Silicon Wafers vs. Glass Wafers: Chii Chatiri Kuchenesa? Kubva Material Essence kuenda kune Process-Yakavakirwa Kuchenesa Solutions

Kunyangwe zvese zviri zviviri silicon negirazi zvimedu zvinogovana chinangwa chakafanana che "kucheneswa," matambudziko uye kutadza maitiro avanosangana nawo panguva yekuchenesa akasiyana zvakanyanya. Kusiyana uku kunomuka kubva kune zvakasikwa zvinhu zvivakwa uye zvakatemwa zvinodiwa zvesilicon negirazi, pamwe neiyo yakasarudzika "uzivi" hwekuchenesa inotungamirwa nemashandisirwo avo ekupedzisira.

Kutanga, ngatijekese: Chii chaizvo chatiri kuchenesa? Ndezvipi zvinosvibisa zvinobatanidzwa?

Contaminants inogona kuiswa muzvikamu zvina:

1. Particle Contaminants

   • Guruva, zvimedu zvesimbi, organic particles, abrasive particles (kubva kuCMP process), nezvimwe.

   • Izvi zvinosvibisa zvinogona kukonzera kukanganisa kwepateni, senge shorts kana matunhu akavhurika.

2. Organic Contaminants

   • Inosanganisira zvisaririra zvephotoresist, resin additives, mafuta eganda remunhu, zvinonyungudutsa, nezvimwe.

   • Organic tsvina inogona kugadzira masiki anotadzisa etching kana ion implantation uye kuderedza kunamatira kwemamwe mafirimu matete.

3. Metal Ion Zvinosvibisa

   • Iron, mhangura, sodium, potasium, calcium, nezvimwewo, izvo zvinonyanya kubva mumidziyo, makemikari, uye kubata kwevanhu.

   • Mune semiconductors, simbi ions "zvinouraya" zvinosvibisa, kuunza mazinga esimba mubhendi rinorambidzwa, izvo zvinowedzera kubuda kwezvino, kupfupisa hupenyu hwemutakuri, uye kukuvadza zvakanyanya zvinhu zvemagetsi. Mugirazi, vanogona kukanganisa kunaka uye kunamatira kwemafirimu matete anotevera.

4. Native Oxide Layer

   • Zvemasilicon wafers: Mutsetse wakatetepa wesilicon dioxide (Native Oxide) unogadzika kugadzirwa pamusoro pemhepo. Ukobvu uye kufanana kweiyi oxide layer yakaoma kudzora, uye inofanirwa kubviswa zvachose panguva yekugadzirwa kwezvimiro zvakakosha senge gedhi oxides.

   • Zvemagirazi mawaferi: Girazi pacharo isiki yetiweki chimiro, saka hapana nyaya ye "kubvisa yemuno oxide layer." Nekudaro, iyo yepamusoro inogona kunge yakagadziridzwa nekuda kwekusvibiswa, uye iyi layer inoda kubviswa.

I. Zvinangwa Zvikuru: Kusiyana pakati peKushanda Kwemagetsi uye Kukwana Kwemuviri

• Silicon Wafers

  • Chinangwa chikuru chekuchenesa ndechekuona kushanda kwemagetsi. Tsanangudzo dzinowanzo sanganisira dzakaomarara particle counts uye saizi (eg, zvimedu ≥0.1μm zvinofanirwa kubviswa zvinobudirira), metal ion concentrations (semuenzaniso, Fe, Cu inofanirwa kudzorwa kusvika ≤10¹⁰ maatomu/cm² kana kudzika), uye organic residue mazinga. Kunyangwe kusvibiswa kwemicroscopic kunogona kutungamira kune mapfupi edunhu, kubuda kwemhepo, kana kutadza kwegedhi oxide kuperera.

• Girazi Wafers

  • Sema substrates, izvo zvakakosha zvinodikanwa kukwana kwemuviri uye kugadzikana kwemakemikari. Tsanangudzo inotarisa pane macro-level zvinhu zvakaita sekushaikwa kwezvikwenya, mavanga asingabvisike, uye kuchengetedzwa kweiyo yepakutanga kukwasharara uye geometry. Chinangwa chekuchenesa ndechekuona kuchena kwekuona uye kunamatira kwakanaka kune anotevera maitiro akadai sekuvhara.

II. Material Nature: Musiyano Wakakosha Pakati peCrystalline neAmorphous

• Silicon

  • Silicon chinhu chine crystalline, uye pamusoro payo pachayo inokura isina-uniform silicon dioxide (SiO₂) oxide layer. Iyi oxide layer inoisa njodzi kukushanda kwemagetsi uye inofanira kunyatsobviswa uye yakaenzana.

• Girazi

  • Girazi is amorphous silica network. Zvinhu zvaro zvakawanda zvakafanana mukuumbwa kune silicon oxide layer yesilicon, zvinoreva kuti inogona kukurumidza kuiswa ne hydrofluoric acid (HF) uye zvakare inotapukirwa nekukukurwa kwakasimba kwealkali, zvichikonzera kuwedzera kweiyo roughness kana deformation. Uyu mutsauko wakakosha unotaura kuti silicon wafer yekuchenesa inogona kushivirira mwenje, inodzorwa etching kubvisa zvinosvibisa, nepo girazi wafer yekuchenesa kunofanirwa kuitwa nekuchenjerera kwakanyanya kudzivirira kukuvadza base zvinhu.

III. Kuenzanisa kweKuchenesa Solutions

Zvichienderana nezvinangwa zvambotaurwa uye hunhu hwezvinhu, mhinduro dzekuchenesa dzesilicon negirazi wafers dzinosiyana:

• Girazi Wafer Yekuchenesa Maitiro

  • Parizvino, mazhinji magirazi ekugadzira magirazi anoshandisa nzira dzekuchenesa zvinoenderana nehunhu hwegirazi, ichitsamira zvakanyanya pane isina simba alkali yekuchenesa maajenti.

  • Kuchenesa Agent Hunhu:Aya akasarudzika ekuchenesa maajenti anowanzo asina simba alkaline, ane pH yakatenderedza 8-9. Iwo anowanzo ane surfactants (semuenzaniso, alkyl polyoxyethylene ether), simbi chelating agents (semuenzaniso, HEDP), uye organic yekuchenesa aids, akagadzirirwa emulsify uye kuora zvinosvibisa organic semafuta uye zvigunwe, uku ichikuvadza zvishoma kune girazi matrix.

  • Process Flow:Iyo yakajairika yekuchenesa maitiro inosanganisira kushandisa chaiyo kuunganidzwa kweasina kusimba alkaline ekuchenesa maajenti patembiricha kubva mukamuri tembiricha kusvika 60 ° C, yakasanganiswa ne ultrasonic kuchenesa. Mushure mekuchenesa, zvimedu zvinotora matanho ekusuka akawanda nemvura yakachena uye kuomeswa zvinyoro (semuenzaniso, kusimudza zvishoma kana IPA vapor drying). Iyi nzira inonyatso kusangana nezvinodiwa zvegirazi wafer yehutsanana hwekuona uye hutsanana hwese.

• Silicon Wafer Yekuchenesa Maitiro

  • Zvekugadzirisa semiconductor, masilicon wafers anowanzo kucheneswa akajairwa eRCA, inova nzira yekuchenesa yakanyanya inokwanisa kugadzirisa zvine hungwaru marudzi ese ezvinosvibisa, kuve nechokwadi chekuti magetsi ekushanda kwemagetsi emidziyo semiconductor asangana.

IV. Kana Girazi Inosangana Nepamusoro "Kuchena" Maitiro

Kana magirazi akaomeswa egirazi achishandiswa mumashandisirwo anoda kuomesesa particles kuverenga uye simbi ion mazinga (semu, sema substrates mumasemiconductor maitiro kana kune akanakisa akaonda firimu deposition nzvimbo), iyo yemukati yekuchenesa maitiro inogona kunge isisina kukwana. Muchiitiko ichi, semiconductor yekuchenesa misimboti inogona kushandiswa, kuunza yakagadziridzwa RCA yekuchenesa zano.

Nheyo yeiyi zano ndeyekudzikisa uye kukwidziridza yakajairwa RCA maitiro maparamendi kuti agamuchire inonzwisa chimiro chegirazi:

• Organic Contaminant Removal:SPM mhinduro kana mvura yakapfava yeozone inogona kushandiswa kukanganisa organic tsvina kuburikidza neoxidation yakasimba.

• Particle Removal:Yakanyanya diluted SC1 mhinduro inoshandiswa pakudzikira kwakadzikira uye ipfupi nguva dzekurapa kushandisa yayo electrostatic repulsion uye micro-etching mhedzisiro kubvisa zvimedu, uku ichideredza ngura pagirazi.

• Metal Ion Kubviswa:A diluted SC2 solution kana simple dilute hydrochloric acid/dilute nitric acid solutions inoshandiswa kubvisa tsvina dzesimbi kuburikidza ne chelation.

• Zvirambidzo Zvakasimba:DHF (di-ammonium fluoride) inofanira kudzivirirwa zvachose kudzivirira kuora kwechikamu chegirazi.

Mune iyo yese yakagadziridzwa maitiro, kusanganisa megasonic tekinoroji kunowedzera zvakanyanya kubviswa kwekuita kwe nano-saizi particles uye inopfava pamusoro.

Mhedziso

Maitiro ekuchenesa esilicon negirazi wafers ndiwo mhedzisiro isingadzivisike yeinjiniya inodzosera zvichienderana nezvinodiwa zvekupedzisira zvekushandisa, zvivakwa zvenyama, uye chimiro chemuviri nemakemikari. Silicon wafer yekuchenesa inotsvaga "atomic-level kuchena" kwemagetsi kuita, ukuwo girazi wafer yekuchenesa inotarisana nekuwana "yakakwana, isina kukuvara" nzvimbo dzemuviri. Sezvo magirazi akaomeswa egirazi ari kuwedzera kushandiswa mumasemiconductor maapplication, maitiro avo ekuchenesa anozoshanduka kupfuura echinyakare asina kusimba alkaline kuchenesa, kugadzira yakawedzera kucheneswa, yakagadziridzwa mhinduro senge yakagadziridzwa RCA maitiro kuti asangane nehutsanana hwepamusoro.