Nhau - Chii chinonzi Wafer TTV, Bow, Warp, uye Zvinoyerwa Sei?

.Dhairekitori

1. Pfungwa Huru uye Zviyero

2. Matekiniki ekuyera

3. Kugadziriswa kweData uye Zvikanganiso

4. Zvinokonzera Maitiro

Mukugadzira ma semiconductor, kufanana kweukobvu uye kusatsetseka kwepamusoro pema wafers zvinhu zvakakosha zvinokanganisa goho remaitiro. Zvikamu zvakakosha zvakaita seTotal Thickness Variation (TTV), Bow (arcuate warpage), Warp (global warpage), uye Microwarp (nano-topography) zvinokanganisa zvakananga kurongeka uye kugadzikana kwemaitiro epakati senge photolithography focus, chemical mechanical polishing (CMP), uye thin-film deposition.

Pfungwa huru uye zviyero

TTV (Kusiyana Kwehukobvu Hwose)

TTV inoreva musiyano mukuru wekukora pamusoro pewafer yese mukati menzvimbo yakatsanangurwa yekuyera Ω (inowanzo kusabatanidza nzvimbo dzekusabvisa mipendero nenzvimbo dziri pedyo nemakaro kana kuti dzakatsetseka). Pamasvomhu, TTV = max(t(x,y)) – min(t(x,y)). Inotarisa pakufanana kwekukora kwemukati kwewafer substrate, zvakasiyana nekuomarara kwepadenga kana kufanana kwefirimu rakatetepa.

\Uta\

Bow inotsanangura kutsauka kwakatwasuka kwenzvimbo yepakati yewafer kubva pane imwe nzvimbo ine zvikwere zvidiki. Makoshero akanaka kana asina kunaka anoratidza kutenderera kwepasi rose kumusoro kana pasi.

Kukombama

Warp inoyera musiyano mukuru pakati penzvimbo dziri pamusoro pegomo nepamupata pakati penzvimbo dzose dzepamusoro nereferensi, ichiongorora kuti wafer yacho yakatsetseka sei iri muchimiro chefree state.

Microwarp

Microwarp (kana nanotopography) inoongorora ma micro-undulations ari pamusoro mukati menzvimbo chaiyo yewavelength (semuenzaniso, 0.5–20 mm). Pasinei nehukuru hudiki, kusiyana uku kunokanganisa zvakanyanya kudzika kwefocus (DOF) uye kufanana kweCMP.

Chimiro cheKuyera

Zviyero zvese zvinoverengerwa uchishandisa geometric baseline, kazhinji kacho chidimbu che least-squares fitted plane (LSQ plane). Kuyerwa kweukobvu kunoda kurongeka kwedata repamberi nerekumashure kuburikidza newafer edges, notches, kana alignment marks. Kuongororwa kweMicrowarp kunosanganisira kusefa nzvimbo kuti kubudiswe zvikamu zvinoenderana nehurefu hwewavelength.

Matekiniki ekuyera

1. Nzira dzekuyera TTV

Kuongororwa Kwepamusoro-soro Kwemhando mbiri
Kuongororwa kweInterferometry:Inoshandisa mipendero yepakati penzvimbo inotaridzirwa nepamusoro pewafer. Yakakodzera nzvimbo dzakatsetseka asi inoganhurirwa nemawafer akakombama.
Kuongororwa kweChiedza Chichena (SWLI):Inoyera hurefu hwakazara kuburikidza nemahamvuropu echiedza asina kubatana zvakanyanya. Inoshanda panzvimbo dzakaita sematanho asi inodziviswa nekumhanya kwekuskena kwemuchina.
Nzira dzeConfocal:Kuwana resolution ye sub-micron kuburikidza ne pinhole kana dispersion principles. Yakanakira nzvimbo dzakaomarara kana dzinopenya asi inononoka nekuda kwe point-by-point scanning.
Kuumbwa kweLaser Triangulation:Mhinduro inokurumidza asi inokurumidza kurasikirwa nekururama nekuda kwekusiyana kwekutarisa kwepadenga.

Kubatanidzwa kweKutapurirana/Kufungisisa
MaSensor Emagetsi Ane Misoro Miviri: Kuiswa kwemasensor akafanana kumativi ese kunoyera ukobvu seT = L – d₁ – d₂ (L = daro rekutanga). Inokurumidza asi inonzwa hunyanzvi hwezvinhu.
Ellipsometry/Spectroscopic Reflectometry: Inoongorora kudyidzana kwechiedza nechinhu chemuchina kuti chionekwe sechinokora asi chisina kukodzera TTV yakawanda.

2. Kuyerwa kweUta neWarp

Magadzirirwo eMulti-Probe Capacitance Arrays: Tora data rehurefu hwenzvimbo yakazara pachikuva chine mhepo kuti uvakwezve nekukurumidza mu3D.
Kuratidzwa kwechiedza chakagadzirwa: Kuongororwa kwe3D nekukurumidza uchishandisa kuumbwa kwechiedza.
Interferometry yeLow-NA: Mepu yenzvimbo ine resolution yepamusoro asi inonzwa kudedera.

3. Kuyerwa kweMicrowarp

Kuongorora Kuwanda Kwenzvimbo:

Wana topography yepamusoro-soro ine resolution yepamusoro.
Kuwanda kwesimba rema spectral (PSD) kuburikidza ne2D FFT.
Isa mafirita ebandpass (semuenzaniso, 0.5–20 mm) kuti ubvise mawavelength akakosha.
Verenga RMS kana PV kubva padata rakasefetwa.

Kutevedzera Vacuum Chuck:Migumisiro yekumanikidza inotevedzera zvinhu panguva yekunyora mifananidzo.

Kugadziriswa kweData uye Matsime Ezvikanganiso

Kugadzirisa Mafambiro Ebasa

TVV:Gadzirisa ma "coordinates" epamberi/kumashure, verenga musiyano weukobvu, uye bvisa zvikanganiso zvehurongwa (semuenzaniso, kuyerera kwekupisa).
.Uta/Warp:Isa data reLSQ pahurefu; Bow = nzvimbo yepakati yasara, Warp = nzvimbo yasara yekumusoro kusvika kumupata.
.Microwarp:Sefa ma frequency enzvimbo, verenga nhamba (RMS/PV).

Manyuko Ezvikanganiso Zvikuru

Zvinhu Zvakatipoteredza:Kudedera (kwakakosha pakuchinjana kwemamiriro ekunze), kutenderera kwemhepo, kuyerera kwekupisa.
Miganhu yeSensor:Ruzha rwechikamu (interferometry), zvikanganiso zvekuenzanisa urefu hwewavelength (confocal), mhinduro dzinoenderana nezvinhu (capacitance).
Kubata Wafer:Kusarongeka kwemiganhu, kusarongeka kwekufamba kwechikamu pakusona.

Mhedzisiro paKukosha kweMaitiro

Lithography:Microwarp yemuno inoderedza DOF, zvichikonzera kusiyana kweCD uye zvikanganiso zve overlay.
CMP:Kusawirirana kwekutanga kweTTV kunotungamira mukumanikidzwa kwekupukuta kusina kufanana.
Kuongorora Kushushikana:Kushanduka kweBow/Warp kunoratidza maitiro ekushushikana kwekupisa/kwemakanika.
Kurongedza:Kuwanda kweTTV kunogadzira maburi muzvisungo zvekubatanidza.

Wafer yeSapphire yeXKH

Nguva yekutumira: Gunyana-28-2025