Ko TTV, BOW, WARP, uye TIR Zvinorevei muWafers?

Paunenge uchiongorora semiconductor silicon wafers kana substrates yakagadzirwa nezvimwe zvinhu, isu tinowanzo kusangana nehunyanzvi zviratidzo se: TTV, BOW, WARP, uye pamwe TIR, STIR, LTV, pakati pevamwe. Ndeapi maparamendi aya anomiririra?

TTV - Total Thickness Variation
HUTA - Kukotama
WARP - Warp
TIR - Kuverenga Kwese kwakaratidzwa
STIR - Saiti Yese Yakaratidzwa Kuverenga
LTV - Nharaunda yehukobvu Kusiyanisa

1. Total Thickness Variation - TTV

Musiyano uripo pakati pehupamhi uye hudiki hukobvu hwewafer hunoenderana nendege yereferensi kana wafer yakasungirirwa uye padhuze. Inowanzo kuratidzwa mu micrometers (μm), inowanzomiririrwa se: ≤15 μm.

2. Kukotama - KURAMBA

Kutsauka pakati pechinhambwe uye chinhambwe chikuru kubva pakati penzvimbo yewaferi kuenda kundege yereferensi kana wafer iri mumahara (isina kuvharwa). Izvi zvinosanganisira zvose concave (negative bow) uye convex (positive bow) makesi. Inowanzo kuratidzwa mu micrometers (μm), inowanzomiririrwa se: ≤40 μm.

3. Warp - WARP

Kutsauka pakati pehudiki uye kureba kure kubva pawafer pamusoro kusvika kune inotaridza ndege (kazhinji iyo yekuseri kwepamusoro pechifukidziro) kana wafer iri mumahara (isina kuvharwa). Izvi zvinosanganisira zvose concave (negative warp) uye convex (positive warp) nyaya. Inowanzo kuratidzwa mu micrometers (μm), inowanzomiririrwa se: ≤30 μm.

4. Kuverenga Kwakakwana Kwese - TIR

Kana iyo wafer yakasungirirwa uye iri pedyo nepedyo, uchishandisa ndege inotaridza iyo inoderedza huwandu hwemapoinzi ese ari mukati memhando yenzvimbo kana dunhu rakatsanangurwa renzvimbo pane wafer pamusoro, iyo TIR ndiko kutsauka pakati pehupamhi uye hudiki madaro kubva pawafer pamusoro kusvika kune ino referensi ndege.

Yakavakirwa pahunyanzvi hwakadzama mune semiconductor zvinhu zvakatemwa seTTV, BOW, WARP, uye TIR, XKH inopa chaiyo tsika wafer kugadzirisa masevhisi akagadzirirwa kuomesera indasitiri zviyero. Isu tinopa uye tinotsigira zvakasiyana-siyana zvemhando yepamusoro-soro zvinosanganisira sapphire, silicon carbide (SiC), silicon wafers, SOI, uye quartz, kuve nechokwadi kupfava kunoshamisa, kusimba kusimba, uye kunaka kwepamusoro kwekushandisa kwepamusoro muoptoelectronics, zvishandiso zvemagetsi, uye MEMS. Vimba nesu kuti tiunze mhinduro dzezvinhu zvakavimbika uye machining chaiwo anosangana nezvako zvakanyanya kudiwa dhizaini zvinodiwa.