kugadzirwa kwemidziyo yemumba kuri kukurumidza, tekinoroji iyi inotarisirwa kuva mhinduro huru yekugadzirisa SiC substrate. Nekuwedzera kwedhayamita yezvinhu zve semiconductor, nzira dzekucheka dzechinyakare dzave dzisingachashandi. Pakati pesarudzo dziripo, tekinoroji yekucheka waya yedhaimani inoratidza mikana yekushandisa ine tariro. Kucheka nelaser, senzira iri kubuda, kune mabhenefiti akakosha uye kunotarisirwa kuva nzira huru yekucheka mune ramangwana.

2,Kukuya kweSiC Imwe Chena

Semumiriri wema semiconductors echizvarwa chechitatu, silicon carbide (SiC) inopa mabhenefiti akakosha nekuda kwebandgap yayo yakakura, simba remagetsi rakanyanya kuputsika, kumhanya kwakanyanya kwemaerekitironi, uye thermal conductivity yakanaka. Hunhu uhu hunoita kuti SiC ive inobatsira zvikuru mukushandiswa kwemagetsi ane simba rakawanda (semuenzaniso, 1200V environments). Tekinoroji yekugadzirisa maSiC substrates chikamu chakakosha chekugadzirwa kwemudziyo. Hunhu hwepamusoro uye kurongeka kwesubstrate zvinokanganisa zvakananga kunaka kwe epitaxial layer uye mashandiro emudziyo wekupedzisira.

Chinangwa chikuru chekugadzira simbi ndechekubvisa mavanga ekucheka pamusoro pesimbi uye kukuvara kunokonzerwa nekucheka simbi, uye kugadzirisa kuchekwa kwayo kunokonzerwa nekucheka simbi. Zvichienderana nekuomarara kwaSiC, kugadzira simbi kunoda kushandiswa kwesimbi dzakaoma dzakadai seboron carbide kana diamond. Kugadzira simbi kwakajairika kunowanzo patsanurwa kuita simbi dzakaoma uye simbi dzakatetepa.

2.1 Kukuya Kwakaomarara Uye Kwakanaka

Kukuya kunogona kurongwa zvichienderana nehukuru hwezvimedu zvinogumbura:

Kukuya kwakakora: Kunoshandisa zvinhu zvikuru zvinobvisa mavanga ekucheka nekukuvara kunokonzerwa nekucheka, zvichivandudza mashandiro ekugadzira.

Kukuya Zvidiki: Kunoshandisa zvinhu zvakapfava kubvisa kukuvara kunosara nekukuya kwakakora, kuderedza kuomarara kwenzvimbo, uye kuwedzera kunaka kwenzvimbo.

Vagadziri vazhinji veSiC substrate mudzimba vanoshandisa nzira huru dzekugadzira. Nzira yakajairika inosanganisira kukuya mativi maviri uchishandisa ndiro yesimbi yakakandwa uye slurry yedhaimani yemonocrystalline. Maitiro aya anobvisa zvinobudirira dara rekukuvadzwa rinosiyiwa nekucheka waya, anogadzirisa chimiro chewafer, uye anoderedza TTV (Total Thickness Variation), Bow, uye Warp. Mwero wekubvisa zvinhu wakasimba, unowanzo kusvika 0.8–1.2 μm/min. Zvisinei, pamusoro pewafer inobuda hauna kusimba uye ine roughness yakanyanya - kazhinji inenge 50 nm - izvo zvinoisa kudiwa kwakanyanya pamatanho anotevera ekupukuta.

2.2 Kukuya Kwemativi Maviri

Kukuya kwedivi rimwe chete kunongogadzira divi rimwe chete rewafer panguva imwe chete. Munguva iyi, wafer inoiswa wax paplate yesimbi. Kana yashandiswa, substrate inoshanduka zvishoma, uye pamusoro pechinhu chinotsveyama. Mushure mekukuya, pasi pechinhu chinotsveyama. Kana kudzvanywa kwabviswa, pamusoro pechinhu chinodzokera pachimiro chayo chepakutanga, izvo zvinokanganisawo pasi pechinhu chiri pasi—zvichiita kuti mativi ese akotame uye aderere.

Uyezve, ndiro yekukuya inogona kukombama munguva pfupi, zvichiita kuti wafer ive convex. Kuti ndiro irambe yakati sandara, zvinodiwa kuti igare yakagadzikwa. Nekuda kwekusashanda zvakanaka uye kusaita zvakanaka kwewafer, kukuya kwedivi rimwe chete hakuna kukodzera kugadzirwa kwakawanda.

Kazhinji, mavhiri ekukuya #8000 anoshandiswa pakukuya zvakanaka. MuJapan, maitiro aya akura uye anotoshandisa mavhiri ekupukuta #30000. Izvi zvinoita kuti mawafer akagadziriswa akwane pasi pe2 nm, zvichiita kuti mawafer agadzirire CMP yekupedzisira (Chemical Mechanical Polishing) pasina kuwedzerwa kugadziriswa.

2.3 Tekinoroji yeKutetepa Kwemativi Maviri

Tekinoroji yeDiamond Single-Sided Thinning inzira itsva yekukuya divi rimwe chete. Sezvakaratidzwa muMufananidzo 5 (hazvina kuratidzwa pano), maitiro aya anoshandisa ndiro yekukuya ine dhaimani. Wafer inogadziriswa kuburikidza ne vacuum adsorption, nepo wafer ne diamond grinding wheel zvichitenderera panguva imwe chete. Wiri rekukuya rinodzika zvishoma nezvishoma kuti wafer iite ukobvu hwayo. Mushure mekunge rimwe divi rapera, wafer inopindurwa kuti igadzire rimwe divi.

Mushure mekutetepa, wafer ye 100 mm inogona kuita zvinotevera:

Uta < 5 μm

TTV < 2 μm

Kuomarara kwepamusoro < 1 nm

Nzira iyi yekugadzira wafer imwe chete inopa kugadzikana kwakanyanya, kugara zvakanaka, uye kukurumidza kubviswa kwezvinhu. Kana tichienzanisa nekukuya kwakajairika kwemativi maviri, nzira iyi inovandudza kushanda zvakanaka kwekukuya neinopfuura 50%.

2.4 Kukuya Kwemativi Maviri

Kukuya kwemativi maviri kunoshandisa ndiro yekukuya yepamusoro nepasi kuti kukuya mativi ese epasi panguva imwe chete, zvichiita kuti pamusoro payo pave neunyanzvi hwakanaka kumativi ese.

Munguva yekuita izvi, maplate ekukuya anotanga aisa kumanikidzwa kunzvimbo dzakakwirira dzebasa, zvichikonzera kuchinjika uye kubviswa kwezvinhu zvishoma nezvishoma panzvimbo idzodzo. Sezvo nzvimbo dzakakwirira dzakaenzana, kumanikidzwa kuri pasi pevhu kunowedzera kuenzana, zvichikonzera kuchinjika kwakafanana pamusoro pevhu rese. Izvi zvinoita kuti nzvimbo dzepamusoro nedzepasi dzigayiwe zvakaenzana. Kana kukuya kwapera uye kumanikidzwa kwaburitswa, chikamu chimwe nechimwe chepasi pevhu chinodzoka zvakaenzana nekuda kwekumanikidzwa kwakaenzana kwachakasangana nako. Izvi zvinoita kuti pave nekukotama kushoma uye kusatsetseka kwakanaka.

Kuomarara kwepazasi mushure mekukuya kunoenderana nehukuru hwezvimedu zvinokwesha—zvimedu zvidiki zvinoburitsa nzvimbo dzakatsetseka. Kana uchishandisa 5 μm abrasives pakukuya mativi maviri, kusiyana kweurefu hwewafer uye ukobvu kunogona kudzorwa mukati me5 μm. Kuyerwa kweAtomic Force Microscopy (AFM) kunoratidza kuomarara kwepazasi (Rq) kweinenge 100 nm, nemakomba ekukuya anosvika 380 nm uye mavara anooneka anokonzerwa nekuita kweabrasive.

Imwe nzira yepamusoro inosanganisira kukuya mativi maviri uchishandisa ma polyurethane foam pads pamwe chete ne polycrystalline diamond slurry. Maitiro aya anogadzira ma wafers ane roughness shoma, zvichiita kuti Ra < 3 nm, iyo inobatsira zvikuru pakukwesha kweSiC substrates.

Zvisinei, kukwenya pamusoro pechinhu kuchiri dambudziko risina kugadziriswa. Pamusoro pezvo, dhaimani repolycrystalline rinoshandiswa mukuita uku rinogadzirwa kuburikidza nekugadzirwa kwe explosive, izvo zvinonetsa tekinoroji, zvinopa huwandu hushoma, uye zvinodhura zvakanyanya.

Kukwesha kweSiC Single Crystals

Kuti pave nepamusoro-soro pa silicon carbide (SiC) wafers, kupolisha kunofanira kubvisa zvachose ma grinding pits uye nanometer-scale surface undulations. Chinangwa ndechekugadzira nzvimbo yakatsetseka, isina zvikanganiso isina kusvibiswa kana kuora, isina kukuvara pasi pevhu, uye isina kusimba kwenzvimbo.

3.1 Kupukuta Kwemakanika uye CMP yeSiC Wafers

Mushure mekukura kweSiC single crystal ingot, zvikanganiso zvepadenga zvinoidzivirira kuti isashandiswe zvakananga pakukura kwe epitaxial. Nokudaro, kugadziriswa kwakawanda kunodiwa. Ingot inotanga yaumbwa kuita chimiro che cylindrical kuburikidza nekutenderera, yozochekwa kuita wafers uchishandisa waya yekucheka, yozoteverwa ne crystallographic orientation verification. Kupukuta idanho rakakosha mukuvandudza kunaka kwewafer, kugadzirisa kukuvara kunogona kuitika pamusoro kunokonzerwa nezvikanganiso zvekukura kwekristaro uye matanho ekutanga ekugadzirisa.

Kune nzira ina huru dzekubvisa zvidimbu zvekukuvara pamusoro peSiC:

Kupukuta nemechanical: Zviri nyore asi zvinosiya mavanga; zvakakodzera pakupukuta kwekutanga.

Kupukuta Kwemakemikari (CMP): Kubvisa mavanga kuburikidza nekucheka kwemakemikari; zvakakodzera kupukuta nemazvo.

Kucheka kwehydrogen: Inoda michina yakaoma, inowanzoshandiswa mukuita kweHTCVD.

Kupukuta kunobatsira plasma: Kwakaoma uye hakuwanzo shandiswa.

Kupukuta kwemuchina chete kunowanzo kukonzera kukwenya, nepo kupukuta kwemuchina chete kuchigona kukonzera kusaenzana kwemavara. CMP inosanganisa zvese zvakanakira uye inopa mhinduro inoshanda uye isingadhuri.

Nheyo yekushanda yeCMP

CMP inoshanda nekutenderedza wafer pasi pekumanikidzwa kwakasimba papedhi rinotenderera. Kufamba uku, pamwe chete nekukweshwa kwemuchina kubva kuzvinhu zvidiki zviri muslurry uye kushanda kwemakemikari ezvinokonzera kupindira, kunoita kuti pave nekurongwa kwenzvimbo.

Zvinhu zvakakosha zvakashandiswa:

Kukwesha matope: Ine zvinobvisa ganda uye zvinogadzirisa makemikari.

Pedhi rekupolisha: Rinopera simba panguva yekushandisa, zvichiita kuti maburi asave akanaka uye kuti jira ribude zvakanaka. Kuisa jira nguva dzose, kazhinji uchishandisa dhiraivha yedhaimani, kunodiwa kuti udzorere kukwasharara.

Maitiro Akajairika eCMP

Inokwenya: 0.5 μm dhaimani slurry

Kuomarara kwenzvimbo yakatarwa: ~0.7 nm

Kukwesha Kwemakemikari:

Midziyo yekupolisha: AP-810 polisha ine mativi maviri

Kumanikidzwa: 200 g/cm²

Kumhanya kweplate: 50 rpm

Kumhanya kwemubati weCeramic: 38 rpm

Kuumbwa kwetsvina:

SiO₂ (30 wt%, pH = 10.15)

0–70 wt% H₂O₂ (30 wt%, reagent grade)

Gadzirisa pH kuita 8.5 uchishandisa 5 wt% KOH uye 1 wt% HNO₃

Mwero wekuyerera kwemvura: 3 L/min, inodzokororwa

Maitiro aya anovandudza kunaka kweSiC wafer uye anosangana nezvinodiwa zvemaitiro ekutevera.

Matambudziko Ehunyanzvi Mukugadzira Michina

SiC, semuchina wemagetsi une bandgap yakakura, inoita basa rakakosha muindasitiri yemagetsi. Nehunhu hwakanaka hwemuviri nemakemikari, makristaro eSiC akakodzera nzvimbo dzakanyanya kutonhora, dzakadai sekupisa kwakanyanya, kuwanda kwema frequency, simba rakawanda, uye kuramba mwaranzi. Zvisinei, kuoma kwayo uye kupfava kunounza matambudziko makuru ekukuya nekupukuta.

Sevagadziri vepasi rose vari kuchinja kubva kuma wafer ane 6-inch kuenda kuma 8-inch, matambudziko akadai sekutsemuka uye kukuvara kwema wafer panguva yekugadzirisa zvave pachena, zvichikanganisa zvakanyanya goho. Kugadzirisa matambudziko ehunyanzvi e8-inch SiC substrates ikozvino ndiyo chiyero chakakosha chekufambira mberi kweindasitiri.

Munguva ye8-inch, kugadzirisa SiC wafer kunosangana nematambudziko akawanda:

Kuyera mawafer kwakakosha kuti pave nekuwedzera kwesimba remachipisi pachikamu chimwe nechimwe, kuderedza kurasikirwa kwemupendero, uye kuderedza mari yekugadzira—kunyanya tichifunga nezvekuwanda kwezvinodiwa mukushandiswa kwemotokari dzemagetsi.

Kunyange hazvo kukura kwemakristaro eSiC single 8-inch kwakakura, maitiro ekumashure akadai sekukuya nekupukuta achiri kusangana nematambudziko, zvichikonzera goho shoma (40-50%).

Mawafer makuru anosangana nekuparadzirwa kwakaomarara kwekumanikidzwa, zvichiwedzera kuoma kwekugadzirisa kushushikana kwekukwesha uye kugona kwayo kugadzikana.

Kunyangwe ukobvu hwemawafer ane 8-inch huri kusvika pahukobvu hwemawafer ane 6-inch, anowanzo kuvadzwa panguva yekubata nekuda kwekumanikidzwa uye kupetana.

Kuderedza kushushikana, kupwanyika, uye kutsemuka kunokonzerwa nekucheka, kucheka nelaser kuri kushandiswa zvakanyanya. Zvisinei:

Malaser ane urefu hwemafungu marefu anokonzera kukuvara kwekupisa.

Malaser mapfupi-refu anogadzira marara akakura uye anodzikamisa kukuvara, zvichiita kuti kupenya kuve kwakaoma.

Kufamba Kwekugadzira Michina yeSiC

Kuyerera kwemaitiro ese kunosanganisira:

Kucheka kwekutarisa

Kukuya kwakaomarara

Kukuya zvakanaka

Kupukuta kwemuchina

Kupukuta Kwemakemikari (CMP) sedanho rekupedzisira

Kusarudzwa kwenzira yeCMP, dhizaini yenzira yekushanda, uye kugadzirisa maparamita zvakakosha. Mukugadzira semiconductor, CMP ndiyo danho rekutanga rekugadzira maSiC wafers ane nzvimbo dzakapfava, dzisina kuremara, uye dzisina kukuvara, izvo zvakakosha pakukura kwe epitaxial yemhando yepamusoro.

(a) Bvisa ingot yeSiC kubva pamoto unopfuta;

(b) Ita kuumba kwekutanga uchishandisa kukuya kwedhayamita rekunze;

(c) Sarudza kuti kristaro iri papi uchishandisa ma "alignment flats" kana kuti "notches";

(d) Cheka ingot kuita mawafer matete uchishandisa kucheka netambo dzakawanda;

(e) Kusvika pakutsvedzerera kwenzvimbo segirazi kuburikidza nekukuya nekupukuta.

Mushure mekupedza matanho ekugadzirisa, mupendero wekunze weSiC wafer unowanzova wakapinza, izvo zvinowedzera njodzi yekupwanyika panguva yekubata kana kushandisa. Kuti usanyanya kuomarara, kukuya mupendero kunodiwa.

Kuwedzera kune maitiro ekucheka echinyakare, nzira itsva yekugadzira mawafer eSiC inosanganisira tekinoroji yekubatanidza. Nzira iyi inogonesa kugadzirwa kwewafer nekubatanidza jira rakatetepa reSiC rimwe chete kune substrate yakasiyana (substrate inotsigira).

Mufananidzo 3 unoratidza kuyerera kwemaitiro:

Kutanga, chidimbu chekubvisa jira chinoumbwa pakadzika kwakatarwa pamusoro peSiC single crystal kuburikidza nehydrogen ion implantation kana matekiniki akafanana. SiC single crystal inogadziriswa inozobatanidzwa kune imwe substrate yakatsetseka uye inomanikidzwa nekupisa. Izvi zvinobvumira kutamiswa nekuparadzaniswa kweSiC single-crystal layer kuenda kune imwe substrate inotsigira.

Rutivi rweSiC rwakaparadzaniswa runogadziriswa pamusoro kuti ruve rwakatsetseka uye runogona kushandiswazve mumatanho anotevera ekubatanidza. Zvichienzaniswa nekucheka kwekare makristaro eSiC, nzira iyi inoderedza kudiwa kwezvinhu zvinodhura. Kunyangwe matambudziko ehunyanzvi achiripo, kutsvagisa nekuvandudza kuri kufambira mberi nesimba kuti zvigoneke kugadzira wafer inodhura zvishoma.

Zvichienderana nekuomarara kwakanyanya uye kugadzikana kwemakemikari kweSiC—izvo zvinoita kuti isakwanise kubatwa nekuchinja kwemamiriro ekunze patembiricha yemumba—kupukuta kwemechanical kunodiwa kubvisa makomba ekukuya, kuderedza kukuvara kwenzvimbo, kubvisa kukwenya, makomba, uye zvikanganiso zvemaganda eorenji, kuderedza kuomarara kwenzvimbo, kunatsiridza kutsvedza, uye kuwedzera kunaka kwenzvimbo.

Kuti nzvimbo yacho ive yakashongedzwa zvakanaka, zvinodikanwa kuti:

Gadzirisa mhando dzeabrasive,

Deredza saizi yezvikamu,

Gadzirisa ma parameter ekuita,

Sarudza zvinhu zvekupukuta nemapedhi ane kuoma kwakaringana.

Mufananidzo 7 unoratidza kuti kupukuta kwemativi maviri ne1 μm abrasives kunogona kudzora kusiyana kwehutete uye ukobvu mukati me10 μm, uye kuderedza kuomarara kwenzvimbo kusvika pa0.25 nm.

3.2 Kupukuta Kwemakemikari (CMP)

Kupukuta Kwemakemikari (CMP) kunobatanidza kukwesha kwezvidimbu zvakapfava zvakanyanya nekukwesha kwemakemikari kuti pave nechinhu chakatsetseka, chakatsetseka pane zviri kugadziriswa. Musimboti wekutanga ndewekuti:

Kusangana kwemakemikari kunoitika pakati pesuru inoporishwa nepamusoro pewafer, zvichiita kuti pave nechikamu chakapfava.

Kukweshana pakati pezvinhu zvinokwesha nechikamu chakapfava kunobvisa zvinhu zvacho.

Zvakanakira CMP:

Inokunda matambudziko ekugadzirisa zvinhu nemakemikari chete,

Inoita kuti kurongwa kwepasi rose uye kwemunharaunda kuvepo,

Inogadzira nzvimbo dzakati sandara uye dzisina kuomarara,

Hazvisiyi kukuvara pamusoro kana pasi pevhu.

Zvizere:

Wafer inofamba ichienzaniswa nepedhi rekupukuta kana yamanikidzwa.

Zvishandiso zveNanometer-scale abrasives (semuenzaniso, SiO₂) zviri muslurry zvinobatsira mukuchekerera, kuderedza simba reSi–C covalent bonds uye kuwedzera kubviswa kwezvinhu.

Mhando dzeMatekiniki eCMP:

Kukwesha Kwemahara Kwekukwesha: Kukwesha (semuenzaniso, SiO₂) kunosungirirwa mutsvina. Kubviswa kwezvinhu kunoitika kuburikidza nekukweshana kwemuviri mitatu (wafer–pad–abrasive). Saizi yekukwesha (kazhinji 60–200 nm), pH, uye tembiricha zvinofanirwa kudzorwa nemazvo kuti zvive nani.

Kupukuta Kwakagadziriswa: Mabhurasiti anoiswa mupurasitiki yekupukuta kudzivirira kusangana—akanakira kugadziriswa nemazvo.

Kuchenesa Mushure mekupukuta:

Mawafer akapukutwa anoongororwa:

Kuchenesa makemikari (kusanganisira kubvisa mvura yeDI nemvura yakasanganiswa netsvina),

Kusukurudza nemvura yeDI, uye

Kuomesa nitrogen inopisa

kuderedza kusvibiswa pamusoro.

Hunhu hwepamusoro & Mashandiro

Kuomarara kwepamusoro kunogona kuderedzwa kusvika paRa < 0.3 nm, zvichizadzisa zvinodiwa ne semiconductor epitaxy.

Kurongwa Kwepasi Pose: Kusanganiswa kwekunyorovesa makemikari nekubvisa michina kunoderedza kukwenya uye kusarongeka, zvichiita kuti nzira dzekugadzira kana dzemakemikari dzishande zvakanaka.

Kushanda Nesimba Kwazvo: Yakakodzera zvinhu zvakaoma uye zvinoputsika senge SiC, ine mwero wekubvisa zvinhu uri pamusoro pe200 nm/h.

Dzimwe Nzira Dzekugadzira Magirazi Dziri Kubudirira

Pamusoro peCMP, dzimwe nzira dzakakurudzirwa, dzinosanganisira:

Kupukuta kwemagetsi, kupukuta kana kuchekwa kweCatalyst, uye

Kupukuta kwemakemikari matatu.

Zvisinei, nzira idzi dzichiri muchikamu chekutsvagisa uye dzakakura zvishoma nezvishoma nekuda kwehunhu hwakaoma hweSiC hwezvinhu.

Pakupedzisira, kugadzirisa SiC inzira yekuderedza kupwanyika nekuomarara zvishoma nezvishoma kuti pave nerunako rwepamusoro, uko kugadzikana nekudzikama kwakakosha muchikamu chimwe nechimwe.

Tekinoroji Yekugadzirisa

Munguva yekukuya wafer, dhaimani ine saizi dzakasiyana dzezvimedu inoshandiswa kukuya wafer kusvika yakatwasuka uye yaomarara inodiwa. Izvi zvinoteverwa nekupukuta, uchishandisa nzira dzekugadzira mechanical uye chemical mechanical polishing (CMP) kugadzira wafers dzisina kukuvara dzesilicon carbide (SiC).

Mushure mekupolisha, mawafer eSiC anoongororwa zvakanyanya nekushandisa michina yakaita semaoptical microscopes uye maX-ray diffractometers kuona kuti zvese zvehunyanzvi zvinosangana nezvinodiwa. Pakupedzisira, mawafer akapolisha anocheneswa uchishandisa makemikari ekuchenesa akasarudzika uye mvura yakachena kwazvo kubvisa tsvina pamusoro. Anozoomeswa uchishandisa nitrogen gas uye spin dryers, zvichipedzisa maitiro ese ekugadzira.

Mushure memakore ekushanda nesimba, kufambira mberi kukuru kwakaitwa mukugadzira SiC single crystal muChina. Munyika, makristaro e100 mm akaputirwa semi-insulating 4H-SiC single crystals akagadzirwa zvinobudirira, uye makristaro emhando yen-type 4H-SiC ne6H-SiC single crystals anogona kugadzirwa ari mumapoka. Makambani akaita seTankeBlue neTYST atogadzira makristaro e150 mm SiC single crystals.

Panyaya ye tekinoroji yekugadzira wafer yeSiC, masangano emuno akatanga kuongorora mamiriro ekushanda uye nzira dzekucheka, kukuya, uye kupukuta kristalo. Anokwanisa kugadzira sampuro dzinoenderana nezvinodiwa pakugadzira michina. Zvisinei, kana tichienzanisa nezvinodiwa zvepasi rose, mhando yekugadzirwa kwewafer yemuno ichiri kumashure zvakanyanya. Pane matambudziko akati wandei:

Dzidziso dzepasi rose dzeSiC uye matekinoroji ekugadzirisa zvakachengetedzwa zvakasimba uye hazvisi nyore kuwana.

Hapana kutsvagurudza kwedzidziso uye rutsigiro rwekuvandudza nekugadzirisa maitiro.

Mutengo wekutenga michina yekunze nezvinhu zvayo wakakwira.

Tsvagiridzo yemuno pamusoro pekugadzirwa kwemidziyo, kunyatsogadzirwa kwayo, uye zvinhu zvichiri kuratidza misiyano yakakura kana tichienzanisa nemazinga epasi rose.

Parizvino, michina yakawanda inoshandiswa nemazvo muChina inotengwa kunze kwenyika. Midziyo yekuyedza uye nzira dzinodawo kuvandudzwa.

Nekuenderera mberi kwekugadzirwa kwema semiconductors echizvarwa chechitatu, dhayamita yeSiC single crystal substrates iri kuramba ichiwedzera, pamwe chete nezvinodiwa zvepamusoro zvemhando yepamusoro yekugadzirisa pamusoro. Tekinoroji yekugadzirisa wafer yave imwe yematanho akaoma zvikuru mushure mekukura kweSiC single crystal.

Kuti tigadzirise matambudziko aripo pakugadzirisa, zvakakosha kuti tidzidze nzira dzekucheka, kukuya, nekupukuta, uye kutsvaga nzira dzakakodzera dzekugadzira SiC wafer. Panguva imwe chete, zvakakosha kudzidza kubva kumatekinoroji epamusoro ekugadzira epasi rose uye kushandisa matekiniki epamusoro-soro ekugadzira michina nemidziyo yekugadzira zvinhu zvemhando yepamusoro.

Sezvo saizi yewafer ichiwedzera, kuoma kwekukura kwekristaro uye kugadzirwa kwayo kunowedzerawo. Zvisinei, kushanda zvakanaka kwekugadzira kwemidziyo iri pasi pemvura kuri kuwedzera zvakanyanya, uye mutengo weyuniti unodzikira. Parizvino, vatengesi vakuru veSiC wafer pasi rose vanopa zvigadzirwa zvinobvira pamainchi mana kusvika pamainchi matanhatu mudhayamita. Makambani anotungamira akadai seCree neII-VI atotanga kuronga kugadzirwa kwemitsetse yekugadzira wafer yeSiC yeinchi masere.