Midziyo yekucheka yeInfrared Picosecond Dual-Platform Laser yeOptical Glass/Quartz/Sapphire Processing

Tsananguro pfupi:

Pfupiso yehunyanzvi:
Sisitimu yekucheka yegirazi yeInfrared Picosecond Dual-Station Glass Laser Cutting System igadziriso yemhando yepamusoro yakagadzirwa zvakananga kuti igadzire zvinhu zvinopenya zvisina kusimba. Yakashongedzerwa ne1064nm infrared picosecond laser source (pulse width <15ps) uye dhizaini yepuratifomu ine chiteshi zviviri, iyi sisitimu inopa mashandiro akapetwa kaviri, ichigonesa magirazi ekuona asina matambudziko (semuenzaniso, BK7, fused silica), makristaro equartz, uye sapphire (α-Al₂O₃) ane kuomarara kusvika kuMohs 9.
Zvichienzaniswa ne nanosecond lasers dzakajairika kana nzira dzekucheka nemechanical, Infrared Picosecond Dual-Station Glass Laser Cutting System inowana upamhi hwe micron-level kerf (hunowanzo shandiswa: 20–50μm) kuburikidza ne "cold ablation" mechanism, ine nzvimbo inokanganiswa nekupisa inogumira ku <5μm. Iyo alternating dual-station operation mode inowedzera kushandiswa kwemidziyo ne70%, nepo proprietary vision alignment system (CCD positioning accuracy: ±2μm) inoita kuti ive yakanakira kugadzirwa kwe3D curved glass components (semuenzaniso, smartphone cover glass, smartwatch lenses) muindasitiri yemagetsi evatengi. Sisitimu iyi inosanganisira automated loading/unloading modules, inotsigira kugadzirwa kunoramba kuripo kwemaawa makumi maviri nemana pazuva, mazuva manomwe pasvondo.

Tumira email kwatiri

Zvinhu zvirimo

Paramita huru

Rudzi rweLaser	Picosecond yeInfrared
Saizi yePuratifomu	700×1200 (mm)
	900×1400 (mm)
Kucheka Ukobvu	0.03-80 (mm)
Kukurumidza Kucheka	0-1000 (mm/s)
Kuputsika Kwemucheto Wekucheka	<0.01 (mm)
Cherechedza: Saizi yepuratifomu inogona kugadziriswa.

Zvinhu Zvikuru

1. Tekinoroji yeLaser yeUltrafast:
· Mapundu mapfupi ePicosecond-level (10⁻¹²s) akasanganiswa netekinoroji yeMOPA tuning anosvika pakuwanda kwesimba >10¹² W/cm².
· Kureba kwechiedza cheinfrared (1064nm) kunopinda muzvinhu zvinoonekera kuburikidza nekunyudzwa kwemvura kusingaenderane nemutsara, zvichidzivirira kubviswa kwemvura pamusoro.
· Sisitimu ye optical ine mafocus akawanda inogadzira nzvimbo ina dzekugadzirisa dzakazvimirira panguva imwe chete.

2. Sisitimu yekubatanidza yeDual-Station:
· Matanho maviri emota ane giraidhi regranite (kunyatsorongeka kwenzvimbo: ± 1μm).
· Nguva yekuchinja chiteshi <0.8s, zvichigonesa mashandiro e "processing-loading/unloading" akafanana.
· Kudzora tembiricha kwakazvimirira (23±0.5°C) pachiteshi chimwe nechimwe kunoita kuti michina igare yakasimba kwenguva refu.

3. Kudzora Maitiro Ehungwaru:
· Dhatabhesi rezvinhu zvakabatanidzwa (200+ magirazi parameters) kuti pave nekufananidza maparameter otomatiki.
· Kutarisa plasma munguva chaiyo kunogadzirisa simba re laser (kugadzirisa: 0.1mJ).
· Kudzivirira maketeni emhepo kunoderedza kutsemuka kwemucheto (<3μm).
Muchiitiko chinowanzo shandiswa pakucheka wafer yesafire ine ukobvu hwe0.5mm, sisitimu iyi inocheka nekukurumidza kwe300mm/s ine saizi yekucheka <10μm, zvichireva kuvandudzwa kwekushanda zvakanaka kashanu pane nzira dzechinyakare.

Kugadzirisa Zvakanakira

1.Integrated dual-station kucheka uye kupatsanura system yekushanda kwakachinjika;
2. Kugadzira ma geometries akaomarara nekukurumidza kunowedzera kushanda zvakanaka kwekushandura maitiro;
3. Mipendero yekucheka isina tambo ine machipisi mashoma (<50μm) uye kubata kwakachengeteka kwemushandisi;
4. Kuchinja kusina musono pakati pezvinodiwa zvechigadzirwa nekushanda kwakajeka;
5. Mari shoma yekushandisa, goho rakawanda, nzira isina kusvibiswa uye isina kusvibiswa;
6. Kusagadzirwa kwetsvina, marara kana mvura yakasviba pasina kusimbiswa kwepamusoro;

Muenzaniso wekuratidzwa

Midziyo yekucheka yegirazi ye infrared picosecond dual-platform 5

Maitiro Akajairika

1. Kugadzira Zvigadzirwa Zvemagetsi zveVatengi:
· Kucheka magirazi e3D efoni nemazvo (R-angle accuracy: ± 0.01mm).
· Kuboorwa kwemaburi madiki mumalenzi ewachi esapphire (kuvhura kushoma: Ø0.3mm).
· Kupedzisa nzvimbo dzemagirazi dzinopa ruzivo rwemagirazi dzinoshandiswa nemakamera asina kuratidzwa.

2. Kugadzirwa kweChikamu cheOptical:
· Kugadzira michina ye AR/VR lens arrays (hukuru hwezvinhu ≥20μm).
· Kucheka kwe quartz prisms ne angled ye laser collimators (angle tolerance: ±15").
· Kugadzira mafirita einfrared profile (kucheka <0.5°).

3. Kurongedza kweSemiconductor:
· Kugadziriswa kwegirazi kuburikidza ne (TGV) padanho rewafer (chikamu che1:10).
· Kucheka kwe microchannel pagirazi rema microfluidic chips (Ra <0.1μm).
· Kugadziriswa kwemafrequency eMEMS quartz resonators.

Pakugadzira mahwindo eLiDAR optical emotokari, sisitimu iyi inobvumira kuchekwa kwegirazi requartz rine ukobvu hwe2mm uye kuchekwa kwakaringana kwe89.5±0.3°, zvichizadzisa zvinodiwa pakuyedzwa kwekutenderera kwemotokari.

Maitiro Ekushandisa

Yakagadzirirwa zvakananga kucheka zvinhu zvakaoma/zvisina kusimba zvinosanganisira:
1. Magirazi egirazi neoptical akajairika (BK7, fused silica);
2. Makristaro eQuartz nesafire substrates;
3. Mafirita egirazi neoptical
4. Zvigadziko zvegirazi
Inokwanisa kucheka contour uye kubhoboza maburi emukati nemazvo (zvishoma Ø0.3mm)

Nheyo yekucheka neLaser

Laser inogadzira ma pulses mapfupi ane simba guru kwazvo anosangana ne workpiece mukati me femtosecond-to-picosecond timescales. Panguva yekupararira kwezvinhu, danda rinokanganisa chimiro charo chekumanikidzwa kuti rigadzire maburi e filamentation ane micron-scale. Nzvimbo yakavandudzwa ye maburi inogadzira ma micro-cracks akadzorwa, ayo anobatanidzwa ne cleaving technology kuti vawane kupatsanurwa kwakarurama.

Mabhenefiti ekucheka kweLaser

1. Kubatanidzwa kwe otomatiki kwakanyanya (kushanda kwakabatana kwekucheka/kucheka) nekushandiswa kwesimba shoma uye kushanda kuri nyore;
2. Kugadzirisa zvinhu zvisina kubatana kunoita kuti zvikwanisike zvakasiyana zvisawanikwe nenzira dzechinyakare;
3. Kushanda pasina zvinodyiwa kunoderedza mari yekushandisa uye kunowedzera kuchengetedzeka kwezvakatipoteredza;
4.Kunyatsojeka kwepamusoro pasina kona ye zero taper uye kubviswa kwekukuvara kwechipiri kwebasa;
XKH inopa masevhisi akazara ekugadzirisa masisitimu edu ekucheka laser, kusanganisira magadzirirwo epuratifomu akagadzirirwa iwe, kuvandudzwa kwema process parameters akasarudzika, uye mhinduro dzakanangana neapplication kuti dzisangane nezvinodiwa zvekugadzira zvakasiyana mumaindasitiri akasiyana siyana.