Kubva kuma1980, huwandu hwemagetsi anobatanidzwa hwave huchiwedzera ne1.5× kana kupfuura pagore. Kubatanidzwa kwakakwirira kunotungamira mukuwanda kwemagetsi uye kugadzirwa kwekupisa panguva yekushanda.Kana ikasanyangarika zvakanaka, kupisa uku kunogona kukonzera kutadza kushanda zvakanaka kwekupisa uye kuderedza hupenyu hwezvinhu zvemagetsi.
Kuti zvikwanisike kuwedzera kwezvinodiwa pakutarisira kupisa, zvinhu zvemagetsi zvemhando yepamusoro zvine mafambiro ekupisa zviri kutsvakurudzwa zvakanyanya uye kugadziriswa.
Zvinhu zvakagadzirwa nedhaimani/mhangura
01 Dhaimani neMhangura
Zvinhu zvekurongedza zvechinyakare zvinosanganisira ceramics, mapurasitiki, simbi, uye alloys dzadzo. Zvigadzirwa zveCeramics zvakaita seBeO neAlN zvinoratidza CTEs dzinoenderana nema semiconductors, kugadzikana kwakanaka kwemakemikari, uye thermal conductivity iri pakati nepakati. Zvisinei, kugadzirwa kwazvo kwakaoma, mutengo wakakwira (kunyanya chepfu BeO), uye brittleness zvinoderedza mashandisirwo azvo. Kurongedza kwepurasitiki kunopa mutengo wakaderera, huremu hwakareruka, uye insulation asi kune dambudziko rekusafambisa zvakanaka kwethermal uye kusagadzikana kwekupisa kwakanyanya. Simbi dzakachena (Cu, Ag, Al) dzine thermal conductivity yakakwira asi CTE yakawandisa, nepo alloys (Cu-W, Cu-Mo) dzichikanganisa kushanda kwethermal. Saka, zvinhu zvitsva zvekurongedza zvinoenzanisa thermal conductivity yakakwira uye CTE yakanakisa zvinodiwa nekukurumidza.
| Kusimbiswa | Kufambisa kwekupisa (W/(m·K)) | CTE (×10⁻⁶/℃) | Kuwanda (g/cm³) |
| Dhaimani | 700–2000 | 0.9–1.7 | 3.52 |
| Zvidimbu zveBeO | 300 | 4.1 | 3.01 |
| Zvidimbu zveAlN | 150–250 | 2.69 | 3.26 |
| Zvidimbu zveSiC | 80–200 | 4.0 | 3.21 |
| Zvidimbu zveB₄C | 29–67 | 4.4 | 2.52 |
| Faibha yeBoron | 40 | ~5.0 | 2.6 |
| Zvidimbu zveTiC | 40 | 7.4 | 4.92 |
| Al₂O₃ zvidimbu | 20–40 | 4.4 | 3.98 |
| Ndebvu dzeSiC | 32 | 3.4 | – |
| Zvidimbu zveSi₃N₄ | 28 | 1.44 | 3.18 |
| TiB₂ zvidimbu | 25 | 4.6 | 4.5 |
| Zvidimbu zveSiO₂ | 1.4 | <1.0 | 2.65 |
Dhaimani, chinhu chepanyama chakaoma kwazvo kuzivikanwa (Mohs 10), chinewo hunhu hwakanakakufambiswa kwemhepo inopisa (200–2200 W/(m·K)).
Upfu hwedhaimani hudiki
Mhangura, ne kupisa kwakanyanya/kupinza magetsi (401 W/(m·K)), ductility, uye kushanda zvakanaka kwemari, zvinoshandiswa zvakanyanya muICs.
Kubatanidza zvinhu izvi,diamond/mhangura (Dia/Cu) zvinoumba—neCu sematrix uye dhaimani sekusimbisa—zviri kubuda sezvinhu zvekutarisira kupisa zvechizvarwa chinotevera.
02 Nzira dzekugadzira dzinokosha
Nzira dzakajairika dzekugadzira dhaimani/mhangura dzinosanganisira: simbi yeupfu, nzira yekupisa kwakanyanya uye yekumanikidza kwakanyanya, nzira yekunyungudutsa mumvura, nzira yekuburitsa plasma sintering, nzira yekupfapfaidza nechando, nezvimwewo.
Kuenzanisa nzira dzakasiyana dzekugadzirira, maitiro uye hunhu hwezvinhu zvakagadzirwa nedhaimani/mhangura zvine saizi imwe chete
| Paramita | Upfu hwesimbi | Kudzvanya Kunopisa kweVacuum | Kupisa kwePlasma (SPS) | Kupisa kwakanyanya (HPHT) | Kuisa Spray Inotonhora | Kunyunguduka Kwemvura |
| Rudzi rwedhaimani | MBD8 | HFD-D | MBD8 | MBD4 | PDA | MBD8/HHD |
| Matrix | 99.8% Cu upfu | 99.9% electrolytic Cu upfu | 99.9% Cu upfu | Upfu hweAlloy/Cu hwakachena | Upfu hweCu hwakachena | Pure Cu bulk/tsvimbo |
| Kugadziriswa kweInterface | – | – | – | B, Ti, Si, Cr, Zr, W, Mo | – | – |
| Saizi yeChidimbu (μm) | 100 | 106–125 | 100–400 | 20–200 | 35–200 | 50–400 |
| Chikamu Chevhoriyamu (%) | 20–60 | 40–60 | 35–60 | 60–90 | 20–40 | 60–65 |
| Tembiricha (°C) | 900 | 800–1050 | 880–950 | 1100–1300 | 350 | 1100–1300 |
| Kumanikidzwa (MPa) | 110 | 70 | 40–50 | 8000 | 3 | 1–4 |
| Nguva (miniti) | 60 | 60–180 | 20 | 6–10 | – | 5–30 |
| Kuwanda kwehuwandu (%) | 98.5 | 99.2–99.7 | – | – | – | 99.4–99.7 |
| Kushanda | ||||||
| Kufambisa Kwekupisa Kwakakodzera (W/(m·K)) | 305 | 536 | 687 | 907 | – | 943 |
Common Dia/Cu composite matekiniki anosanganisira:
(1)Upfu hwesimbi
Upfu hwedhaimani/Cu hwakasanganiswa hunogochwa uye hunopiswa. Kunyange zvazvo huchidhura uye huri nyore, nzira iyi inopa huwandu hushoma, magadzirirwo madiki asina kufanana, uye saizi yemuenzaniso yakaganhurirwa.
Schikamu chekubatanidza
(1)Kupisa kwakanyanya (HPHT)
Ichishandisa michina yekudhinda ine maanvil akawanda, Cu yakanyungudutswa inopinda mumadhaimani emuchina mumamiriro ezvinhu akaoma, ichigadzira zvinhu zvakakora. Zvisinei, HPHT inoda mapundu anodhura uye haina kukodzera kugadzirwa pamhando huru.
Ckudzvanya kweubic
(1)Kunyunguduka Kwemvura
Molten Cu inonyunguduka inopinda mumadhaimani preforms kuburikidza nekudzvanywa kana kupindira kunofambiswa ne capillary. Macomposites anobuda anosvitsa >446 W/(m·K) thermal conductivity.
(2)Kupisa kwePlasma (SPS)
Mhepo inopusha inokurumidza kusvina hupfu hwakasanganiswa kana yamanikidzwa. Kunyangwe ichishanda zvakanaka, kushanda kweSPS kunoderera pazvikamu zvedhaimani >65 vol%.
Dhirowamu yechirongwa chekubvisa plasma sintering system
(5) Kuisa Pureyi Inotonhora
Upfu hunokurumidza uye hunoiswa pamusoro pezvinhu zvinogadzirwa. Nzira iyi itsva inosangana nematambudziko mukutonga kupedzwa kwechinhu pamusoro uye kusimbiswa kwekushanda kwekupisa.
03 Kugadziriswa kweInterface
Pakugadzirira zvinhu zvakasanganiswa, kunyorovesa pakati pezvikamu chinhu chakakosha pakuita kwekubatanidzwa uye chinhu chakakosha chinokanganisa chimiro chekubatanidza uye mamiriro ekubatanidza pakati pedhaimani neCu. Mamiriro ekusanyorovesa pakati pedhaimani neCu anotungamira kune kuramba kwakanyanya kwekupisa kweinterface. Saka, zvakakosha zvikuru kuita tsvakiridzo yekuchinja pane interface pakati pezviviri kuburikidza nenzira dzakasiyana dzehunyanzvi. Parizvino, kune nzira mbiri dzekuvandudza dambudziko reinterface pakati pedhaimani neCu matrix: (1) Kugadziriswa kwedhaimani pamusoro; (2) Kugadziriswa kwe copper matrix.
Dhayagiramu yekuchinja: (a) Kuisa dhayamita zvakananga pamusoro pedhaimani; (b) Kubatanidza matrix
(1) Kugadziriswa kwedhaimani pamusoro
Kuisa zvinhu zvinoshanda zvakaita seMo, Ti, W uye Cr pamusoro pechikamu chekusimbisa kunogona kuvandudza hunhu hwedhaimani, nokudaro zvichiwedzera kufambisa kwayo kupisa. Kuisa simbi kunogona kuita kuti zvinhu zviri pamusoro apa zvigone kuita nekabhoni pamusoro peupfu hwedhaimani kuti zvigadzire chikamu chekuchinja kwekabhoni. Izvi zvinoita kuti mamiriro ekunyorova ari pakati pedhaimani nechigadziko chesimbi awedzere, uye chifukidziro chinogona kudzivirira chimiro chedhaimani kuti chisachinje pakupisa kwakanyanya.
(2) Kuumbwa kwemhangura yemhangura
Pamberi pekugadziriswa kwezvinhu zvakasanganiswa, mushonga wekugadzira mhangura yesimbi unoitwa, iyo inogona kugadzira zvinhu zvakasanganiswa zvine thermal conductivity yakakwira. Kuisa zvinhu zvinoshanda mu copper matrix hakungogone kuderedza Angle inonyorovesa pakati pedhaimani nemhangura chete, asiwo kugadzira carbide layer inonyungudika zvakasimba mu copper matrix pa diamond / Cu interface mushure mekuita. Nenzira iyi, mipata yakawanda iripo pa material interface inogadziriswa uye inozadzwa, nokudaro ichivandudza thermal conductivity.
04 Mhedziso
Zvinhu zvekurongedza zvakajairika hazvishande zvakanaka pakugadzirisa kupisa kubva kumachipisi epamusoro. Macomposites eDia/Cu, ane CTE inogadziriswa uye ultrahigh thermal conductivity, anomiririra mhinduro inoshandura zvinhu zvemagetsi zvechizvarwa chinotevera.
Sekambani ine tekinoroji yepamusoro inobatanidza maindasitiri nekutengeserana, XKH inotarisa pakutsvaga nekugadzira uye kugadzira zvinhu zvakaita sedhaimani/mhangura uye zvinhu zvine simba repamusoro zvakaita seSiC/Al neGr/Cu, zvichipa mhinduro itsva dzekutarisira kupisa dzine simba rekupisa rinodarika 900W/(m·K) kuminda yekurongedza kwemagetsi, mamodule emagetsi uye ndege.
XKH'Zvinhu zvakagadzirwa nelaminate zvakagadzirwa nemhangura yedhaimani:
Nguva yekutumira: Chivabvu-12-2025