150mm 6 inch 0.7mm 0.5mm Sapphire Wafer Substrate Inotakura C-Ndege SSP/DSP
Applications
Zvikumbiro zve6-inch sapphire wafers zvinosanganisira:
1. Kugadzirwa kwe LED: sapphire wafer inogona kushandiswa se substrate ye LED chips, uye kuoma kwayo uye kupisa kwekushisa kunogona kuvandudza kugadzikana uye hupenyu hwebasa re LED chips.
2. Laser kugadzira: Sapphire wafer inogonawo kushandiswa se substrate ye laser, kubatsira kuvandudza kushanda kwelaser uye kuwedzera hupenyu hwebasa.
3. Semiconductor kugadzira: Sapphire wafers anoshandiswa zvakanyanya mukugadzira zvigadzirwa zvemagetsi uye optoelectronic, kusanganisira optical synthesis, solar cell, high-frequency electronic devices, etc.
4. Zvimwe zvinoshandiswa: Sapphire wafer inogonawo kushandiswa kugadzira touch screen, optical devices, thin film solar cells uye zvimwe zvigadzirwa zvepamusoro.
Tsanangudzo
Material | Yakakwirira kuchena imwe crystal Al2O3, safire wafer. |
Dimension | 150 mm +/- 0.05 mm, 6 inch |
Ukobvu | 1300 +/- 25 um |
Orientation | C ndege (0001) kubva M (1-100) ndege 0.2 +/- 0.05 dhigirii |
Primary flat orientation | Ndege +/- 1 dhigirii |
Primary flat urefu | 47.5 mm +/- 1 mm |
Total Thickness Variation (TTV) | <20 um |
Bow | <25 um |
Warp | <25 um |
Thermal Kuwedzera Coefficient | 6.66 x 10-6 / °C inofambirana neC axis, 5 x 10-6 / °C perpendicular to C axis |
Dielectric Simba | 4.8 x 105 V/cm |
Dielectric Constant | 11.5 (1 MHz) pamwe neC axis, 9.3 (1 MHz) perpendicular to C axis |
Dielectric Loss Tangent (aka dissipation factor) | isingasviki 1 x 10-4 |
Thermal Conductivity | 40 W/(mK) pa20℃ |
Kupukuta | divi rimwe chete rakakwenenzverwa (SSP) kana kaviri mativi akakwenenzverwa (DSP) Ra <0.5 nm (neAFM). Rutivi rwakadzokera kumashure rweSSP wafer rwakanga rwakanaka kusvika kuRa = 0.8 - 1.2 um. |
Transmittance | 88% +/-1 % @460 nm |