Maonero Akazara eTita Firimu Deposition Techniques: MOCVD, Magnetron Sputtering, uye PECVD

Mukugadzira semiconductor, nepo photolithography uye etching ari iwo anonyanya kutaurwa maitiro, epitaxial kana nhete yekuisa firimu maitiro akakosha zvakaenzana. Ichi chinyorwa chinozivisa akati wandei akaonda akaonda firimu deposition nzira dzinoshandiswa mukugadzira chip, kusanganisiraMOCVD, magnetron sputtering,uyePECVD.

Sei Matete Mafirimu Maitiro Akakosha muChip Manufacturing?

Kuenzanisira, fungidzira chingwa chisina kubikwa chisina kubikwa. Payo pachayo, inogona kuravira zvisina kunaka. Zvisinei, nekukwesha pamusoro nesoso dzakasiyana-sepaste inonaka yebhinzi kana manyuchi inotapira malt - unogona kunyatsoshandura kunaka kwayo. Aya machira ekuwedzera kunaka akafananamafirimu matetemune semiconductor maitiro, nepo flatbread pachayo inomiririra iyosubstrate.

Mukugadzira chip, mafirimu matete anoshanda akawanda anoshanda mabasa - insulation, conductivity, passivation, kunyudza chiedza, nezvimwewo - uye basa rega rega rinoda chaiyo deposition nzira.

1. Metal-Organic Chemical Vapor Deposition (MOCVD)

MOCVD inyanzvi yepamusoro uye yakanyatso shandiswa pakuisa emhando yepamusoro semiconductor matete mafirimu uye nanostructures. Inobata basa rakakosha mukugadzirwa kwemidziyo yakaita se LED, lasers, uye magetsi emagetsi.

Zvikamu zvakakosha zveMOCVD System:

• Gasi Delivery System
  Basa rekunyatso kusuma reactants mukamuri yekupindura. Izvi zvinosanganisira kuyerera kwe:

• Carrier magasi

• Metal-organic precursors

• Hydride magasi
  Iyo sisitimu inoratidzira akawanda-nzira mavharuvhu ekuchinja pakati pekukura uye kuchenesa modhi.

• Reaction Chamber
  Mwoyo wegadziriro umo kukura kwezvinhu chaiko kunoitika. Zvikamu zvinosanganisira:

  • Graphite susceptor (substrate holder)

  • Heater uye tembiricha sensors

  • Optical ports ye in-situ yekutarisa

  • Maoko eRobhoti e automated wafer kurodha / kurodha

• Kukura Kudzora System
  Inosanganisira programmable logic controller uye komputa inotambira. Izvi zvinovimbisa kunyatsotarisisa uye kudzokororwa mukati meiyo deposition process.

• In-situ Monitoring
  Zvishandiso zvakadai semapyrometers uye reflectometers chiyero:

  • Firimu ukobvu

  • Kupisa kwepamusoro

  • Substrate curvature
    Izvi zvinogonesa mhinduro chaiyo-nguva uye kugadzirisa.

• Exhaust Treatment System
  Inobata chepfu byproducts uchishandisa kupisa kwemafuta kana kemikari catalysis kuve nechokwadi chekuchengetedza uye kutevedza kwezvakatipoteredza.

Yakavharwa-Yakabatana Showerhead (CCS) Configuration:

Mune vertical MOCVD reactors, dhizaini yeCCS inobvumira magasi kuti abaiwe zvakafanana kuburikidza neanotsinhanisa nozzles mushowerhead chimiro. Izvi zvinoderedza kuita nguva isati yakwana uye zvinowedzera kusanganiswa kweyunifomu.

• Theinotenderera graphite susceptorinowedzera kubatsira homogenize muganho wegasi, kuvandudza kufanana kwemafirimu pane imwe wafer.

2. Magnetron Sputtering

Magnetron sputtering inzira yemuviri vapor deposition (PVD) inoshandiswa zvakanyanya kuisa mafirimu matete uye machira, kunyanya mumagetsi, optics, uye ceramics.

Working Principle:

1. Target Material
   Iyo sosi yezvinhu ichaiswa-simbi, oxide, nitride, nezvimwe-yakagadziriswa pane cathode.

2. Vacuum Chamber
   Iyo nzira inoitwa pasi pepamusoro vacuum kudzivirira kusvibiswa.

3. Plasma Generation
   Gasi inert, kazhinji argon, inonatswa kuti iite plasma.

4. Magnetic Field Application
   Nzvimbo yemagineti inovharira maerekitironi padhuze nekwakanangana nekunatsiridza kugona kweionization.

5. Sputtering Process
   MaIoni anobhomba chinangwa, achibvisa maatomu anofamba nemukamuri uye anoisa pane substrate.

Zvakanakira zveMagnetron Sputtering:

• Uniform Film Depositionmunzvimbo huru.

• Kugona Kuisa Deposit Complex Compounds, kusanganisira alloys uye ceramics.

• Tunable Process Parameterskuitira kunyatso kudzora ukobvu, kuumbwa, uye microstructure.

• High Film Qualitynekunamatira kwakasimba uye simba remagetsi.

• Broad Material Kuenderana, kubva kusimbi kusvika kuokisidhi uye nitrides.

• Low-Temperature Operation, yakakodzera kune tembiricha-sensitive substrates.

3. Plasma-Enhanced Chemical Vapor Deposition (PECVD)

PECVD inoshandiswa zvakanyanya pakuiswa kwemafirimu matete sesilicon nitride (SiNx), silicon dioxide (SiO₂), uye amorphous silicon.

Musimboti:

Mune PECVD system, precursor magasi anounzwa mukamuri yekutsvaira umo akupenya kuburitsa plasmainogadzirwa uchishandisa:

• RF excitation

• DC high voltage

• Microwave kana pulsed sources

Iyo plasma inomutsa gasi-chikamu maitiro, ichigadzira reactive mhando dzinoisa pane substrate kuita firimu rakatetepa.

Deposition Matanho:

1. Plasma Formation
   Kunakidzwa neminda yemagetsi, precursor gasi ionize kuumba reactive radicals uye ions.

2. Reaction uye Transport
   Mhuka idzi dzinosangana nemaitiro echipiri padzinofamba dzichienda kune substrate.

3. Surface Reaction
   Pakusvika kune substrate, vanoshambadza, vanoita, uye vanogadzira firimu rakasimba. Zvimwe zvigadzirwa zvinoburitswa semagasi.

PECVD Benefits:

• Yakanakisa Uniformitymukugadzirwa kwemafirimu uye ukobvu.

• Kunamatira Kwakasimbakunyangwe panguva yakaderera deposition tembiricha.

• High Deposition Rates, ichiita kuti ive yakakodzera kugadzirwa kwemaindasitiri.

4. Mutete Film Characterization Techniques

Kunzwisisa zvinhu zvemafirimu akaonda kwakakosha pakutonga kwemhando. Maitiro akajairika anosanganisira:

(1) X-ray Diffraction (XRD)

• Chinangwa: Ongorora zvimiro zvekristaro, mareti egarageti, uye maratidziro.

• Principle: Kubva paMutemo waBragg, inoyera kuti maX-ray anosiyana sei kuburikidza nekristaro zvinhu.

• Applications: Crystallography, chikamu chekuongorora, kuyera kuyerwa, uye yakaonda firimu kuongorora.

(2) Kuongorora Electron Microscopy (SEM)

• Chinangwa: Ongorora pamusoro morphology uye microstructure.

• Principle: Inoshandisa simbi yeerekitironi kuongorora nzvimbo yemuenzaniso. Masaini anoonekwa (semuenzaniso, echipiri uye maerekitironi akapararira kumashure) anoratidza ruzivo rwepamusoro.

• Applications: Zvishandiso sainzi, nanotech, biology, uye kutadza kuongorora.

(3) Atomic Force Microscopy (AFM)

• Chinangwa: Mufananidzo uri paatomu kana nanometer resolution.

• Principle: Tsvakurudzo inopinza inotarisa pamusoro apo ichichengetedza simba rekubatana nguva dzose; vertical displacements inogadzira 3D topography.

• Applications: Nanostructure research, pamusoro roughness kuyerwa, biomolecular zvidzidzo.