Au yakavharidzirwa, chipfuko chesafire, silicon, SiC wafer, 2inch 4inch 6inch, Goridhe yakavharidzirwa kukora 10nm 50nm 100nm

Au yakavharwa, chipfuko chesafire, chipfuko chesilicon, SiC wafer, 2inch 4inch 6inch, Goridhe rakavharidzirwa kukora 10nm 50nm 100nm Featured Image

Tsanangudzo Pfupi:

Yedu Goridhe Coated Wafers anowanikwa mune dzakasiyana siyana substrates, kusanganisira Silicon (Si), Sapphire (Al₂O₃), uye Silicon Carbide (SiC) wafers. Aya mawafer anouya mune 2-inch, 4-inch, uye 6-inch saizi uye akaputirwa nedete, yakakwirira-kuchena goridhe (Au) layer. Iyo yegoridhe yekuputira inowanikwa muhukobvu kubva pa10nm kusvika 500nm, ine tsika ukobvu hwakagadzirirwa kusangana nezvinodiwa nevatengi. Iyo yegoridhe layer inowedzerwa neadhesion firimu rakagadzirwa neChromium (Cr), kuve nechokwadi chekubatana kwakasimba pakati pe substrate uye goridhe layer.
Aya mawafer akavharwa negoridhe akanakira akasiyana semiconductor uye optoelectronics application, achipa epamusoro emagetsi conductivity, kupisa kwekupisa, corrosion resistance, uye kusimba kwemagetsi. Izvo zvinoshandiswa zvakanyanya muzvigadzirwa zvepamusoro-soro uko kugadzikana, kuvimbika, uye kushanda kwenguva refu kwakakosha.

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Key Features

Feature	Tsanangudzo
Substrate Zvishandiso	Silicon (Si), Sapphire (Al₂O₃), Silicon Carbide (SiC)
Gold Coating Ukobvu	10nm, 50nm, 100nm, 500nm
Gold Purity	99.999%kuchena kwekuita kwakanyanya
Adhesion Film	Chromium (Cr), 99.98% kuchena, kuve nechokwadi chekunamatira kwakasimba
Kukasharara Kwepamusoro	akati wandei nm (yakapfava pamusoro pemhando yehunyanzvi hwekushandisa)
Resistance (Si Wafer)	1-30 Ohm/cm(zvichienderana nerudzi)
Wafer Sizes	2-inch, 4-inch, 6-inch, uye saizi yakasarudzika
Hukobvu (Si Wafer)	275µm, 381µm, 525µm
TTV (Total Thickness Variation)	≤20µm
Primary Flat (Si Wafer)	15.9 ± 1.65mmku32.5 ± 2.5mm

Nei Goridhe Coating Yakakosha muSemiconductor Indasitiri

Electrical Conductivity
Ndarama ndechimwe chezvakanakisa zvekushandisakufambisa kwemagetsi. Zvimedu zvakafukidzwa negoridhe zvinopa nzira dzakaderera-dzinodzivirira, izvo zvakakosha kune semiconductor zvishandiso zvinoda kukurumidza uye kugadzikana kubatanidza magetsi. Thekuchena kwepamusoroyegoridhe inova nechokwadi chekufambisa zvakanaka, kuderedza kurasikirwa kwechiratidzo.

Corrosion Resistance
Ndarama ndiyoisingakureuye inopikisa zvakanyanya kune oxidation. Izvi zvinoita kuti ive yakanaka kune semiconductor application inoshanda munzvimbo dzakaoma kana dziri pasi pekupisa kwakanyanya, hunyoro, kana mamwe mamiriro ekuora. Chimedu chegoridhe-chakavharwa chichachengetedza maitiro emagetsi uye kuvimbika nekufamba kwenguva, kupa ahupenyu hurefu hwebasanokuda kwezvishandiso zvinoshandiswa.

Thermal Management
Gold'syakanakisa thermal conductivityinovimbisa kuti kupisa kunoitwa panguva yekushanda kwemidziyo ye semiconductor inobviswa zvakanaka. Izvi zvinonyanya kukosha kune yakakwirira-simba maapplication sengeLEDs, magetsi emagetsi,uyeoptoelectronic zvishandiso, uko kupisa kwakanyanya kunogona kutungamirira kukukundikana kwechigadzirwa kana chisina kutarisirwa zvakanaka.

Mechanical Durability
Zvipfeko zvegoridhe zvinopakuchengetedzwa kwemichinakune wafer, kudzivirira kukanganisa kwepamusoro panguva yekubata nekugadzirisa. Iyi yakawedzerwa layer yedziviriro inovimbisa kuti wafers anochengeta kuvimbika kwavo kwechimiro uye kuvimbika, kunyangwe mumamiriro ekuda.

Post-Coating Hunhu

Yakavandudzwa Surface Hunhu
Iyo yegoridhe yakashongedzwa inovandudzakutsetseka kwepamusoroyewafer, iyo yakakosha kuneyakakwirira-chaiyoapplications. Thepamusoro roughnessinoderedzwa kusvika kune akati wandei nanometers, ichiva nechokwadi chenzvimbo isina kukanganisa yakanakira maitiro akadaiwire bonding, soldering,uyephotolithography.

Yakavandudzwa Bonding uye Soldering Properties
Iyo yegoridhe layer inosimudzira iyobonding propertiesyewafer, ichiita kuti ive yakakodzerawire bondinguyeflip-chip bonding. Izvi zvinoguma nekuchengetedzeka uye kwenguva refu yekubatanidza magetsi mukatiIC kurongedzauyesemiconductor assemblies.

Haina Corrosion uye Inogara kwenguva refu
Iyo yegoridhe yekuputira inovimbisa kuti wafer icharamba isina oxidation uye kuora, kunyangwe mushure mekuratidzwa kwenguva refu kune yakaoma mamiriro ekunze. Izvi zvinobatsira kunekugadzikana kwenguva refuchekupedzisira semiconductor mudziyo.

Thermal uye Magetsi Kugadzikana
Zvimedu zvakavharwa negoridhe zvinopa zvinoenderanakupisa kwemafutauyemagetsi conductivity, zvichiita kuti zvive nani uyekuvimbikayemidziyo nekufamba kwenguva, kunyangwe mukupisa kwakanyanya.

Parameters

Property	Value
Substrate Zvishandiso	Silicon (Si), Sapphire (Al₂O₃), Silicon Carbide (SiC)
Goridhe Layer Ukobvu	10nm, 50nm, 100nm, 500nm
Gold Purity	99.999%(kuchena kwepamusoro kwekuita kwakanyanya)
Adhesion Film	Chromium (Cr),99.98%kuchena
Kukasharara Kwepamusoro	Nanometers dzinoverengeka
Resistance (Si Wafer)	1-30 Ohm/cm
Wafer Sizes	2-inch, 4-inch, 6-inch, saizi yakasarudzika
Si Wafer Ukobvu	275µm, 381µm, 525µm
TTV	≤20µm
Primary Flat (Si Wafer)	15.9 ± 1.65mmku32.5 ± 2.5mm

Zvishandiso zveGold-Coated Wafers

Semiconductor Packaging
Mawafer akavharwa negoridhe anoshandiswa zvakanyanya mukatiIC kurongedza, uko kwavomagetsi conductivity, mechanical durability,uyekupisa kwemafutazvivakwa zvinovimbisa kuvimbikainterconnectsuyebondingmune semiconductor zvishandiso.

LED Manufacturing
Mawafer akavharwa negoridhe anoita basa rakakosha mukatiKugadzirwa kwe LED, kwavanosimudzirathermal managementuyekushanda kwemagetsi. Iyo goridhe layer inova nechokwadi chekuti kupisa kunoitwa neakakwira-simba maLED anoraswa zvine mutsindo, zvichipa hupenyu hurefu uye kushanda zvakanaka.

Optoelectronic Devices
In optoelectronics, zvitete zvakavharwa negoridhe zvinoshandiswa mumidziyo yakadaiphotodetectors, laser diodes,uyechiedza sensors. Iyo yegoridhe yakashongedzwa inopa zvakanakisathermal conductivityuyekugadzikana kwemagetsi, kuve nechokwadi chekushanda kunoenderana mumidziyo inoda kunyatso kudzora kwechiedza nemagetsi masaini.

Power Electronics
Zvimedu zvakavharwa negoridhe zvakakosha kunemidziyo yemagetsi magetsi, uko kushanda kwepamusoro uye kuvimbika kwakakosha. Aya mawafer anovimbisa kugadzikanakushandura simbauyekupisa kupisamumidziyo yakadaisimba transistorsuyevoltage regulators.

Microelectronics uye MEMS
In microelectronicsuyeMEMS (Micro-Electromechanical Systems), zvitete zvakavharwa negoridhe zvinoshandiswa kugadziramicroelectromechanical zvikamuizvo zvinoda kunyatsojeka uye kusimba. Iyo yegoridhe layer inopa yakagadzikana kushanda kwemagetsi uyekuchengetedzwa kwemichinamune masevhisi microelectronic midziyo.

Mibvunzo Inowanzo bvunzwa (Q&A)

Q1: Sei uchishandisira goridhe pakupfekedza zvingwa?

A1:Ndarama inoshandiswa pairiyepamusoro yemagetsi conductivity, corrosion resistance,uyethermal managementproperties. Inovimbisayakavimbika interconnects, hurefu hwehupenyu hwechigadzirwa,uyekuenderana kuitamune semiconductor application.

Q2: Ndeapi mabhenefiti ekushandisa goridhe-yakavharwa wafers mune semiconductor application?

A2:Zvimedu zvakavharwa negoridhe zvinopakuvimbika kwepamusoro, kugadzikana kwenguva refu,uyezviri nani zvemagetsi uye zvinopisa. Vanowedzerawobonding propertiesuye kudziviriraoxidationuyengura.

Q3: Ndeupi hukobvu hwekuputira goridhe hwandinofanira kusarudza pakushandisa kwangu?

A3:Hukobvu hwakakodzera hunotsamira pane yako chaiyo application.10nmyakakodzera kune chaiyo, yakapfava maapplication, uku50nmku100nmmabhanhire anoshandiswa kune yakakwirira magetsi emagetsi.500nminogona kushandiswa kune-heavy-duty application inoda makobvu maseru edurabilityuyekupisa kupisa.

Q4: Unogona here kugadzirisa saizi yewafer?

A4:Ehe, mawafers anowanikwa mukati2-inch, 4-inch,uye6-inchsaizi yakajairwa, uye isu tinokwanisawo kupa saizi yakajairwa kuti isangane nezvinodiwa zvako.

Q5: Ko iyo yegoridhe yekuputira inosimudzira sei mashandiro echishandiso?

A5:Ndarama inovandudzakupisa kwemafuta, magetsi conductivity,uyecorrosion resistance, iyo yose inobatsira kuti ibudirire uyeyakavimbika semiconductor zvishandisonehupenyu hurefu hwekushanda.

Q6: Ko firimu rekunamatira rinonatsiridza sei goridhe rekupfeka?

A6:Thechromium (Cr)adhesion firimu inovimbisa chisungo chakasimba pakati pegoridhe layeruyesubstrate, kudzivirira delamination uye kuvimbisa kutendeseka kwewafer panguva yekugadzirisa uye kushandiswa.

Mhedziso

Yedu Goridhe Yakavharwa Silicon, Sapphire, uye SiC Wafers inopa mhinduro dzepamberi dzema semiconductor application, ichipa epamusoro magetsi conductivity, kupisa kwekupisa, uye kusadzivirirwa nekuora. Aya mawafer akanakira semiconductor kurongedza, LED kugadzira, optoelectronics, nezvimwe. Negoridhe rakachena-yakanyanya, ukobvu hwekubatika hunogoneka, uye kusimba kwemakina, vanovimbisa kuvimbika kwenguva refu uye kuita kunoenderana munzvimbo dzinoda.