Chinja Zvinhu Zvinopisa! Kudiwa kweSilicon Carbide Substrate Kwakagadzirira Kuputika!​

Zviri Mukati

1. Kupisa Kunoparadza Zvimedu muAI Chips uye Kubudirira kweSilicon Carbide Materials​

2. Hunhu uye Mabhenefiti ehunyanzvi eSilicon Carbide Substrates​

3. Zvirongwa zveStrategic uye Kubudirira Kwekushandira pamwe neNVIDIA neTSMC​

4. Nzira yeKuita Basa uye Matambudziko Makuru eUnyanzvi​

5.​​Tarisiro yeMusika uye Kuwedzera Kwesimba​​

6. Kukanganisa paKutengesa uye Mashandiro eMakambani Akabatana

7.​​Mashandisirwo Akakura uye Saizi Yese Yemusika weSilicon Carbide​​

8. Mhinduro Dzakagadzirirwa XKH uye Rutsigiro rweChigadzirwa​

Dambudziko rekuparadza kupisa kwemachipisi eAI emangwana riri kukundwa nezvinhu zvesilicon carbide (SiC) substrate.

Sekureva kwemishumo yenhau dzekunze, NVIDIA inoronga kutsiva zvinhu zvepakati pe substrate muCoWoS advanced packaging process yema processors ayo echizvarwa chinotevera nesilicon carbide. TSMC yakakoka vagadziri vakuru kuti vagadzire pamwe chete matekinoroji ekugadzira eSiC intermediate substrates.

Chikonzero chikuru ndechekuti kuvandudzwa kwebasa remachipisi eAI aripo kwasangana nezvinetso zvemuviri. Sezvo simba reGPU richikwira, kubatanidza machipisi akawanda muma "silicon interposer" kunounza kudiwa kukuru kwekupisa. Kupisa kunogadzirwa mumachipisi kuri kusvika pamuganhu wakwo, uye ma "silicon interposer" echinyakare haagone kugadzirisa dambudziko iri zvinobudirira.

NVIDIA Processors Shandurai Zvinhu Zvinopisa! Kudiwa kweSilicon Carbide Substrate Kwakagadzirira Kuputika! Silicon carbide imhando yemhando dzakasiyana dze bandgap, uye hunhu hwayo hwakasiyana hunoipa mabhenefiti akakosha munzvimbo dzakanyanya dzine simba rakawanda uye kupisa kwakanyanya. MuGPU advanced packaging, ine mabhenefiti maviri makuru:

1. Kugona Kupisa: Kutsiva ma "silicon interposers" ne "SiC interposers" kunogona kuderedza kuramba kupisa neanenge 70%.

2. Kugadzira Simba Zvinoshanda: SiC inogonesa kugadzirwa kwemamodule ekugadzirisa magetsi madiki anoshanda zviri nani, ichipfupisa nzira dzekupa simba, ichideredza kurasikirwa kweseketi, uye ichipa mhinduro dzinoshanda nekukurumidza uye dzakagadzikana dzemitoro yeAI computing.

Shanduko iyi ine chinangwa chekugadzirisa matambudziko ekupisa anokonzerwa nekuwedzera simba reGPU nguva dzose, zvichipa mhinduro inoshanda zvakanyanya kumachipisi emakombiyuta anoshanda zvakanyanya.

Kufambiswa kwemafuta esilicon carbide kwakakwira ka2-3 kupfuura kwesilicon, zvichinyatso vandudza mashandiro ekushandisa mafuta uye kugadzirisa matambudziko ekupisa mumachipisi ane simba guru. Kushanda kwayo kwakanaka kwemafuta kunogona kuderedza tembiricha yeGPU chips panosangana magetsi ne20-30°C, zvichiwedzera kugadzikana muzviitiko zvemakomputa ane simba guru.

Nzira yeKuita Basa uye Matambudziko

Zvichienderana nezvinyorwa zvekutengesa, NVIDIA ichaita shanduko iyi yezvinhu mumatanho maviri:

•​​2025-2026​​: Rubin GPU yechizvarwa chekutanga icharamba ichishandisa silicon interposer. TSMC yakakoka vagadziri vakuru kuti vagadzire pamwe chete tekinoroji yekugadzira SiC interposer.

•​​2027​​: Zvishandiso zveSiC zvichabatanidzwa zviri pamutemo muhurongwa hwepamusoro hwekurongedza.

Zvisinei, chirongwa ichi chinosangana nematambudziko akawanda, kunyanya mumabasa ekugadzira. Kuomarara kwesilicon carbide kwakafanana nekwedhaimani, kunoda tekinoroji yekucheka yakanyanya. Kana tekinoroji yekucheka isina kukwana, pamusoro peSiC panogona kudonha, zvichiita kuti isakwanise kushandiswa pakurongedza kwepamusoro. Vagadziri vemidziyo vakaita seDISCO yekuJapan vari kushanda kugadzira michina mitsva yekucheka nelaser kugadzirisa dambudziko iri.

Tarisiro Yeramangwana

Parizvino, tekinoroji yeSiC interposer ichatanga kushandiswa mumachipisi eAI epamusoro-soro. TSMC inoronga kutanga CoWoS ine reticle 7x muna 2027 kuti isanganise ma processor akawanda ne memory, zvichiwedzera nzvimbo yeinterposer kusvika 14,400 mm², izvo zvichaita kuti kudiwa kwema substrates kuve kwakanyanya.

Morgan Stanley anofanotaura kuti huwandu hweCoWoS hwepamwedzi huchakwira kubva pa38,000 wafers dze12-inch muna 2024 kusvika pa83,000 muna 2025 uye 112,000 muna 2026. Kukura uku kuchawedzera zvakananga kudiwa kweSiC interposer.

Kunyange hazvo ma substrates eSiC ane 12-inch ari kudhura parizvino, mitengo inotarisirwa kudzikira zvishoma nezvishoma kusvika padanho rakanaka sezvo kugadzirwa kwakawanda kuchikwira uye tekinoroji ichikura, zvichigadzira mamiriro ekushandiswa kukuru.

Zvishandiso zveSiC hazvingogadzirisi matambudziko ekupisa chete asiwo zvinovandudza huwandu hwekubatanidza. Nzvimbo yezvikamu zveSiC zvemainji gumi nemaviri yakakura ne90% kupfuura yezvikamu zvemainji masere, zvichibvumira munhu mumwe chete kuti abatanidze mamwe maChiplet modules, zvichitsigira zvakananga zvinodiwa zveNVIDIA zve7x reticle CoWoS pakurongedza.

TSMC iri kushanda pamwe chete nemakambani ekuJapan akaita seDISCO kugadzira tekinoroji yekugadzira SiC interposer. Kana michina mitsva yavapo, kugadzirwa kweSiC interposer kuchaenderera mberi zviri nyore, uye kutanga kwekurongedza kwepamusoro kunotarisirwa muna 2027.

Zvichitevera nhau idzi, masheya ane chekuita neSiC akabudirira zvikuru musi wa5 Gunyana, nenhamba yemasheya ichikwira ne5.76%. Makambani akaita seTianyue Advanced, Luxshare Precision, naTiantong Co. akasvika padanho repamusoro rezuva nezuva, ukuwo Jingsheng Mechanical & Electrical neYintang Intelligent Control akakwira nepamusoro pe10%.

Sekureva kweDaily Economic News, kuti iwedzere kushanda zvakanaka, NVIDIA inoronga kutsiva zvinhu zvepakati pe substrate muCoWoS advanced packaging process nesilicon carbide muchirongwa chayo chinotevera chekugadzira Rubin processor.

Ruzivo rweveruzhinji runoratidza kuti silicon carbide ine hunhu hwakanaka kwazvo. Zvichienzaniswa nemidziyo yesilicon, michina yeSiC ine zvakanakira zvakaita sekuwanda kwesimba, kurasikirwa nesimba kwakaderera, uye kugadzikana kwakanyanya pakupisa kwakanyanya. Sekureva kweTianfeng Securities, cheni yeindasitiri yeSiC inosanganisira kugadzirira ma substrates eSiC uye epitaxial wafers; chikamu chepakati chinosanganisira dhizaini, kugadzira, uye kurongedza/kuyedza michina yeSiC nemidziyo yeRF.

Pasi pemvura, mashandisirwo eSiC akawanda, achifukidza maindasitiri anopfuura gumi, anosanganisira mota itsva dzemagetsi, ma photovoltaics, maindasitiri ekugadzira, kutakura, nzvimbo dzekutaurirana, uye radar. Pakati peizvi, mota dzichava nzvimbo huru yekushandisa yeSiC. Sekureva kweAijian Securities, panosvika gore ra2028, chikamu chemotokari chichava ne74% yemusika wepasi rose wemagetsi eSiC.

Panyaya yehukuru hwemusika wese, maererano neYole Intelligence, hukuru hwemusika wepasi rose weSiC substrate unoshanda uye unodzivirira kupisa hwaive mamiriyoni mazana mashanu negumi nemaviri nemakumi mana nemaviri, zvichiteerana, muna 2022. Zvinofungidzirwa kuti panosvika gore ra2026, hukuru hwemusika weSiC pasi rose huchasvika mabhiriyoni maviri nemakumi mashanu nematatu nematatu, nehukuru hwemusika weSiC substrate unoshanda uye unodzivirira kupisa hunosvika mabhiriyoni zana nemakumi matanhatu nemaviri emadhora ($1.62 bhiriyoni) uye mamiriyoni mazana mana nemakumi matatu nematatu emadhora ($433 bhiriyoni). Kukura kwegore negore kweCompound annual growth rates (CAGRs) yeSiC substrates inofambisa kupisa kupisa kubva muna 2022 kusvika 2026 inotarisirwa kuva 33.37% uye 15.66%, zvichiteerana.

XKH Inonyanya Kugadzira Zvakagadziriswa uye Kutengeswa Kwepasirose kweSilicon Carbide (SiC) Products, ichipa saizi yakazara ye2 kusvika 12 inches kune ese ari maviri e conductive uye semi-insulating silicon carbide substrates. Isu tinotsigira kugadzirisa kwakasarudzika kwema parameter akadai se crystal orientation, resistivity (10⁻³–10¹⁰ Ω·cm), uye ukobvu (350–2000μm). Zvigadzirwa zvedu zvinoshandiswa zvakanyanya munzvimbo dzemhando yepamusoro dzinosanganisira mota itsva dzemagetsi, ma photovoltaic inverters, uye ma industrial motors. Tichishandisa sisitimu yakasimba yekugovera uye timu yekutsigira tekinoroji, tinovimbisa kupindura nekukurumidza uye kuendesa kwakarurama, tichibatsira vatengi kusimudzira mashandiro emudziyo uye kugadzirisa mitengo yesisitimu.