LNOI Wafer (Lithium Niobate pane Insulator) Telecommunications Sensing High Electro-Optic
Detailed Diagram
Overview
Mukati mebhokisi rewafer mune symmetrical grooves, hukuru hwayo hwakanyatso yunifomu kutsigira mativi maviri ewafer. Iyo kristaro bhokisi rinowanzo gadzirwa ne translucent epurasitiki PP zvinhu izvo zvisingaenderane tembiricha, kupfeka uye static magetsi. Mavara akasiyana ezviwedzere anoshandiswa kusiyanisa simbi process zvikamu mu semiconductor kugadzirwa. Nekuda kweiyo diki kiyi saizi yemasemiconductors, dense mapatani, uye yakanyanya kuomarara particle size zvinodiwa mukugadzirwa, wafer bhokisi rinofanirwa kuvimbiswa nzvimbo yakachena yekubatanidza kune microenvironment box reaction cavity yemichina yekugadzira yakasiyana.
Fabrication Methodology
Kugadzirwa kweLNOI wafers kune akati wandei matanho chaiwo:
Danho 1: Kuiswa kweHelium IonHelium ions inounzwa mune yakawanda LN crystal ichishandisa ion implanter. Aya maion anogara pakadzika chaiwo, achigadzira ndege isina simba iyo inozopedzisira yagonesa kupatsanurwa kwemafirimu.
Danho 2: Base Substrate KuumbwaSilicon yakaparadzana kana LN wafer yakashongedzwa kana kuiswa neSiO2 uchishandisa PECVD kana thermal oxidation. Nzvimbo yayo yepamusoro yakarongedzerwa kuti iite bonding yakakwana.
Nhanho 3: Kubatana kweLN kune SubstrateIyo ion-yakasimwa LN crystal inopepetwa uye yakanamatira kune base wafer uchishandisa yakananga wafer bonding. Muzvirongwa zvekutsvagisa, benzocyclobutene (BCB) inogona kushandiswa seanonamira kurerutsa kubatana pasi pemamiriro asina kuomesesa.
Nhanho 4: Kurapa Kwekupisa uye Kuparadzaniswa kweFirimuAnnealing inomutsa kuumbwa kwebubble pakadzika kwakasimwa, zvichiita kuti kupatsanurwa kwefirimu rakatetepa (yepamusoro LN layer) kubva muhuwandu. Mechanical force inoshandiswa kupedzisa exfoliation.
Nhanho 5: Kupenya kwepamusoroKemikari Mechanical Polishing (CMP) inoshandiswa kutsvedzerera pamusoro peLN pamusoro, kuvandudza optical mhando uye goho remudziyo.
Technical Parameters
| Material | Optical Giredhi LiNbO3 wafes (White or Nhema) | |
| Curie Temp | 1142±0.7℃ | |
| Kucheka Angle | X/Y/Z nezvimwe | |
| Diameter/saizi | 2"/3"/4" ±0.03mm | |
| Tol(±) | <0.20 mm ± 0.005mm | |
| Ukobvu | 0.18 ~ 0.5mm kana kupfuura | |
| Primary Flat | 16mm/22mm/32mm | |
| TTV | <3μm | |
| Bow | -30 | |
| Warp | <40μm | |
| Orientation Flat | Zvose zviripo | |
| Surface Type | Single Side Polished(SSP)/Double Sides Polished(DSP) | |
| Yakanatswa side Ra | <0.5nm | |
| S/D | 20/10 | |
| Edge Criteria | R=0.2mm C-mhando or Bullnose | |
| Hunhu | Free of kuputika (bubbles uye inclusions) | |
| Optical doped | Mg/Fe/Zn/MgO etc nokuti optical giredhi LN zvimedu pa requested | |
| Wafer Surface Criteria | Refractive index | No=2.2878/Ne=2.2033 @632nm wavelength/prism coupler method. |
| Kusvibiswa, | Hapana | |
| Zvimedu c>0.3μ m | <=30 | |
| Kukwenya, Chipping | Hapana | |
| Kuremara | Hapana kumucheto kutsemuka, kukwenya, masaw marks, mavara | |
| Packaging | Qty / Wafer bhokisi | 25pcs pabhokisi |
Shandisa Nyaya
Nekuda kwekusiyana-siyana uye kuita kwayo, LNOI inoshandiswa kune akawanda maindasitiri:
Photonics:Compact modulators, multiplexers, uye photonic circuits.
RF/Acoustics:Acousto-optic modulators, RF mafirita.
Quantum Computing:Nonlinear frequency mixers uye photon-pair jenareta.
Defense & Aerospace:Yakaderera-kurasikirwa optical gyros, frequency-shifting zvishandiso.
Midziyo yekurapa:Optical biosensors uye high-frequency signal probes.
FAQ
Mubvunzo: Sei LNOI ichidiwa pane SOI mumasisitimu emeso?
A:LNOI inoratidzira epamusoro electro-optic coefficients uye yakafara pachena siyana, ichigonesa kushanda kwepamusoro mumaseketi ephotonic.
Mubvunzo: CMP inosungirwa here mushure mekuparadzana?
A:Ehe. Iyo yakafumurwa yeLN nzvimbo ine hutsinye mushure mekuchekeresa ion uye inofanirwa kukwenenzverwa kuti isangane neyakajeka-giredhi zvakatemwa.
Mubvunzo: Ndeipi yakakura saizi yewafer inowanikwa?
A:Commercial LNOI wafers anonyanya kuita 3" uye 4", kunyange vamwe vatengesi vari kugadzira 6" akasiyana.
Mubvunzo: Iyo LN layer inogona kushandiswazve mushure mekupatsanurwa?
A:Iyo base crystal inogona kukwenenzverwa uye kushandiswazve kakawanda, kunyangwe mhando yacho inogona kudzikisira mushure mekutenderera kwakawanda.
Mubvunzo: Ko LNOI wafers inoenderana neCMOS kugadzirisa?
A:Ehe, dzakagadzirirwa kuenderana neyakajairwa semiconductor yekugadzira maitiro, kunyanya kana silicon substrates inoshandiswa.
