Mhangura substrate imwe sekristaro Cu wafer 5x5x0.5/1mm 10x10x0.5/1mm 20x20x0.5/1mm

Tsanangudzo Pfupi:

Yedu yemhangura substrates uye wafers inogadzirwa kubva yakakwira-kuchena mhangura (99.99%) ine imwechete crystal chimiro, inopa yakanakisa magetsi uye yekupisa conductivity. Aya mawafer anowanikwa mune cubic orientation ye <100>, <110>, uye <111>, ichiita kuti ive yakanaka kune maapplication mune yepamusoro-performance zvemagetsi uye semiconductor kugadzira. Iine zviyero zve 5 × 5 × 0.5 mm, 10 × 10 × 1 mm, uye 20 × 20 × 1 mm, yedu substrates yemhangura inogoneka kuzadzisa zvakasiyana siyana zvinodiwa. Iyo lattice parameter yeaya mafirita ekristaro imwechete ndeye 3.607 Å, kuve nechokwadi chechokwadi chechimiro chechimiro chekugadzirwa kwechigadzirwa chepamusoro. Sarudzo dzepamusoro dzinosanganisira single-side polished (SSP) uye kaviri-side polished (DSP) inopera, ichipa kuchinjika kune akasiyana maitiro ekugadzira.

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Tsanangudzo

Nekuda kwekukwirira kwayo kupisa uye kusimba kwemagetsi, ma substrates emhangura anoshandiswa zvakanyanya mumicroelectronics, masisitimu ekupisa kupisa uye matekinoroji ekuchengetedza simba, uko kunoshanda kwekutonga kwemafuta uye kuvimbika kwakakosha. Izvi zvivakwa zvinogadzira mhangura substrates chinhu chakakosha mune akawanda epamberi tekinoroji maapplication.
Aya ndiwo mamwe ehunhu hwemhangura imwechete crystal substrate: Yakanakisa magetsi conductivity, conductivity yechipiri chete kune sirivheri. Thermal conductivity yakanaka kwazvo, uye thermal conductivity ndiyo yakanyanya kunaka pakati pesimbi dzakajairwa. Kushanda kwakanaka kwekugadzirisa, kunogona kuita zvakasiyana-siyana zve metallurgical processing technology.Corrosion resistance is good, asi mamwe matanho ekudzivirira achiri kudiwa.Iyo mari inodhura yakaderera, uye mutengo unowedzera hupfumi mumatare substrate zvinhu.
Copper substrate inoshandiswa zvakanyanya mumaindasitiri akasiyana siyana nekuda kwekunaka kwayo magetsi conductivity, thermal conductivity uye mechanical simba. Izvi zvinotevera kushandiswa kukuru kwemhangura substrate:
1. Electronic circuit board: mhangura foil substrate zvinhu seyadhindwa redunhu bhodhi (PCB). Inoshandiswa kwepamusoro density interconnect circuit board, flexible circuit board, etc. Iine conductivity yakanaka uye inopisa kupisa zvinhu uye inokodzera magetsi emagetsi emagetsi.

2. Thermal management applications: inoshandiswa se substrate inotonhorera yemarambi e LED, magetsi emagetsi, etc. Gadzira zvakasiyana-siyana zvekupisa kupisa, ma radiator uye zvimwe zvikamu zvekutarisira kupisa. Iyo yakanakisa thermal conductivity yemhangura inoshandiswa kuitisa uye kubvisa kupisa zvinobudirira.

3. Electromagnetic shielding application: seyemagetsi mudziyo goko uye shielding layer, kuti ipe inoshanda yemagetsi kudzivirira. Inoshandiswa nharembozha, makomputa uye zvimwe zvigadzirwa zvemagetsi zvesimbi shell uye yemukati shielding layer. Iine yakanaka electromagnetic kudzivirira kuita, inogona kuvharira kukanganiswa kwemagetsi.

4.Zvimwe zvikumbiro: sechinhu chinotenderera chedunhu chekuvaka masisitimu emagetsi. Inoshandiswa mukugadzirwa kwezvinhu zvakasiyana siyana zvemagetsi, mota, ma transformer uye zvimwe zvinhu zvemagetsi. Sechinhu chekushongedza, shandisa maitiro ayo akanaka ekugadzirisa.

Isu tinokwanisa kugadzirisa akasiyana siyana, ukobvu uye maumbirwo eCopper Single crystal substrate zvinoenderana nezvinodiwa nevatengi.

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