TSMC Inovhara 12-Inch Silicon Carbide yeNew Frontier, Kushandiswa Kwakarongwa muAI Era's Critical Thermal Management Materials​

Zviri Mukati​​

1. Kuchinja Kwetekinoroji: Kukwira kweSilicon Carbide Nematambudziko Ayo​

2. Kuchinja Kwesimba reTSMC: Kubuda muGaN uye Kubheja paSiC

3. Makwikwi eZvinhu: Kusatsiviwa kweSiC​

4. Maitiro Ekushandisa: Kuchinja Kwekutonga Kwekupisa muAI Chips neNext-Gen Electronics

5. Matambudziko Eramangwana: Zvipingamupinyi Zvehunyanzvi uye Makwikwi Eindasitiri​

Sekureva kweTechNews, indasitiri yepasi rose yesemiconductor yapinda munguva inotungamirwa nehunyanzvi hwekugadzira (AI) uye high-performance computing (HPC), uko manejimendi yekupisa yakabuda sechipingamupinyi chikuru chinokanganisa dhizaini yechip uye kufambira mberi kwemaitiro. Sezvo magadzirirwo epamusoro ekurongedza akadai se3D stacking uye 2.5D integration achiramba achiwedzera huwandu hwechip uye kushandiswa kwesimba, zvigadziko zveceramic zvechinyakare hazvichakwanisi kusangana nezvinodiwa zvekupisa. TSMC, kambani inotungamira pasi rose yekugadzira wafer, iri kupindura dambudziko iri nekuchinja kukuru kwezvinhu: ichigamuchira zvizere 12-inch single-crystal silicon carbide (SiC) substrates uku ichibuda zvishoma nezvishoma mubhizinesi regallium nitride (GaN). Kufamba uku hakungorevi chete kugadziriswazve kwehurongwa hwezvinhu zveTSMC asiwo kunoratidza kuti manejimendi yekupisa yakachinja sei kubva ku "tekinoroji inotsigira" kuenda ku "purofiti huru yemakwikwi."

Silicon Carbide: Kupfuura Simba reMagetsi

Silicon carbide, inozivikanwa nehukuru hwayo hwakakura hwe bandgap semiconductor, yagara ichishandiswa mumagetsi emagetsi anoshanda zvakanyanya akadai semagetsi emagetsi, maindasitiri ekutonga mota, uye zvivakwa zvesimba rinodzokororwa. Zvisinei, kugona kweSiC kunopfuura izvi. Nekupisa kwakanyanya kwemhepo kunosvika 500 W/mK—kupfuura zvakanyanya zvinhu zveceramic zvakaita sealuminium oxide (Al₂O₃) kana sapphire—SiC ikozvino yagadzirira kugadzirisa matambudziko ari kuwedzera ekupisa ekushandiswa kwemafuta akawanda.

AI Accelerators uye Dambudziko reThermal

Kuwanda kwemaAI accelerators, data center processors, uye AR smart glasses kwawedzera zvipingamupinyi zvenzvimbo uye matambudziko ekutarisira kupisa. Semuenzaniso, mumidziyo inopfekwa, microchip components dziri pedyo nemaziso dzinoda kudzora kupisa kwakaringana kuti ive nechokwadi chekuti yakachengeteka uye yakagadzikana. Ichishandisa hunyanzvi hwayo hwemakumi emakore mukugadzira wafer ye 12-inch, TSMC iri kusimudzira substrates dzeSiC dzenzvimbo hombe kuti dzitsive ceramics dzechinyakare. Iyi nzira inobvumira kubatanidzwa mumitsara yekugadzira iripo, ichienzanisa goho uye zvakanakira mutengo pasina kuda kugadziriswa kwakazara kwekugadzira.

Matambudziko eUnyanzvi uye Zvitsva.

.Basa raSiC muKurongedza Kwakafambira Mberi

• Kubatanidzwa kwe2.5D​​:Machipisi anoiswa pasilicon kana organic interposer ane nzira pfupi uye dzinoshanda dzemasaini. Matambudziko ekupisa pano anonyanya kurara.
• Kubatanidzwa kwe3D:Machipisi akaunganidzwa akamira ne through-silicon vias (TSVs) kana hybrid bonding inoita kuti pave ne ultra-high interconnect density asi inotarisana ne exponential thermal pressure. SiC haingoshandi se passive thermal material chete asiwo inoshanda pamwe chete ne advanced solutions dzakadai se diamond kana liquid metal kuti igadzire "hybrid cooling systems".

.Kubuda muGaN

Kupfuura Zvemotokari: Miganhu Mitsva yeSiC

• SiC yerudzi rweN inofambisa mhepo:Inoshanda sezvinhu zvinoparadzira kupisa muzvishandiso zveAI uye ma processor anoshanda zvakanyanya.
• SiC inodzivira:Inoshanda se interposer mumagadzirirwo echiplet, ichienzanisa kupatsanurwa kwemagetsi nekupisa.

Izvi zvitsva zvinoisa SiC senzira huru yekutarisira kupisa muAI nemachipisi edata.

​​​​​Nzvimbo Yezvinhu