Muna 1965, Intel co-muvambi Gordon Moore akataura izvo zvakava "Mutemo waMoore." Kweanopfuura hafu yezana ramakore yakatsigira budiriro yakatsiga mukuita kwakabatanidzwa-dunhu (IC) uye kuderera kwemitengo-hwaro hwemazuva ano tekinoroji yedhijitari. Muchidimbu: nhamba ye transistors pane chip inopeta kaviri makore maviri ega ega.
Kwemakore, kufambira mberi kwaitevera cadence iyoyo. Iye zvino mufananidzo uri kuchinja. Kuwedzera kuderera kwave kwakaoma; saizi yemaficha inodzika kusvika kuma nanometer mashoma. Mainjiniya ari kumhanyisa mumiganho yemuviri, matanho akaomarara ekuita, uye kukwira kwemitengo. Madiki madiki ejometri zvakare anodzvinyirira goho, zvichiita kuti kugadzirwa kwemhando yepamusoro kuome. Kuvaka uye kushanda jira rinotungamira kunoda mari yakakura uye hunyanzvi. Saka vazhinji vanopokana Mutemo waMoore uri kurasikirwa nemhepo.
Iyo shanduko yakavhura musuwo kune nzira nyowani: chipsets.
Chiplet idiki diki rinoita basa chairo-chaizvoizvo chidimbu cheyaimbove imwe monolithic chip. Nekubatanidza machiplets akawanda mupakeji imwe chete, vagadziri vanogona kuunganidza yakazara system.
Munguva yemonolithic, mabasa ese aigara pane imwe hombe kufa, saka chirema chero kupi chaigona kubvisa chip yese. Ne machiplets, masisitimu anovakwa kubva ku "inozivikanwa-yakanaka kufa" (KGD), zvinoshamisa kuvandudza goho nekugadzira mashandiro.
Kubatanidzwa kwakasiyana-siyana-kusanganisa kufa kwakavakirwa pane akasiyana maitiro node uye nemabasa akasiyana-kunoita kuti machiplets ave nesimba. High-performance compute blocks inogona kushandisa manode achangoburwa, nepo ndangariro uye analog maseketi anogara pane akakura, anodhura-inoshanda matekinoroji. Chigumisiro: kushanda kwepamusoro pamutengo wakaderera.
Indasitiri yemotokari inonyanya kufarira. Vagadziri vemagetsi makuru vari kushandisa nzira idzi kugadzira ramangwana mumotokari SoCs, nekutorwa kwevanhu vakawanda kunonangwa mushure me2030. Chiplets inovabvumira kuyera AI uye magirafu zvakanyatsoita apo vachivandudza goho-kukurudzira zvose kushanda uye kushanda mumotokari semiconductors.
Zvimwe zvikamu zvemotokari zvinofanirwa kugutsa zvakaomesesa kushanda-chengetedzo zviyero uye nekudaro vanovimba nevakuru, vakapupurirwa node. Zvichakadaro, masisitimu echizvino-zvino akadai seyepamusoro mutyairi-rubatsiro (ADAS) uye software-inotsanangurwa mota (SDVs) inoda yakawanda compute. Chiplets bhiriji iro gap: nekubatanidza kuchengetedza-kirasi mamicrocontrollers, ndangariro hombe, uye ane simba AI accelerators, vagadziri vanogona kugadzirisa maSoCs kune yega yega automaker zvinodiwa - nekukurumidza.
Aya mabhenefiti anowedzera kupfuura mota. Chiplet zvivakwa zviri kupararira muAI, telecom, uye mamwe madomasi, ichimhanyisa hunyanzvi mumaindasitiri uye nekukurumidza kuita mbiru yesemiconductor roadmap.
Chiplet kubatanidzwa kunoenderana compact, high-speed die-to-die connections. Iyo kiyi inogonesa ndeye interposer-yepakati layer, kazhinji silicon, pasi pemafaro ayo anoisa masaini senge diki redunhu bhodhi. Zvirinani interposer zvinoreva kubatana kwakasimba uye nekukurumidza masaini kuchinjanisa.
Advanced packaging zvakare inovandudza kuendesa simba. Dense arrays ediki simbi yekubatanidza pakati pemafa inopa nzira dzakakwana dzeazvino uye data kunyangwe munzvimbo dzakamanikana, ichigonesa yakakwirira-bandwidth kufambisa uku uchinyatso shandisa yakaderera pasuru nzvimbo.
Nzira yemazuva ano ndeye 2.5D yekubatanidza: kuisa akawanda anofa padivi-ne-parutivi pane interposer. Iyo inotevera kusvetuka ndeye 3D yekubatanidza, iyo mirwi inofa yakatwasuka ichishandisa kuburikidza nesilicon vias (TSVs) kune yakanyanya density.
Kubatanidza modular chip dhizaini (kuparadzanisa mabasa uye edunhu marudzi) ne3D stacking inobereka nekukurumidza, diki, yakawanda-inoshanda simba semiconductors. Co-locating memory uye compute inopa yakakura bandwidth kune makuru datasets-yakanakira AI uye mamwe mabasa epamusoro-basa.
Vertical stacking, zvisinei, inounza matambudziko. Kupisa kunowedzera zviri nyore, zvichikanganisa kutonga kwekupisa uye goho. Kuti zvigadzirise izvi, vaongorori vari kufambisa nzira nyowani dzekurongedza kuti vabate zvirinani zvipingaidzo zvekupisa. Kunyange zvakadaro, kukurumidza kwakasimba: kusanganiswa kwechiplets uye 3D kubatanidzwa kunoonekwa zvakanyanya separadigm inovhiringidza-yagadzirira kutakura mwenje uko Mutemo waMoore unosiya.
Nguva yekutumira: Oct-15-2025