Dia300x1.0mmt Hukobvu Sapphire Wafer C-Plane SSP/DSP
Sumo yewafer box
Crystal Materials | 99,999% yeAl2O3,Kuchena Kwepamusoro, Monocrystalline, Al2O3 | |||
Crystal quality | Inclusions, block marks, mapatya, Rudzi, madiki mabhubhu uye nzvimbo dzekuparadzira hazvipo. | |||
Diameter | 2inch | 3inch | 4inch | 6inch ~ 12inch |
50.8± 0.1mm | 76.2±0.2mm | 100±0.3mm | Zvinoenderana nezvinodiwa zveyakajairwa kugadzirwa | |
Ukobvu | 430±15µm | 550±15µm | 650±20µm | Inogona kugadzirwa nemutengi |
Orientation | C- ndege (0001) kuenda kuM-ndege (1-100) kana A-ndege (1 1-2 0) 0.2±0.1° /0.3±0.1°, R-ndege (1-1 0 2), A-ndege (1 1-2 0), M-ndege(1-1 0 0), Chero Maonero, Chero kona | |||
Primary flat urefu | 16.0±1mm | 22.0±1.0mm | 32.5±1.5 mm | Zvinoenderana nezvinodiwa zveyakajairwa kugadzirwa |
Primary flat Oientation | A-ndege (1 1-2 0 ) ± 0.2° | |||
TTV | ≤10µm | ≤15µm | ≤20µm | ≤30µm |
LTV | ≤10µm | ≤15µm | ≤20µm | ≤30µm |
TIR | ≤10µm | ≤15µm | ≤20µm | ≤30µm |
BOW | ≤10µm | ≤15µm | ≤20µm | ≤30µm |
Warp | ≤10µm | ≤15µm | ≤20µm | ≤30µm |
Front Surface | Epi-Polished (Ra< 0.2nm) |
* Bow: Kutsauka kwepakati penzvimbo yepakati peiyo yemahara, isina-kusungirirwa wafer kubva mundege yereferensi, apo ndege yereferensi inotsanangurwa nemakona matatu eequilateral triangle.
*Warp: Musiyano uripo pakati pehupamhi uye hudiki hunhambwe hwepakati penzvimbo yemahara, isina-yakasungirirwa wafer kubva kundege inotsanangurwa pamusoro.
Zvigadzirwa zvemhando yepamusoro uye masevhisi echizvarwa chinotevera semiconductor zvishandiso uye epitaxial kukura:
Yakakwira dhigirii yekupfava (inodzorwa TTV, uta, warp etc.)
Yepamusoro-mhando yekuchenesa (yakaderera particle kusvibiswa, yakaderera simbi kusvibiswa)
Substrate drilling, grooving, kucheka, uye nekumashure kukwenenzvera
Kusungirirwa kwedata senge kuchena uye chimiro che substrate (sarudzo)
Kana iwe uchida sapphire substrates, ndapota inzwa wakasununguka kubata:
tsamba:eric@xkh-semitech.com+86 158 0194 2596 /doris@xkh-semitech.com+86 187 0175 6522
Tichadzoka kwauri nekukurumidza!