Kaviri chiteshi sikweya muchina monocrystalline silicon tsvimbo kugadzirisa 6/8/12 inch pamusoro flatness Ra≤0.5μm

Tsanangudzo Pfupi

Monocrystalline silicon kaviri chiteshi square muchina chishandiso chinoshanda chekugadzirisa monocrystalline silicon tsvimbo (Ingot). Iyo inotora kaviri chiteshi synchronous dhizaini dhizaini uye inogona kucheka matanda maviri esilicon panguva imwe chete, ichivandudza zvakanyanya kugadzirwa. Chishandiso chinogadzira cylindrical silicon matanda kuita sikweya/quasi-square silicon blocks (Grit) kuburikidza nedhaimani waya yekucheka tekinoroji kana yemukati denderedzwa saw blades, kugadzirira kunotevera kucheka (sekugadzira silicon wafers), uye inoshandiswa zvakanyanya musilicon material processing links mu photovoltaic uye semiconductor industries.

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Features

Equipment maitiro:

(1) Kaviri chiteshi synchronous kugadzirisa
· Kubudirira kaviri: Kugadziriswa panguva imwe chete kwesimbi mbiri dzesilicon (Ø6 "-12") kunowedzera kugadzirwa ne40% -60% vs. Simplex michina.

· Kuzvimiririra kuzvidzora: Imwe neimwe chiteshi inogona kuzvimiririra kugadzirisa maparamendi ekucheka (tension, feed speed) kuti ienderane kune akasiyana silicon tsvimbo yakatarwa.

(2) Kucheka kwepamusoro-soro
· Dimensional kurongeka: sikweya bhaa parutivi kureba kushivirira ± 0.15mm, renji ≤0.20mm.

· Unhu hwepamusoro: kucheka kumucheto <0.5mm, kuderedza huwandu hwekukuya kunotevera.

(3) Kudzora noungwaru
* Adaptive kucheka: chaiyo-nguva yekutarisisa yesilicon tsvimbo morphology, shanduko inosimba yekucheka nzira (senge kugadzirisa yakabhenda silicon tsvimbo).

· Dhata traceability: rekodha magadzirirwo maparamita ega ega silicon tsvimbo kutsigira MES system docking.

(4) Mutengo wakaderera
· Diamond waya kushandiswa: ≤0.06m/mm (silicon tsvimbo kureba), waya dhayamita ≤0.30mm.

· Inotonhorera kutenderera: Iyo filtration system inowedzera hupenyu hwesevhisi uye inoderedza kuraswa kwemarara.

Technology uye budiriro zvakanakira:

(1) Kucheka tekinoroji optimization
- Multi-line yekucheka: 100-200 mitsara yedhaimondi inoshandiswa mukufanana, uye kukurumidza kucheka kuri ≥40mm / min.

-Tension control: Yakavharwa loop gadziriso system (± 1N) kuderedza njodzi yekutyoka waya.

(2) Kuenderana kwekuwedzera
- Material adaptation: Tsigiro P-mhando / N-mhando monocrystalline silicon, inoenderana neTOPCon, HJT uye mamwe mabheti esilicon tsvimbo yakakwirira.

- Flexible saizi: silicon tsvimbo kureba 100-950mm, sikweya tsvimbo parutivi kureba 166-233mm inogadziriswa.

(3) Kuvandudza otomatiki
-Robhoti kurodha uye kurodha: otomatiki kurodha / kuburitsa esilicon tsvimbo, kurova ≤3 maminetsi.

-Akangwara diagnostics: Predictive gadziriso yekudzikisa isina kurongeka yekudzika.

(4) Utungamiri hweindasitiri
- Wafer rutsigiro: inogona kugadzira ≥100μm Ultra-yakaonda nesilicon ine sikweya tsvimbo, kupatsanurwa mwero <0.5%.

- Simba rekushandisa optimization: Kushandiswa kwesimba pachikamu chesilicon tsvimbo kunoderedzwa ne30% (vs.

Technical parameters:

Zita reparameter	Index value
Nhamba yemabhawa akagadziriswa	2 zvidimbu / set
Kugadzirisa bhaa kureba	100 ~ 950mm
Machining margin range	166 ~ 233mm
Cutting speed	≥40mm/min
Diamond wire speed	0~35m/s
Diamond dhayamita	0.30 mm kana pasi
Linear kushandiswa	0.06 m/mm kana pasi
Inopindirana denderedzwa tsvimbo dhayamita	Yakapedzwa sikweya tsvimbo dhayamita +2mm, Iva nechokwadi chekupukuta chiyero chekupasa
Kucheka kumucheto breakage control	Raw mupendero ≤0.5mm, Hapana chipping, yepamusoro yepamusoro mhando
Arc kureba kufanana	Projection range <1.5mm, Kunze kwekukanganiswa kwesilicon tsvimbo
Zviyero zvemuchina (muchina mumwechete)	4800×3020×3660mm
Total rated power	56kW
Uremu hwakafa hwemidziyo	12t

Machining accuracy index tafura:

Precision chinhu	Tolerance range
Square bar margin kushivirira	± 0.15mm
Square bar edge range	≤0.20mm
Angle kumativi ose eskweya tsvimbo	90°±0.05°
flatness of square rod	≤0.15mm
Robhoti yakadzokorodza kumira zvakanaka	± 0.05mm

XKH's masevhisi:

XKH inopa yakazara-kutenderera masevhisi e-mono-crystalline silicon dual-station machines, kusanganisira kugadzirisa midziyo (inoenderana nematanda makuru esilicon), maitiro ekutumira (kucheka parameter optimization), kudzidziswa kwekushanda uye mushure mekutengesa-rutsigiro (makiyi zvikamu kupa, kuremerwa kuongororwa), kuve nechokwadi chekuti vatengi vanowana goho rakawanda (> 99%) uye yakaderera consumable mutengo kugadzirwa, uye kupa tekinoroji kukwidziridzwa kweA. Nguva yekuendesa ndeye 2-4 mwedzi.