Multi-Wire Diamond Sawing Machine yeSiC Sapphire Ultra-Hard Brittle Materials
Nhanganyaya kune Multi-Waya Diamond Sawing Machine
Iyo yakawanda-waya madhaimani sawing muchina inyika-ye-the-art slicing system yakagadzirirwa kugadzirisa zvakanyanya kuoma uye brittle zvinhu. Nekuisa waya dzakawanda dzakafanana-dzakavharwa nedhaimani, muchina uyu unogona panguva imwe chete kucheka mawaferi akawanda mukutenderera kumwe chete, uchiwana zvese zvakakwirira uye nemazvo. Iyi tekinoroji yave chishandiso chakakosha mumaindasitiri akadai semiconductors, solar photovoltaics, LEDs, uye advanced ceramics, kunyanya kune zvinhu zvakaita seSiC, safiro, GaN, quartz, uye alumina.
Kuenzaniswa neyakajairwa imwe-waya yekucheka, iyo yakawanda-waya gadziriso inoburitsa gumi nemaviri kumazana ezvimedu pabatch, ichideredza zvakanyanya kutenderera nguva ichichengeta yakanakisa flatness (Ra <0.5 μm) uye dimensional chaiyo (± 0.02 mm). Yayo modular dhizaini inosanganisa otomatiki waya tensioning, workpiece inobata masisitimu, uye yekutarisa pamhepo, kuve nechokwadi chenguva refu, yakagadzikana, uye yakazara otomatiki kugadzirwa.
Unyanzvi Parameters yeMulti-Waya Diamond Sawing Machine
| Item | Tsanangudzo | Item | Tsanangudzo |
|---|---|---|---|
| Saizi yepamusoro yebasa (Square) | 220 × 200 × 350 mm | Dhiraivha mota | 17.8 kW × 2 |
| Saizi yepamusoro yebasa (Round) | Φ205 × 350 mm | Wire drive mota | 11.86 kW × 2 |
| Spindle spacing | Φ250 ±10 × 370 × 2 akiso (mm) | Worktable kusimudza mota | 2.42 kW × 1 |
| Principal axis | 650 mm | Swing mota | 0.8 kW × 1 |
| Kumhanya kwewaya | 1500 m/min | Gadziriro injini | 0.45 kW × 2 |
| Waya dhayamita | Φ0.12–0.25 mm | Tension mota | 4.15 kW × 2 |
| Simudza kumhanya | 225 mm/min | Slurry mota | 7.5 kW × 1 |
| Max. kutenderera kwetafura | ±12° | Slurry tank capacity | 300 L |
| Swing angle | ±3° | Kuyerera kunotonhorera | 200 L/min |
| Swing frequency | ~30 nguva/min | Temp. kururama | ±2 °C |
| Feed rate | 0.01–9.99 mm/min | Magetsi | 335+210 (mm²) |
| Wire feed rate | 0.01–300 mm/min | Air compressed | 0.4–0.6 MPa |
| Saizi yemuchina | 3550 × 2200 × 3000 mm | Kurema | 13,500 kg |
Kushanda Mechanism yeMulti-Wire Diamond Sawing Machine
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Multi-Waya Kucheka Motion
Waya dzedhaimani dzakawanda dzinofamba nekumhanyisa kumhanya kusvika ku1500 m/min. Precision-inotungamirirwa pulleys uye yakavharwa-loop tension control (15-130 N) inochengetedza waya dzakagadzikana, kuderedza mukana wekutsauka kana kuputsika. -
Kwakarurama Kudyisa & Positioning
Servo-inotyairwa chinzvimbo inowana ± 0.005 mm chokwadi. Optional laser kana kuona-kubatsirwa kurongeka kunosimudzira mhedzisiro yezvimiro zvakaoma. -
Kutonhodza uye Kubvisa Marara
High-pressure coolant inoramba ichibvisa machipisi uye inotonhodza nzvimbo yebasa, kudzivirira kukuvara kwemafuta. Multi-stage filtration inowedzera hupenyu hunotonhorera uye inoderedza nguva yekudzikira. -
Smart Control Platform
High-response servo drivers (<1 ms) zvine simba gadzirisa chikafu, kunetsa, uye kumhanya kwewaya. Yakabatanidzwa resipi manejimendi uye tinya-kamwe parameter switching streamline misa kugadzirwa.
Core Benefits yeMulti-Waya Diamond Sawing Machine
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Kubudirira Kwepamusoro
Inokwanisa kucheka 50-200 wafers per run, ine kerf kurasikirwa <100 μm, kuvandudza kushandiswa kwezvinhu kusvika ku40%. Kuburikidza ndeye 5-10 × iyo yechinyakare-waya masisitimu. -
Precision Control
Waya tension kugadzikana mukati me ± 0.5 N inova nechokwadi chemibairo inowirirana pazvinhu zvakasiyana brittle. Chaiyo-nguva yekutarisa pane gumi ″ HMI interface inotsigira resipi kuchengetedza uye kushanda kure. -
Flexible, Modular Build
Inoenderana newaya madhayamita kubva 0.12-0.45 mm kune akasiyana maitiro ekucheka. Optional robhoti kubata inobvumira zvizere otomatiki mitsara yekugadzira. -
Industrial-Giredhi Kuvimbika
Heavy-duty cast/forged mafuremu anoderedza deformation (<0.01 mm). Nhungamiro pulleys ane ceramic kana carbide coatings inopa anopfuura 8000 maawa ehupenyu hwesevhisi.
Minda Yekushandisa yeMulti-Waya Diamond Sawing Machine
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Semiconductors: Kucheka SiC yeEV simba modules, GaN substrates ye5G zvishandiso.
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Photovoltaics: High-speed silicon wafer slicing ine ± 10 μm kufanana.
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LED & Optics: Sapphire substrates ye epitaxy uye chaiyo optical elements ine <20 μm edge chipping.
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Advanced Ceramics: Kugadziriswa kwealumina, AlN, uye zvimwe zvakafanana zveaerospace uye zvinopisa manejimendi zvikamu.
FAQ - Multi-Wire Diamond Sawing Machine
Q1: Ndeapi mabhenefiti e-multi-waya sawing kana ichienzaniswa ne-single-waya michina?
A: Multi-waya masisitimu anogona kucheka gumi nemazana kusvika kumazana emawafer panguva imwe chete, achiwedzera kushanda zvakanaka ne5-10 ×. Kushandiswa kwezvinhu kwakakwira zvakare nekurasikirwa kwekerf pazasi pe100 μm, zvichiita kuti ive yakanakira kugadzirwa kwehuwandu.
Q2: Ndeapi marudzi ezvigadzirwa zvinogona kugadziriswa?
A: Muchina uyu wakagadzirirwa zvinhu zvakaoma uye zvinoputika, zvinosanganisira silicon carbide (SiC), safiro, gallium nitride (GaN), quartz, alumina (Al₂O₃), uye aluminium nitride (AlN).
Q3: Ndeipi iyo inogoneka chaiyo uye yemhando yepamusoro?
A: Kushata kwepamusoro kunogona kusvika kuRa <0.5 μm, nechiyero che ± 0.02 mm. Edge chipping inogona kudzorwa kusvika <20 μm, kusangana semiconductor uye optoelectronic indasitiri zviyero.
Q4: Nzira yekucheka inokonzera kuputika kana kukanganisa here?
A: Iine yakanyanya-kudzvanya inotonhorera uye yakavharwa-loop tension control, njodzi yemadiki-kutsemuka uye kushungurudzika kukuvadzwa kunoderedzwa, kuve nechokwadi chakanakisa wafer kutendeseka.
