Mubvunzo: Ndedzipi matekinoroji makuru anoshandiswa mukucheka nekugadzira SiC wafer?
A:Silicon carbide (SiC) ine kuomarara kuri pasi pedhaimani uye inoonekwa sechinhu chakaoma zvikuru uye chisina kusimba. Maitiro ekucheka, ayo anosanganisira kucheka makristaro akakura kuita mawafer matete, anotora nguva uye anowanzo pwanyika. Sedanho rekutanga muSiCKugadzirwa kwekristaro imwe chete, kunaka kwekucheka kunokanganisa zvakanyanya kukuya, kupukuta, uye kutetepa kunotevera. Kucheka kunowanzounza kuputika kwepamusoro nepasi pevhu, zvichiwedzera mwero wekuputsika kwewafer uye mitengo yekugadzira. Naizvozvo, kudzora kukuvara kwekuputika kwepamusoro panguva yekucheka kwakakosha pakusimudzira kugadzirwa kwemidziyo yeSiC.
Nzira dzekucheka SiC dziri kutaurwa parizvino dzinosanganisira kucheka nemaoko zvisina kuvharika, kucheka nemaoko zvisina kuvharika, kucheka nelaser, kucheka nelayer (kupatsanurana nechando), uye kucheka nemagetsi. Pakati peizvi, kucheka nemaoko akawanda uchishandisa madhaimani asina kuvharika ndiyo nzira inonyanya kushandiswa pakugadzira makristaro eSiC. Zvisinei, sezvo saizi dzema ingot dzichisvika masendimita masere zvichikwira, kucheka netambo dzechinyakare kunenge kusisina kushanda nekuda kwezvinodiwa nemidziyo yakawanda, mitengo, uye kushanda zvakanaka. Pane kudiwa kukuru kwehunyanzvi hwekucheka nemaoko husingadhuri, husina kurasikirwa zvakanyanya, uye hunoshanda zvakanyanya.
Mubvunzo: Ndezvipi zvakanakira kucheka nelaser pane kucheka netambo dzakawanda?
A: Kucheka waya kwechinyakare kunochekaSiC ingotZvidimbu zvinozogayiwa uchishandisa dhaimani kubvisa mavanga ekucheka uye kukuvara kuri pasi pevhu, zvichiteverwa ne chemical mechanical polishing (CMP) kuti pave ne global planarization, uye pakupedzisira zvinocheneswa kuti pave nemaSiC wafers.
Zvisinei, nekuda kwekuomarara uye kuputsika kweSiC, matanho aya anogona kukonzera kupetana, kutsemuka, kuwedzera kwehuwandu hwekupwanyika, mitengo yepamusoro yekugadzira, uye zvichikonzera kukweshana kwepamusoro uye kusvibiswa (guruva, mvura yakasviba, nezvimwewo). Pamusoro pezvo, kucheka waya kunononoka uye kune goho shoma. Zvinofungidzirwa zvinoratidza kuti kucheka waya dzakawanda kwechinyakare kunongowana 50% chete yekushandiswa kwezvinhu, uye kusvika 75% yezvinhu zvinorasika mushure mekukwesha nekukuya. Ruzivo rwekutanga rwekugadzira kunze kwenyika rwakaratidza kuti zvinogona kutora mazuva angangoita 273 ekugadzirwa kwemaawa makumi maviri nemana nguva dzose kugadzira mawafer zviuru gumi - anotora nguva yakawanda.
Munyika, makambani mazhinji eSiC crystal growth anotarisa pakuwedzera kugona kwechoto. Zvisinei, pane kungowedzera zvinobuda, zvakakosha kufunga nezvenzira yekuderedza kurasikirwa—kunyanya kana goho rekukura kwekristaro risati ranyatsonaka.
Midziyo yekucheka nelaser inogona kuderedza zvakanyanya kurasikirwa nezvinhu uye kuwedzera goho. Semuenzaniso, kushandisa imwe chete ye20 mmSiC ingot: Kucheka waya kunogona kubereka mawafers angangoita makumi matatu ane ukobvu hwe350 μm. Kucheka nelaser kunogona kubereka mawafers anopfuura makumi mashanu. Kana ukobvu hwewafer hwakaderedzwa kusvika 200 μm, mawafers anopfuura makumi masere anogona kugadzirwa kubva mungot imwechete. Kunyange zvazvo kucheka waya kuchishandiswa zvakanyanya kumawafers madiki masendimita matanhatu, kucheka ingot yeSiC ye8-inch kunogona kutora mazuva gumi kusvika gumi nemashanu nenzira dzechinyakare, zvinoda michina yepamusoro uye zvichidhura zvishoma. Pasi pemamiriro ezvinhu aya, mabhenefiti ekucheka nelaser anova pachena, zvichiita kuti ive tekinoroji huru yeramangwana yemawafers e8-inch.
Nekucheka nelaser, nguva yekucheka pawafer imwe neimwe ine 8-inch inogona kunge iri pasi pemaminitsi makumi maviri, uye kurasikirwa kwezvinhu pawafer imwe neimwe kuri pasi pe60 μm.
Muchidimbu, zvichienzaniswa nekucheka netambo dzakawanda, kucheka nelaser kunoita kuti zvinhu zvikurumidze, goho riri nani, kurasikirwa nezvinhu zvishoma, uye kugadziriswa kwakachena.
Mubvunzo: Ndeapi matambudziko makuru ehunyanzvi mukucheka kweSiC laser?
A: Maitiro ekucheka nelaser anosanganisira matanho maviri makuru: kugadzirisa nelaser uye kupatsanurwa kwewafer.
Chinhu chikuru chekugadzirisa laser ndechekugadzira beam uye kugadzirisa ma parameter. Zvinhu zvakaita se laser power, spot diameter, uye scan speed zvese zvinokanganisa kunaka kwekubvisa zvinhu uye kubudirira kwekupatsanurwa kwe wafer kunotevera. Geometry yenzvimbo yakagadziriswa inosarudza kuomarara kwenzvimbo uye kuoma kwekupatsanurwa. Kuomarara kwepamusoro kunoomesa kukuya kwenzvimbo gare gare uye kunowedzera kurasikirwa kwezvinhu.
Mushure mekugadzirisa, kupatsanurwa kwewafer kunowanzoitwa kuburikidza nekuchekwa kwesimbi, senge kupwanyika kwechando kana kumanikidzwa kwemagetsi. Mamwe masisitimu epamba anoshandisa ma ultrasound transducers kuti aite kuti simbi dziparare, asi izvi zvinogona kukonzera kupwanyika uye zvikanganiso zvemucheto, zvichideredza goho rekupedzisira.
Kunyange zvazvo matanho maviri aya asina kuoma, kusawirirana mumhando yekristaro—nekuda kwemaitiro akasiyana ekukura, huwandu hwedoping, uye kugoverwa kwekushushikana mukati—kunokanganisa zvakanyanya kuoma kwekucheka, goho, uye kurasikirwa kwezvinhu. Kungoziva nzvimbo dzine dambudziko nekugadzirisa nzvimbo dze laser scanning kunogona kusavandudza mhedzisiro zvakanyanya.
Chinhu chikuru chekushandiswa kwakawanda chiri mukugadzira nzira itsva nemidziyo inogona kuenderana nemhando dzakasiyana dzekristaro kubva kuvagadziri vakasiyana-siyana, kugadzirisa ma process parameters, uye kuvaka laser slicing systems ine simba rekushandisa pasi rose.
Mubvunzo: Ko tekinoroji yekucheka nelaser inogona kushandiswa kune zvimwe zvinhu zve semiconductor kunze kweSiC here?
A: Tekinoroji yekucheka neLaser yagara ichishandiswa pazvinhu zvakasiyana-siyana. Muma semiconductors, pakutanga yaishandiswa pakucheka wafer uye kubvira ipapo yakawedzera kusvika pakucheka makristaro makuru.
Kunze kweSiC, laser slicing inogona kushandiswawo kune zvimwe zvinhu zvakaoma kana zvinoputsika zvakaita sedhaimani, gallium nitride (GaN), uye gallium oxide (Ga₂O₃). Zvidzidzo zvekutanga pazvinhu izvi zvakaratidza kuti laser slicing inoshanda uye zvakanakira mashandisirwo e semiconductor.
Mubvunzo: Pari zvino kune zvigadzirwa zvemidziyo yekucheka laser yemumba yakura here? Tsvagiridzo yako iri padanho ripi?
A: Midziyo mikuru yekucheka SiC laser inoonekwa semichina mikuru yeramangwana rekugadzira wafer yeSiC ye 8-inch. Parizvino, Japan chete ndiyo inogona kupa masisitimu akadaro, uye anodhura uye anotongwa nemirau yekutengesera kunze kwenyika.
Kudiwa kwemuno kwe laser slicing/thinning systems kunofungidzirwa kuti kuri panosvika chiuru chimwe chete, zvichibva pazvirongwa zvekugadzira SiC uye kugona kwe wire saw kuripo. Makambani makuru emuno akaisa mari yakawanda mukuvandudza, asi hapana michina yemuno yakakura uye inotengeswa yasvika pakushandiswa mumaindasitiri.
Mapoka ekutsvagisa anga achigadzira tekinoroji ye laser lift-off kubva muna 2001 uye ikozvino akawedzera izvi kusvika pakuchekwa nekucheka nekucheka kweSiC laser ine dhayamita hombe. Vakagadzira sisitimu yemuenzaniso uye maitiro ekucheka anokwanisa: Kucheka nekucheka SiC wafers dzine 4-6 inch semi-insulating Kucheka 6-8 inch conductive SiC ingots Zviyero zvekushanda: 6-8 inch semi-insulating SiC: nguva yekucheka 10-15 maminetsi/wafer; kurasikirwa kwezvinhu <30 μm6-8 inch conductive SiC: nguva yekucheka 14-20 maminetsi/wafer; kurasikirwa kwezvinhu <60 μm
Goho rinofungidzirwa rewafer rakawedzera neanopfuura 50%
Mushure mekuchekwa, mawafer anosangana nezvinodiwa zvenyika zve geometry mushure mekukuyiwa nekukweshwa. Zvidzidzo zvinoratidzawo kuti mhedzisiro yekupisa inokonzerwa ne laser haikanganisi zvakanyanya kushushikana kana geometry mumawafer.
Midziyo imwecheteyo yakashandiswawo kuona kuti dhaimani, GaN, uye Ga₂O₃ makristaro madiki anogona kuchekwa here.
Nguva yekutumira: Chivabvu-23-2025