Muchina we Double station sikweya monocrystalline silicon rod processing 6/8/12 inch surface flatness Ra≤0.5μm

Muchina wesimbi wesimbi wepachiteshi chine mativi maviri unogadzirisa tsvimbo yesilicon ine 6/8/12 inch yakatsetseka Ra≤0.5μm Mufananidzo Wakatariswa

Tsananguro pfupi:

Muchina wesimbi wesimbi wesimbi wesimbi wesimbi wesimbi wesimbi wesimbi wesimbi wesimbi unoshanda zvakanaka pakugadzirisa simbi dze ...

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Zvinhu zvirimo

Zvishandiso hunhu:

(1) Kugadziriswa kwematanho maviri akaenzana
· Kushanda zvakanaka kaviri: Kugadziriswa kwetsvimbo mbiri dzesilicon panguva imwe chete (Ø6"-12") kunowedzera kugona ne40%-60% zvichienzaniswa nemidziyo yeSimplex.

· Kudzora kwakazvimirira: Chiteshi chega chega chinogona kugadzirisa maparamita ekucheka ega (kusimba, kumhanya kwekudyisa) kuti chienderane nezvinodiwa zvakasiyana zvetsvimbo yesilicon.

(2) Kucheka kwakanyatsonaka
· Kururama kwehukuru: kutsungirira daro remativi emativi ebhawa ± 0.15mm, nzvimbo ≤0.20mm.

· Hunhu hwepamusoro: kupwanyika kwemucheto <0.5mm, kuderedza huwandu hwekukuya hunotevera.

(3) Kudzora kwakangwara
· Kucheka kunochinjika: kutarisa mafambiro etsvimbo yesilicon panguva chaiyo, kugadzirisa nzira yekucheka (senge kugadzirisa tsvimbo yesilicon yakakombama).

· Kutevedza data: nyora maparamita ekugadzirisa etsvimbo yega yega yesilicon kuti utsigire MES system docking.

(4) Mutengo wakaderera unodyiwa
· Kushandiswa kwewaya yedhaimani: ≤0.06m/mm (kureba kwetsvimbo yesilicon), dhayamita yewaya ≤0.30mm.

· Kutenderera kwemhepo inotonhodza: Sisitimu yekusefa inowedzera hupenyu hwebasa uye inoderedza kuraswa kwemvura inoraswa.

Tekinoroji nebudiriro zvakanakira:

(1) Kugadzirisa tekinoroji
- Kucheka mitsetse yakawanda: mitsetse yemadhaimani 100-200 inoshandiswa panguva imwe chete, uye kumhanya kwekucheka kuri ≥40mm/min.

- Kudzora kushushikana: Sisitimu yekugadzirisa tambo yakavharwa (±1N) kuderedza njodzi yekutyoka kwewaya.

(2) Kuwedzera kwekuenderana
- Kugadziriswa kwezvinhu: Tsigira P-type/N-type monocrystalline silicon, inoenderana neTOPCon, HJT nedzimwe tsvimbo dzesilicon dzebhatiri dzinoshanda zvakanyanya.

- Saizi inochinjika: kureba kwetsvimbo yesilicon 100-950mm, kureba kwetsvimbo yemativi esimbi inochinjika 166-233mm.

(3) Kuvandudzwa kwe otomatiki
- Kurodha nekuburitsa marobhoti: kurodha/kuburitsa otomatiki marobhoti esilicon, kurova ≤3 maminitsi.

- Kuongorora zvinhu zvine hungwaru: Kugadzirisa zvinhu zvinofanotaurwa kuti zvideredze nguva yekusashanda zvakanaka isina kurongwa.

(4) Hutungamiriri hweindasitiri
- Rutsigiro rweWafer: inogona kugadzirisa ≥100μm silicon yakatetepa zvikuru ine mativi matete, mwero wekupatsanuka <0.5%.

- Kugadzirisa kushandiswa kwesimba: Kushandiswa kwesimba pachikamu chimwe nechimwe chesimbi yesilicon kunoderedzwa ne30% (zvichienzaniswa nemidziyo yechinyakare).

Magadzirirwo ehunyanzvi:

Zita reparamita	Kukosha kweindekisi
Huwandu hwemabhawa akagadziriswa	Zvidimbu zviviri/seti
Kureba kwebhawa rekugadzirisa	100~950mm
Nzvimbo yemuchina wekugadzira	166~233mm
Kukurumidza kutema	≥40mm/miniti
Kumhanya kwewaya yedhaimani	0~35m/s
Dhayamita yedhaimani	0.30 mm kana pasi
Kushandiswa kwemutsetse	0.06 m/mm kana pasi
Inoenderana nedhayamita yetsvimbo yakatenderera	Yakapedzwa dhayamita yetsvimbo yemativi mana +2mm, Ita shuwa kuti kupenya kwepasi kwacho kwakwira
Kudzora kuputsika kwemucheto wepamusoro	Mupendero usina kubikwa ≤0.5mm, Hapana chipping, mhando yepamusoro yepamusoro
Kufanana kwehurefu hwearc	Range yekufungidzira <1.5mm, Kunze kwekukanganiswa kwetsvimbo yesilicon
Zviyero zvemuchina (muchina mumwe chete)	4800×3020×3660mm
Simba rose rakatarwa	56kW
Kurema kwemidziyo	12t

Tafura yekunyora zvakarurama kweindekisi yemashini:

Chinhu chakanyatsojeka	Kushivirira kwemarudzi
Kushivirira muganhu webhawa resikweya	± 0.15mm
Mupendero wepakati pebhawa resikweya	≤0.20mm
Angle kumativi ese etsvimbo yakaenzana	90°±0.05°
Kufara kwetsvimbo yemativi mana	≤0.15mm
Kurongeka kwerobhoti kunodzokororwa	± 0.05mm

Mabasa eXKH:

XKH inopa masevhisi ekushanda kwemuchina we mono-crystalline silicon dual-station, kusanganisira kugadzirisa michina (inoenderana nesimbi hombe dzesilicon), kuita kuti michina ishande zvakanaka (cutting parameter optimization), kudzidziswa kwekushanda uye rutsigiro rwekutengesa mushure mekutengesa (kuwanikwa kwezvikamu zvakakosha, kuongororwa kuri kure), kuve nechokwadi chekuti vatengi vanowana goho rakakura (>99%) uye mutengo wakaderera wekushandisa, uye kupa kuvandudzwa kwetekinoroji (senge AI cutting optimization). Nguva yekutumira imwedzi miviri kusvika mina.